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Status of global wafer foundry industry, 2023
NEWS TAGGED SEAJ
Friday 13 January 2023
Japan-made chipmaking equipment sales may see 1st drop in 4 years
Sales of Japan-made semiconductor equipment are forecast to drop about 5% to JPY3.5 billion (US$27.1 billion) in fiscal 2023 - the first annual drop in four years, according to the...
Thursday 3 December 2020
Semiconductor equipment billings surge 30% in 3Q20, says SEMI
Global semiconductor equipment billings increased 30% on year and 16% sequentially to US$19.4 billion in the third quarter of 2020, according to SEMI.
Wednesday 9 September 2020
Global fab equipment spending to rise in 2020 and 2021, says SEMI
Soaring pandemic-inspired demand for chips that power everything from communications and IT infrastructures to personal computing, gaming and healthcare electronics will drive an...
Friday 5 July 2019
Japan-made chipmaking equipment sales to fall 11% in fiscal 2019, says SEAJ
Sales of Japan-made semiconductor equipment will decline 11% to about JPY2 trillion (US$18.5 billion) in fiscal 2019, which will end a six-year streak of increases, according to the...
Tuesday 4 June 2019
Semiconductor equipment billings decline in 1Q19, says SEMI
Billings among North American manufacturers of semiconductor production equipment registered both sequential and on-year decreases in the first quarter of 2019.
Tuesday 6 June 2017
Korea replaces Taiwan as largest semiconductor equipment market
Worldwide semiconductor manufacturing equipment billings reached a record US$13.1 billion in the first quarter of 2017, according to SEMI. The billings figure was 14% higher than...
Tuesday 22 November 2016
Japan chip gear orders rise 7% in October, says SEAJ
Japan-based semiconductor equipment manufacturers posted JPY139.3 billion (US$1.3 billion) in orders in October 2016 (three-month average basis), up 7.3% from JPY129.85 billion in...
Tuesday 10 September 2013
Global 2Q13 semiconductor equipment billings and bookings drop on year
Worldwide semiconductor manufacturing equipment billings and bookings showed on-year decreases of 27% and 5%, respectively, in the second quarter of 2013, according to data collected...
Thursday 23 May 2013
US fab-tool book-to-bill stays above parity, says SEMI
The book-to-bill ratio for the North America semiconductor equipment industry stayed above parity for the fourth consecutive month in April 2013, according to industry association...
Friday 22 March 2013
SEMI, SEAJ book-to-bill ratios almost flat in February 2013
Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.17 in February 2013, compared to 1.18 in January, according to the Semiconductor Equipment...
Thursday 24 January 2013
Japan chip gear ratio rises above parity in December 2012, says SEAJ
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.23 on a three-month average basis in December 2012, up from 0.89 the month before, according...
Thursday 20 December 2012
SEMI, SEAJ book-to-bill ratios rise
North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.79 in November 2012, up from 0.75 in October, ending seven straight months of sequential...
Monday 19 November 2012
Japan October 2012 chip gear book-to-bill ratio at 0.70, says SEAJ
Japan-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.70 in October 2012, up from 0.65 in September, according to data gathered by Semiconductor Equipment...
Friday 19 October 2012
SEMI, SEAJ book-to-bill ratios continue slide
Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 0.65 in September 2012, hitting the lowest level since May 2009, according to the Semiconductor...
Tuesday 20 March 2012
Japan February 2012 chip-gear orders down 5.7%, says SEAJ
Japan-based manufacturers of semiconductor equipment posted JPY99.8 billion (US$1.2 billion) in orders in February 2012 (three-month average basis), down 5.7% from a year earlier,...
Dec 8, 10:41
ASUS Handheld Ultrasound LU700 series: lightweight, high resolution and long battery life solution for mobile healthcare
Friday 8 December 2023
Clientron garners the prestigious 2024 Taiwan Excellence Award for innovative Smart eCockpit of Electric Vehicle
Wednesday 6 December 2023
AIRA features CPU-powered face recognition to address market challenges
Tuesday 5 December 2023
PowerArena uncovers human factors causing production line bottlenecks, boosting productivity and quality
TSMC likely to win it all, with Samsung's 3nm reportedly losing several significant orders
Approximately 1,400 ASML equipment installed in China, limited application for advanced chip expected
Huawei's 5nm chip in L540 NB could be inventory made by TSMC before US ban
Global semiconductor market to rebound with 13% growth in 2024, says WSTS
Samsung and SK Hynix will both supply HBM3 for AWS Trainium 2
Huawei's NearLink wireless technology signals a decoupled connected world
Intel cuts off manufacturing in IDM2.0, TSMC is expected to benefit
Tesla's humanoid robot 'Optimus' debuts in Taiwan, showcasing AI advancements
ASML reportedly sees first big EUV equipment order cut from TSMC
US, Japanese, and Dutch semiconductor equipment export values to China dropped; more substantial strategies demanded by expert
Global top-5 notebook brands experience over 20% on-month shipment drop in October, says DIGITIMES Research
Global notebook shipments rise in 3Q23 but to slip in 4Q23, says DIGITIMES Research
Research Insight: order backlog, China demand to drive Infineon automotive segment in FY24
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