The global automotive industry experienced moderate growth in 2025, driven by electrification and smart technologies. But rising geopolitical risks, cost pressures, and uneven regional...
A tightening supply of indium phosphide substrates is emerging as a bottleneck for artificial intelligence data centers and high-speed optical interconnects, prompting compound semiconductor...
The global semiconductor industry is on track to reach US$1 trillion in annual sales by 2026 as intense demand for artificial intelligence processors and advanced memory capacity...
According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that...
India's first wave of OSAT facilities is moving from capacity announcements to competitive positioning, with some domestic players now benchmarking themselves against established...
A magnitude-7.0 earthquake struck offshore Yilan late on December 27, 2025, rattling northern Taiwan. The quake prompted precautionary shutdowns across Hsinchu Science Park. Several...
Nvidia has reportedly asked memory suppliers to prepare for the delivery of 16-high high-bandwidth memory by the second half of 2026, according to industry sources cited by South...
Data centers are entering a new phase of infrastructure upgrades in 2026, feeding off generative AI under Nvidia's leadership. While silicon photonics (SiPh) and co-packaged optics...
In 2025, the global display industry will undergo a major shift as South Korea exits LCD production and strengthens its OLED patent lead. China gains dominance over LCD capacity and...
As demand for electric vehicles cools in the United States, Honda Motor of Japan and LG Energy Solution of South Korea are making a significant course correction in their North American...
With panel industry demand remaining weak, display driver IC testing and packaging specialist Chipbond is pursuing a second growth engine and has formally entered the silicon photonics...
Memory maker Winbond Electronics has recently continued to expand capital expenditures by increasing capacity for 16nm and DDR4 DRAM. As inventories of legacy DDR3 products decrease,...
Samsung Electronics and SK Hynix are pushing forward their production schedules for sixth-generation high-bandwidth memory to February 2026. Industry sources and South Korean media...
SK Hynix is scheduled to deliver final samples of its next-generation high-bandwidth memory to Nvidia in early January 2025. This comes as the South Korean chipmaker nears a February...
