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Monday 13 October 2025
Weekly news roundup: China pushes DUV breakthroughs, Intel and AMD weigh partnership, Arm CEO reflects on Nvidia's strategic pivot
Below are the top DIGITIMES Asia stories from October 6 to 12, 2025.
Saturday 11 October 2025
Intel's Arizona Fab 52 begins production in major advance for US-based chip manufacturing
Intel officially announced on October 9 (Taipei time) the beginning of mass production at Fab 52, its latest wafer plant. The new fab, located in Chandler, Arizona, marks a significant...
Thursday 9 October 2025
TSMC's 3Q25 revenue surpasses high forecast as AI drives advanced process demand
TSMC reported consolidated revenue of NT$330.98 billion (US$10.8 billion) in September 2025, a slight 1.4% decrease from August but a 31.4% increase year-over-year, marking a record...
Thursday 9 October 2025
Foxconn walks away from Nissan factory deal amid stalled talks
Struggling with prolonged financial headwinds, Nissan Motor Co. has announced plans to shutter one of its core production sites, the Oppama plant, by March 2028. Talks to sell the...
Thursday 9 October 2025
Semicon West relocation doubles attendance as US chip investment surges
The annual SEMICON West relocated for the first time to Phoenix in 2025, the new hub of US chip manufacturing. Compared to previous years, the event saw a 45% increase in exhibitors,...
Thursday 9 October 2025
Commentary: China's TGV ambitions face an uphill battle
China's development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles,...
Thursday 9 October 2025
Phoenix Silicon International expands wafer production capacity with new FAB3B facility
Phoenix Silicon International (PSI) has officially launched the expansion of its Zhonggang FAB3A/B manufacturing complex, announcing plans for the new FAB3B plant to begin production...
Thursday 9 October 2025
Glass substrate TGV: China's edge to capture AI HPC packaging
China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in...
Thursday 9 October 2025
Parallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VP
SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one...
Thursday 9 October 2025
GLT shutters China plant, eyes Vietnam trial and biomedical expansion
Global Lighting Technologies (GLT) has liquidated its Zhongshan factory in Guangdong, China and has plans to start trial production at its new facility in Vietnam facility in the...
Wednesday 8 October 2025
OpenAI reignites AMD ecosystem, boosting Taiwan supply chain prospects
OpenAI has recently intensified collaborations with chip suppliers, signing an AI GPU partnership with AMD following deals with Nvidia and Broadcom. This move revitalizes the previously...
Wednesday 8 October 2025
Qualcomm acquires open-source MCU firm Arduino to tap developer community
Qualcomm has announced the acquisition of Italian open-source hardware and software company Arduino, assuring that Arduino's brand mission and community spirit will remain intact...
Wednesday 8 October 2025
Compal subsidiary partners with Japan's Meiko to build PCB plant in Vietnam
Taiwanese printed circuit board (PCB) manufacturer Allied Circuit (ACCL), a subsidiary of Compal Electronics, has entered a joint venture with Japanese firm Meiko to establish an...
Wednesday 8 October 2025
Indian solar manufacturer to expand AI-powered production capacity in Gujarat
Pahal Solar, an Indian startup integrating artificial intelligence (AI) into solar manufacturing, plans to invest INR170 million (approx. US$1.91 million) to double its production...
Wednesday 8 October 2025
Samsung joins HBF development race, leveraging NAND dominance to reshape market
Samsung Electronics, the leader in NAND flash, has reportedly entered the high-bandwidth flash (HBF) memory market, signaling a potential shift in the competitive landscape of next-generation...