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Tuesday 19 August 2025
Smartphone display market sees diverging price trends across panel types

The third quarter, traditionally a peak season for the smartphone supply chain, has brought a mixed picture for display panel pricing...

Tuesday 19 August 2025
Samsung SDI beats LGES, SK On to secure major ESS contract
Samsung SDI recently emerged victorious in a large-scale energy storage system (ESS) tender in South Korea, marking a significant milestone in its business transformation as the electric...
Tuesday 19 August 2025
Samsung to challenge SK Hynix, Micron in Nvidia HBM supply after delays

Samsung Electronics is intensifying its bid to break into Nvidia's high-bandwidth memory (HBM) supply chain after lagging behind SK Hynix...

Tuesday 19 August 2025
SK Hynix signals slowing demand for TCB equipment, putting Hanmi at risk
The market for thermo-compression bonders, or TCB, has surged on the back of booming demand for AI. But signals out of South Korea now show signs of a slowdown. New orders in the...
Tuesday 19 August 2025
China's memory makers adopt domestic EDA: Empyrean in spotlight
China's semiconductor sector is intensifying its localization push. As ChangXin Memory Technologies (CXMT) and Yangtze Memory Technology Corp. (YMTC) ramp up mass production of DRAM...
Tuesday 19 August 2025
Foxconn to operate SoftBank's Stargate AI server site in Ohio
Hon Hai Precision Industry Co. will operate a US factory owned by SoftBank Group Corp., setting up what's in the running to be the first manufacturing site in the Japanese company's...
Tuesday 19 August 2025
China EV sector invests more abroad than at home for first time
Chinese companies involved in the electric vehicle industry invested more overseas than domestically for the first time in 2024, although foreign projects face higher costs, delays...
Tuesday 19 August 2025
Nvidia and ASIC servers drive liquid cooling expansion in ASEAN
Nvidia Corporation's GB200 server cabinets, along with cloud service providers' (CSP) servers powered by their in-house ASIC chips, are increasingly adopting liquid cooling technologies...
Tuesday 19 August 2025
China's demand for AI chips and HBM equipment persists despite uncertainty over Nvidia H20 sales
China's semiconductor industry continues to expand capacity in mature process chips while strengthening self-production of AI chips, especially as the Chinese AI sector gained momentum...
Monday 18 August 2025
Qisda-backed Diva Labs rolls out new display tech for hospitals and industrial control
Diva Laboratories, a medical display unit of Taiwan's Qisda Corp., is expanding with three growth drivers: the world's first 55- and 65-inch optical bonding (OB) LCDs for operating...
Monday 18 August 2025
Topco Scientific prepares for 2027 showdown as Chinese wafer makers strengthen market hold
As China's semiconductor juggernaut gathers pace, a fierce contest for dominance in the silicon wafer market is becoming inevitable for global suppliers.
Monday 18 August 2025
Foxconn reportedly begins small-scale iPhone 17 production in India despite US tariff headwinds
Despite fresh concerns over US President Donald Trump's decision to impose a punitive 50% tariff on Indian exports, global electronics manufacturers are pressing ahead with expansion...
Monday 18 August 2025
Foxconn underscores US strategy with EV and AI systems at Dallas expo

Hon Hai Technology Group, also known as Foxconn, presented a US-market version of its electric sport utility vehicle and showcased its...

Monday 18 August 2025
Huawei tests China's first HBM3 as CXMT accelerates expansion to counter supply squeeze
China's push for self-reliance in artificial intelligence (AI) semiconductors is running into fresh obstacles as Washington tightens controls on advanced memory. In response, ChangXin...
Monday 18 August 2025
Weekly news roundup: Apple's US$599 MacBook, China's HBM3 breakthrough, and TSMC 2nm leak update
Below are the top DIGITIMES Asia stories from August 11 to 17, 2025. Leading the headlines: Apple is preparing to launch a US$599 MacBook, with mass production of key components expected...