CONNECT WITH US
NEWS TAGGED PRODUCTION
Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers

As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains

As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...

Wednesday 2 September 2026
Tmytek to list on Innovation Board in September on antenna module growth
Millimeter-wave phased-array solutions provider Tmytek is set to list on the Innovation Board in September. Although the company has yet to turn profitable, its revenue mix has been...
Wednesday 2 September 2026
Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration
Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global manufacturing footprint. Its Japan plant is expected to complete...
Tuesday 1 September 2026
Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
Tuesday 1 September 2026
Japan's chip materials makers reportedly deepen Taiwan ties as AI reshapes supply chains
Japanese semiconductor materials suppliers Ajinomoto and Daikin Industries are expanding their presence in Taiwan as the AI boom fuels demand for advanced chip materials and encourages...
Tuesday 1 September 2026
Micron opens Tainan plant after 6.5 months amid labor dispute
Micron's plant at the Southern Taiwan Science Park, which it purchased from AUO for NT$7.4 billion (US$233.8 million) in August 2024, is now officially in operation, marking a key...
Tuesday 1 September 2026
ASML says High NA EUV has reached its first high-volume logic product
ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...
Tuesday 1 September 2026
Tmytek moves toward Taiwan listing as millimeter-wave demand nears mass production
Tmytek is preparing to list on the Taiwan Innovation Board as its millimeter-wave platforms approach commercial scale. For global telecom, satellite, and defense customers, the timing...
Tuesday 1 September 2026
LG Energy Solution secures long-term US lithium supply
LG Energy Solution has signed a long-term supply agreement with Smackover Lithium for battery-grade lithium carbonate, a move that could strengthen supply chains for energy storage...
Tuesday 1 September 2026
TSMC delays CoWoS orders as CoPoS plans take shape
TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
Tuesday 1 September 2026
XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6
South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device...
Tuesday 1 September 2026
Samsung locks 70% of memory output as HBM spot prices soar
Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
Tuesday 1 September 2026
Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale
China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...