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    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Monday 4 May 2026
    Zhen Ding expands NTHU partnership with new five-year research program
    PCB maker Zhen Ding Technology has launched the second phase of its joint research center with National Tsing Hua University, aiming to deepen collaboration on advanced PCB and IC...
    Saturday 2 May 2026
    Yageo AI revenue reaches 15% as chair says sector remains early in cycle
    Yageo chairman Pierre Chen said the company has undergone a major transformation over the past eight years, driven in part by the rise of AI applications.
    Saturday 2 May 2026
    Samsung Electro-Mechanics tops US$2 billion quarterly sales, flags ABF substrate shortage
    Samsung Electro-Mechanics (Semco) reported its first-ever quarterly revenue exceeding KRW3 trillion (approx. US$2.2 billion), driven by expanding AI infrastructure investment and rising...
    Friday 1 May 2026
    Samsung Electro-Mechanics weighs MLCC price hike of 5–10% as supply tightens
    Samsung Electro-Mechanics is considering raising prices for multilayer ceramic capacitors (MLCCs) by about 5% to 10% as demand from artificial intelligence (AI) infrastructure tightens...
    Thursday 30 April 2026
    Chang Wah Technology forecasts double-digit growth in the second quarter on EMC LED strength
    Packaging leadframe maker Chang Wah Technology Co., Ltd. reported that it achieved NT$3.672 billion (US$116 million) in revenue in the first quarter of 2026, its fourth-highest quarterly...
    Wednesday 29 April 2026
    Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
    Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...
    Wednesday 29 April 2026
    PCB industry urges four policy moves in Thailand expansion
    Amid global supply chain restructuring, Asia's PCB industry is moving toward closer regional collaboration. Industry experts say that as southbound expansion in the PCB sector takes...
    Tuesday 28 April 2026
    AI chip testing complexity lifts probe card and upstream supply chain demand
    As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.
    Monday 27 April 2026
    Thailand's PCB industry moves upmarket, local supply gaps persist

    Thailand is fast emerging as a critical hub for high-end electronics manufacturing, as global supply chains shift and demand for AI computing...

    Monday 27 April 2026
    TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
    ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...
    Monday 27 April 2026
    Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
    Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
    Monday 27 April 2026
    Innolux enters leading tier of advanced packaging with new RDL and TGV technology
    Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
    Friday 24 April 2026
    TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker
    The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
    Friday 24 April 2026
    AI PCB supply crunch squeezes margins on rising materials and energy costs
    A tightening supply of high-end materials is emerging as a key constraint just as PCB specifications and manufacturing processes move into a new upgrade cycle. Shortages span from...
    Friday 24 April 2026
    Zhen Ding to invest CNY40 billion in Huai'an to expand high-end PCB capacity

    Zhen Ding Technology has broken ground on its HD campus at the Huai'an Technology City in China, as it accelerates investment to expand...

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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook