News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Tuesday 27 January 2026

TPCA predicts 13.9% rise in global PCB market in 2026 amid AI-driven capacity shift

The rapid expansion of artificial intelligence (AI) computing is fueling a new wave of structural growth in the global printed circuit board (PCB) industry.

Tuesday 27 January 2026

AI and localization reshape China's semiconductor supply chain as price hikes arrive

After navigating pandemic tailwinds, US-China conflicts, and tariffs under US President Donald Trump, the global semiconductor and electronics industries are emerging from inventory...

Tuesday 27 January 2026

Yageo leads chip resistor price hikes, Walsin follows

Price increases are spreading through the passive components industry as clearer pricing signals from market leaders accelerate the trend across the supply chain. Products ranging...

Monday 26 January 2026

TAISIC Materials shifts focus to high-end SiC substrates

Facing intense price competition from Chinese manufacturers in the silicon carbide (SiC) substrate market, Kenmec Mechanical Engineering's subsidiary TAISIC Materials is pursuing a...

Monday 26 January 2026

Jabil names longtime director Steve Raymund chair

Jabil said on January 22, 2026, that longtime director Steve Raymund has been appointed chairman of its board, while Thomas T. Edman and Raejeanne Skillern have joined as new direc...

Monday 26 January 2026

LG Display pushes into glass interposers as Korean panel makers seek growth

LG Display is moving from research toward execution in the emerging glass interposer market, working with domestic glass-processing partners to apply its display manufacturing experience...

Monday 26 January 2026

Commentary: China's RISC-V progress from C-Sky to T-Head

Alibaba is rumored to be evaluating a plan to spin off T-Head Semiconductor for a potential listing. T-Head may still appear to be a young company, but to the semiconductor industry,...

Saturday 24 January 2026

Energy limits AI growth; geopolitical stakes in rare earths, new packaging innovations reshape global supply chains

The Global Electronics Association's latest "2026 Electronics Industry Trend Forecast" highlights critical challenges and shifts that will impact the sector over the next few years...

Saturday 24 January 2026

LinkCom magnetic component price pressure eases; wireless charging module prices rise by 20%

The Taiwanese passive components industry continued to experience a wave of price increases. Magnetic component manufacturer LinkCom pointed out that since magnetic components primarily...

Friday 23 January 2026

Resistor price surge spreads as Walsin Technology hikes pricing

Price increases for resistors are spreading across the passive components industry. After reported hikes by Taiwan-based market leader Yageo and supplier Formosan Rubber, Walsin Technology...

Friday 23 January 2026

ASML leads chip equipment charge into advanced packaging

Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end processes as a new growth engine as artificial intelligence...

Friday 23 January 2026

Fiberglass crunch spurs supply scramble as CCL makers ban order changes

As AI chip package sizes continue to grow, warpage issues in IC substrates have become more pronounced. Capacity constraints for low-CTE...

Thursday 22 January 2026

Tripod Technology targets over NT$5B in 2026 capex for Vietnam, China expansion

PCB maker Tripod Technology said full-year 2025 revenue reached a record high, and it expects stable momentum heading into 2026 despite...

Thursday 22 January 2026

Taiwan PCB direct shipments to the US remain limited

The US has lowered the tariff rate on Taiwan to 15%, and it will not be stacked with the most-favored-nation (MFN) tariff rate. This places Taiwan on the same baseline as Japan, South...

Wednesday 21 January 2026

Research Insight: High-end fiberglass cloth supply tightens as server demand spotlights Nittobo

As next-generation AI server platforms enter volume deployment, supply chain constraints are extending beyond high-bandwidth memory (HBM)...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook