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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Thursday 4 September 2025
Taiwan PCB supply chain tightens capex scale; leaders increase AI and SEA investments
Despite facing global end-market inventory adjustments and rising geopolitical uncertainties, Taiwan's printed circuit board (PCB) supply chain is shifting its capital expenditure...
Thursday 4 September 2025
China's SiC substrate industry faces setback, seeks strategic pivot
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
Thursday 4 September 2025
Tech Forum 2025: China's SiC surge leaves Wolfspeed struggling beyond bankruptcy
Wolfspeed's recovery from bankruptcy protection remains uncertain, with core problems expected to extend beyond its anticipated year-end exit. The US power semiconductor firm is struggling...
Wednesday 3 September 2025
Nittobo to triple T-Glass cloth capacity by 2027
Japanese fiberglass cloth giant Nitto Boseki (Nittobo) announced plans to invest JPY15 billion(US$101.87 million) to expand its production facilities to meet surging demand from...
Wednesday 3 September 2025
Why TSMC is holding back on advanced packaging despite soaring demand
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
Wednesday 3 September 2025
Yageo receives Japanese approval to acquire Shibaura Electronics after national security review
Taiwan-based Yageo has secured approval from Japanese foreign direct investment (FDI) authorities to acquire Shibaura Electronics, following an extensive national security review...
Tuesday 2 September 2025
Nittobo's Fukushima bet shakes up CoWoS supply chain, Taiwan Glass on the line
The global surge in generative AI is driving explosive growth in the AI server market, making advanced CoWoS packaging a crucial battleground for GPU makers and custom chip developers...
Monday 1 September 2025
Taiwan's Co-tech to halt standard copper foil, double down on AI and 5G specialty demand
Co-tech Development is shifting further into high-performance copper foil for AI servers and 5G networks, confirming it will discontinue standard-grade foil production by early 2026...
Monday 1 September 2025
TPCA Show to kick off in October with Unimicron chair as keynote speaker
The technology supply chain will gather for a series of exhibitions in the second half of 2025, including Taiwan's major PCB industry event, the TPCA Show, which will take place from...
Monday 1 September 2025
APCB faces pressure after capacity reduction, eyes boost from DDR5, optical modules in 2026
Taiwan-based PCB manufacturer APCB is launching two new products in 2025, following significant capacity downsizing in 2024. However, the company noted that the new QSFP optical module...
Saturday 30 August 2025
TSMC supplier AMC rewires its future with warpage-control materials after LCD collapse

Taiwan's LCD panel industry, which peaked at over NT$1 trillion in 2007, collapsed within years and became unprofitable. The decline...

Friday 29 August 2025
AI demand and state backing lift China's semiconductor rally

Shares of Chinese semiconductor firms rallied after a wave of strong half-year earnings, highlighting how Beijing's AI push is reshaping...

Friday 29 August 2025
Everlight Chemical banks on semiconductor materials
Everlight Chemical is maintaining a cautious outlook for the second half of 2025, with no expectations of recovering demand in the third quarter, but seeing a potential rebound in...
Thursday 28 August 2025
Yageo confident of Shibaura acquisition approval after METI discussions
Yageo Corp. officially launched a public tender offer for Shibaura Electronics on May 9, 2025. Shibaura, a globally recognized manufacturer of negative temperature coefficient (NTC)...
Wednesday 27 August 2025
Nvidia's CoWoP PCB architecture targets ABF substrates but faces warpage risk
Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...