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    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Tuesday 4 August 2026
    Samsung Electro-Mechanics reportedly fast-tracks Philippine MLCC plant in wake of AI-driven price hikes

    Samsung Electro-Mechanics (SEMCO) is reportedly pulling forward the start-up of its first overseas multilayer ceramic capacitor (MLCC)...

    Tuesday 4 August 2026
    Taiwan specialty chemical firm expands Taiwan, China capacity on AI materials boom, eyes 20% revenue gain in 2026
    Taiwan-based specialty chemicals supplier Johnson Fine Chemical expects robust growth in electronic materials demand driven by AI, high-performance computing (HPC) and advanced communications...
    Tuesday 4 August 2026
    Kinsus boosts spending as global IC substrate supply stays tight
    Kinsus said stronger second-quarter results and fresh capital spending reflect continued strain in the global IC substrate market, where demand from AI, CPU, GPU, and ASIC customers...
    Monday 3 August 2026
    AI infrastructure orders extend PCB expansion race
    Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL)...
    Monday 3 August 2026
    India expands chip talent pipeline amid surging global chip demand
    India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply...
    Monday 3 August 2026
    Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027
    Samsung Electro-Mechanics used its second-quarter earnings call to signal that its bet on AI infrastructure is paying off and about to get bigger, pointing to a run of long-term supply...
    Monday 3 August 2026
    Flexible PCB maker Flexium sees AI server shipments doubling after 2Q margin turns positive
    Flexium Interconnect said its second-quarter operating loss narrowed from the previous quarter as new flexible printed circuit products entered mass production for a US customer's...
    Monday 3 August 2026
    C.C.P. Contact Probes teams with chipmaker on MEMS probes and test-cleaning sheets
    C.C.P. Contact Probes said it has expanded its presence in the AI sector through a joint development project with a major semiconductor company covering microelectromechanical systems...
    Monday 3 August 2026
    AI server demand revives long-term MLCC supply agreements as shortages intensify
    Surging demand for AI servers is tightening global capacity for high-end passive components, prompting customers to once again pursue long-term supply agreements (LTSAs) as they seek...
    Saturday 1 August 2026
    Elite Material posts record 2Q result on strong AI-related demand
    Elite Material Co. said booming demand for advanced materials used in AI hardware kept its factories fully loaded in the second quarter of 2026, lifting revenue and profit to record...
    Saturday 1 August 2026
    Thintronics wins proposed US CHIPS incentives for advanced substrate technology
    Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
    Friday 31 July 2026
    AI server boom reshapes MLCC pricing as capacity shifts upmarket

    The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring...

    Friday 31 July 2026
    Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

    Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

    Friday 31 July 2026
    Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
    TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
    Friday 31 July 2026
    Chang Wah sees broadening demand recovery and higher margins in 2Q26
    Chang Wah Technology said stronger demand and tighter inventories are lifting its business across multiple markets, a sign that the recovery in electronics supply chains is widening...
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    Aug 31, 08:00
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
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