News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Tuesday 3 June 2025

Nittobo announces 20% price increase on fiberglass products

Leading Japanese glass cloth manufacturer Nittobo Boseki announced on June 2, 2025, that it will increase the price of certain fiberglass products in its composite materials business...

Tuesday 3 June 2025

Chip packaging material shortage deepens as top supplier raises prices 20%

Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...

Tuesday 3 June 2025

Flexium Interconnect pushes forward in AI server while rejoining Apple suply chain amid transformation challenges

Flexible printed circuit (FPC) maker Flexium Interconnect is navigating a critical phase of transformation as it shifts its business focus toward next-generation technologies. While...

Tuesday 3 June 2025

Exclusive: Renesas to sell near-new SiC gear as EV pivot clouds Taiwan partnerships

Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company has canceled plans for mass production in early 2025 and...

Tuesday 3 June 2025

Zhen Ding sees tariff risk as minimal, but braces for forex losses

Zhen Ding Technology, the world's leading printed circuit board (PCB) manufacturer, held its 2025 annual shareholders' meeting on May...

Monday 2 June 2025

Trump holds reins on Wolfspeed's future as foreign buyers balk at 'Made in USA' cost burden

Wolfspeed, the US leader in silicon carbide (SiC) materials and a key player in the power semiconductor supply chain, has denied recent bankruptcy rumors. However, delays in receiving...

Monday 2 June 2025

Applied Materials reportedly partners with Absolics in glass substrate

Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced lithography equipment dedicated to this emerging segment...

Monday 2 June 2025

Samsung Electro-Mechanics to supply glass substrate samples to US firms, Korean giants target TSMC's packaging lead

Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...

Monday 2 June 2025

Wolfspeed's missteps fuel decline as China closes silicon carbide gap

Wolfspeed, once the dominant supplier of silicon carbide (SiC) materials, is now grappling with financial distress as its market lead continues to erode. Just five years ago, the...

Monday 2 June 2025

Weekly news roundup: Huawei's 5nm PC, Wolfspeed's SiC crisis, and China's export chokehold

These are the most-read DIGITIMES Asia stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in China's chip self-sufficiency, Wolfspeed's...

Saturday 31 May 2025

Samyang eyes Japan acquisitions to diversify beyond food and chemicals

South Korea's Samyang Holdings, a conglomerate traditionally rooted in food and chemicals, is setting its sights on Japan's semiconductor supply chain as part of a strategic pivot...

Thursday 29 May 2025

WPG marks 20 years by doubling down on AI and tariff strategy amid global disruptions

As it marks its 20th anniversary in 2025, WPG Holdings, Asia's largest semiconductor distributor, finds itself at the intersection of two disruptive forces: the generative AI boom...

Thursday 29 May 2025

Leadframe maker CWTC upbeat about market, with capacity expansion on track in Malaysia

Taiwan-based leadframe maker Chang Wah Technology (CWTC) is upbeat about 2025 as demand recovers, and will continue to expand its production capacity in Malaysia, according to company...

Thursday 29 May 2025

Currency crunch stalls Nanya PCB, yet cloud and edge AI bets are just getting started

Nan Ya Printed Circuit Board Corporation (Nanya PCB), a top Taiwanese IC substrate maker, cautioned that second-quarter earnings may...

Wednesday 28 May 2025

Foxconn taps NTU, KAUST in μ-LED leap for next-gen optical and AI interconnects

With artificial intelligence driving explosive demand for high-speed data transfer, optical communication technologies are advancing in lockstep. Foxconn's Hon Hai Research Institute...

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Jun 30, 16:14

Vietnam's new crypto law sets global standard for token regulation and licensing

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Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES