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    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Thursday 26 February 2026
    Taiwan Mask posts nearly NT$100m profit in January, advanced packaging to boost revenue in 2H26
    Benefiting from its group integration strategy, Taiwan Mask Corporation (TMC) is seeing operations that are gradually recovering. The parent company's core business has seen five consecutive...
    Thursday 26 February 2026
    Fiberglass shortage persists in 2026, Unimicron increases substrate price
    As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly...
    Thursday 26 February 2026
    Yageo posts 82% profit jump in 4Q25 on AI-driven product mix
    Taiwanese passive component giant Yageo reported a strong operational rebound in the fourth quarter of 2025, driven by continued growth in demand related to artificial intelligence...
    Wednesday 25 February 2026
    Unimicron names UMC's SC Chien chair in substrate strategy shift
    Unimicron held an investor conference on 25 February 2026. A day earlier, its board approved the appointment of UMC co-president SC Chien as chairman and group chief strategy officer...
    Wednesday 25 February 2026
    Chart: Why Taiwan's OSAT sector just flipped the switch

    The latest January revenue data for Taiwan's Outsourced Semiconductor Assembly and Test (OSAT) sector—disclosed this month—confirms...

    Wednesday 25 February 2026
    Unimicron's 4Q25 profit surpasses combined earnings of first 3 quarters; 2026 capex raised to NT$34 billion
    Given the steady demand for AI and high-performance computing (HPC) chips, Unimicron stated that orders for IC substrates and PCBs have picked up. This has not only steadily increased...
    Wednesday 25 February 2026
    Walsin Technology boosts Matsuo Electric stake to expand product lines
    Walsin Technology Corporation announced plans to invest JPY508 million (US$3.27 million) to increase its shareholding in Japan's Matsuo Electric, a move the passive components maker...
    Wednesday 25 February 2026
    MLCC prices to climb as AI demand hits full capacity
    The global multilayer ceramic capacitor (MLCC) market is on the brink of a price surge as Japanese and Korean giants grapple with record demand from AI data centers. Samsung Electro-Mechanics...
    Wednesday 25 February 2026
    ASE accelerates panel-level packaging push with fully automated 310mm line by 2026
    AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...
    Wednesday 25 February 2026
    China AI server buildout strains optical module, MLCC capacity
    China's AI data center supply chain gained renewed focus after the Lunar New Year holiday, as optical module and MLCC suppliers pointed to sustained demand from hyperscale infrastructure...
    Tuesday 24 February 2026
    Chart: Small specialists outrun giants in Taiwan's semiconductor materials market

    Following the February 10th disclosure deadline for Taiwan-listed companies, the January 2026 revenue reports for the semiconductor materials sector...

    Tuesday 24 February 2026
    CMAT sees order visibility extending two quarters ahead as test interface structural precision upgrades
    The rapid development of AI and high-performance computing (HPC) chips is providing long-term demand support for the semiconductor advanced testing interface supply chain, driving...
    Tuesday 24 February 2026
    Taiwan's CMAT to debut as AI chip testing boom lifts margins
    Semiconductor test interface component manufacturer Certain Micro Application Technology (CMAT) announced during a media gathering that it will officially begin trading on the Taipei...
    Tuesday 24 February 2026
    Analysis: Foxconn's India semiconductor push signals deeper localization and supply-chain shift
    Foxconn's move from assembly to semiconductor packaging in India marks a strategic deepening that could accelerate local supply-chain integration and influence global EMS competition,...
    Tuesday 24 February 2026
    Analysis: MediaTek’s long game in cloud silicon
    MediaTek CEO Rick Tsai set the climate for the company's growth trajectory at the International Solid-State Circuits Conference (ISSCC) 2026, centering his keynote speech on cloud...
    2/46 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook