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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 2 October 2026
ASE stake, expansion open doors for Machvision
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
Friday 2 October 2026
JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists
JSR Micro Korea, the local subsidiary of Japan-based JSR, officially completed construction of a new semiconductor materials plant on September 30 in the Ochang Foreign Investment...
Thursday 1 October 2026
Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity
Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction...
Thursday 1 October 2026
Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move
As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV)...
Thursday 1 October 2026
BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced...
Thursday 1 October 2026
Unimicron expands ABF substrate capacity with NT$10B Hukou land deal
Unimicron has moved again to ease tight ABF substrate supply, buying a Hukou site from Bridgestone Taiwan for more than NT$10 billion (US$313.65 million). The deal highlights how AI...
Thursday 1 October 2026
Qualcomm says PC chip shortages are manageable; price swings hit harder
Qualcomm's senior vice president and general manager of the compute and gaming business, Kedar Kondap, said the biggest challenge facing the PC industry is not component shortages,...
Thursday 1 October 2026
ASIC shipments top GPUs in 2027 as ABF substrate bottlenecks shift
The high-end cloud AI accelerator market will see a structural shift in 2027, with total ASIC shipments surpassing GPU shipments for the first time, driven by rising output from Google,...
Wednesday 30 September 2026
Gold Circuit turns Amazon into a shareholder for Trainium servers
Gold Circuit Electronics (GCE) plans to bring in Amazon as a strategic investor through a private placement expected to raise NT$1.59 billion (US$49.88 million), lifting the two companies...
Wednesday 30 September 2026
AI boom draws display makers into semiconductors with glass core substrates and Micro LED
AI is driving the semiconductor industry into a new growth cycle while creating opportunities for display companies traditionally centered on panels to move into semiconductors. These...
Wednesday 30 September 2026
Murata begins mass production of world's smallest three-terminal MLCCs
Murata Manufacturing has started mass production of its LLD series, a new class of ultra-compact capacitors that could help device makers worldwide fit more power management into smaller...
Wednesday 30 September 2026
NSIG chair exit brings leadership succession into focus
National Silicon Industry Group (NSIG) chairman Haitao Jiang has resigned from all positions at the company, prompting the Shanghai-listed semiconductor materials supplier to begin...
Wednesday 30 September 2026
Samsung Electro-Mechanics' disclosed 2026 supply agreements total US$2.6 billion as server demand surges
Samsung Electro-Mechanics has signed another long-term supply agreement for server components, bringing the value of its disclosed supply agreements this year to about US$2.6 billion...
Wednesday 30 September 2026
TDK and Taiyo Yuden to explore alliance on AI-grade capacitors and inductors
TDK and Taiyo Yuden have signed a memorandum of understanding to begin discussions on a business alliance to develop electronic components, including MLCCs and inductors jointly, the...
Wednesday 30 September 2026
Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant
Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026,...