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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 18 September 2026
GaN is winning the AI power argument, not yet the cost battle

Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage...

Friday 18 September 2026
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit...

Thursday 17 September 2026
Trumpf eyes glass as AI demand drives packaging innovation
At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser...
Thursday 17 September 2026
Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance...
Thursday 17 September 2026
AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader...

Thursday 17 September 2026
Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag
Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek...
Thursday 17 September 2026
Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026

Foreign commitments timed around SEMICON India are moving deeper into the supply chain. In the three days before the 2026 edition opened...

Thursday 17 September 2026
Column: China tightens rare earth controls, exposing hidden vulnerabilities in Taiwan's supply chain
China's rare earth export controls are changing the rules governing global critical mineral supply chains. For Taiwan, the real concern is not that China could suddenly halt all exports...
Wednesday 16 September 2026
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
Wednesday 16 September 2026
Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs

Global cloud service providers are continuing to expand AI infrastructure, driving a surge in demand for high-frequency, high-speed...

Wednesday 16 September 2026
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
Wednesday 16 September 2026
Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...
Wednesday 16 September 2026
FSC teams with South Korean maker on TGV equipment for glass substrates
Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
Wednesday 16 September 2026
A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors
High-end multilayer polymer capacitors (MLPCs) — increasingly critical to power delivery in AI servers and high-wattage GPUs and CPUs — have historically been dominated...