AI and high-performance computing are pushing chip packages beyond the limits of conventional materials, and German laser equipment...

The global wave of AI data center construction continues to accelerate, driving structural growth across the PCB and passive component...

AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry...

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products...