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    Tsinghua Unigroup distances itself as Dongguan chip-cloud city land is reclaimed
    6h 50min ago
    Manz Asia targets PLP demand with three lines and three sizes
    6h 50min ago
    Panel-level packaging splits roles as FOPLP targets cost and CoPoS courts AI chips
    6h 50min ago
    Google expands TPU lineup, AMD may not crowd out Broadcom or MediaTek
    6h 50min ago
    US-China tech war spreads to optical transceivers and upstream supply chain
    6h 50min ago
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Friday 14 August 2026
    China PCB makers pour billions into AI server, HPC, optical markets
    Chinese printed circuit board (PCB) makers are stepping up investment in higher-value markets including AI servers, high-performance computing (HPC) and optical communications. Following...
    Friday 14 August 2026
    Interview: 'Modern warfare is a battle of PAs'–Transcom targets overseas defense, LEO satellite growth

    Amid escalating geopolitical tensions, defense awareness is rising rapidly worldwide, with drone and counter-drone technologies becoming...

    Friday 14 August 2026
    ABF substrate boom lifts Eternal Precision prices 20%

    Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision...

    Friday 14 August 2026
    Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
    AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
    Friday 14 August 2026
    Korea's CNT pellicle race heats up as aweXome Ray pushes toward EUV commercialization
    As South Korea's major memory manufacturers race to secure next-generation lithography technologies for increasingly advanced process nodes, the approaching High-NA EUV era is adding...
    Thursday 13 August 2026
    Pegatron stocks AI server parts early as shortages spread through supply chain
    Pegatron Corp. said in its second-quarter 2026 results that its server business posted strong gains and that it had already begun preparing for demand in the second half of 2026 while...
    Thursday 13 August 2026
    Zhen Ding targets 50% revenue share from AI servers, optical modules, IC substrates by 2030

    Zhen Ding Tech (ZDT), a major PCB supplier, said at its second-quarter 2026 earnings conference on August 11 that rising investment...

    Thursday 13 August 2026
    409.6T switches could push industry toward CPO, Arista says
    Co-packaged optics (CPO) has become a major focus of the optical networking industry, but pluggable modules remain the mainstream choice for optical interconnects. At a silicon photonics...
    Thursday 13 August 2026
    Lenovo Capital backs Niobium Optoelectronics in Series B funding for TFLN chips
    Jiangsu Niobium Optoelectronics Technology, a Chinese maker of thin-film lithium niobate (TFLN) photonic chips, has closed a Series B funding round worth several hundred million yuan...
    Thursday 13 August 2026
    Can diamond rewrite the rules of AI chip cooling? Wiwynn is putting it to the test
    As AI processors become more powerful, one of the industry's most stubborn constraints is becoming increasingly physical: there is only so much heat conventional materials can move...
    Thursday 13 August 2026
    LSE Semiconductor wins strategic investment from TIS

    Lithography Semiconductor Equipment Co. (LSE) officially announced on August 11 that TECO Image Systems Co. (TIS) had completed a strategic...

    Wednesday 12 August 2026
    MediaTek, Realtek, Himax, Elan eye optical communications boom in 2027
    The use of optical communications in cloud AI data-center interconnect architectures is rising sharply, and Taiwan IC design firms including MediaTek, Realtek Semiconductor, Himax...
    Wednesday 12 August 2026
    Nichidenbo sees MLCC supply tightness as AI pushes lead times to 36 weeks

    Passive component distributor Nichidenbo said supply of MLCCs and other products remains tight as AI servers and ASIC applications...

    Wednesday 12 August 2026
    OCP APAC 2026: Murata upgrades power, optical products as AI data centers strain global infrastructure
    Murata Manufacturing has unveiled upgraded power converters and optical components, highlighting how rising AI workloads are pushing data centers worldwide toward denser, more efficient...
    Tuesday 11 August 2026
    YAGEO, Walsin post record July sales as AI demand lifts passive components
    YAGEO and Walsin Technology reported strong July 2026 revenue as artificial intelligence demand continued to lift Taiwan's passive components sector. Both companies said orders from...
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    CIOE
    BIZ FOCUS
    Aug 13, 08:00
    AI Memory & Storage: GMIF 2026 Hits Shenzhen Sept 22-23
    Wednesday 12 August 2026
    From Campus to Global R&D: Joining Phison in Malaysia
    Tuesday 11 August 2026
    ViTrox showcases AI packaging inspection solutions at SEMICON Taiwan 2026.
    Monday 10 August 2026
    BIOSTAR to Showcase at EMBEDDED WORLD NORTH AMERICA 2026
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