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    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Wednesday 14 October 2026
    Taiwan FPCB maker CMI targets flat 2026 revenue despite memory, CPU shortages hitting notebook demand
    Flexible printed circuit board (FPCB) manufacturer Complex Micro Interconnection (CMI) reported September 2026 revenue of NT$163 million (≈ US$5.1 million), down 15.43% year-on-year,...
    Tuesday 13 October 2026
    AI substrate material shortages ease, but advanced equipment emerges as expansion bottleneck
    As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention...
    Tuesday 13 October 2026
    Samsung's US$9B chip expansion faces funding, supply hurdles
    Samsung affiliates plan to invest a combined KRW12.26 trillion (approx. US$9.18 billion) in semiconductor operations across South Korea and Vietnam, but the projects face different...
    Tuesday 13 October 2026
    AI server tracker: Taiwan's CCL, PCB and IC substrate suppliers see widening growth gap despite AI boom

    Taiwan's copper-clad laminate (CCL), printed circuit board (PCB) and IC substrate suppliers are seeing uneven returns from AI infrastructure spending...

    Tuesday 13 October 2026
    South Korea's YMT targets fivefold rise in glass-substrate plating capacity
    South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times...
    Tuesday 13 October 2026
    Korea Alcohol Group speeds up pivot into semiconductors
    Korea Alcohol Group is accelerating its shift toward semiconductor materials with a KRW450 billion (US$337 million) production base at Yesan County in South Korea's South Chungcheong...
    Tuesday 13 October 2026
    AI Server tracker: Taiwan's AI server chain grew 55% in September, but the growth narrowed to fewer suppliers
    The AI buildout is still lifting Taiwan's server supply chain faster than almost any other industry, yet September's filings show the lift concentrating into fewer hands. The 49 listed...
    Monday 12 October 2026
    How 'Filter Moore's Law' is doubling revenue for a Taiwan chip filter maker
    Under what the industry terms the "Filter Moore's Law," each process node shrink lowers tolerance for airborne molecular contaminants, causing filtration demand to grow exponentially...
    Monday 12 October 2026
    Sumitomo Bakelite expands packaging material production across Singapore, China
    Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This...
    Monday 12 October 2026
    AI racks approach megawatt power levels as SiC, GaN, silicon divide power delivery roles
    The rapid expansion of AI infrastructure is driving demand for higher power and voltage levels, pushing power semiconductor development toward greater efficiency, higher power density,...
    Monday 12 October 2026
    Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation
    This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...
    Monday 12 October 2026
    India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

    India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...

    Saturday 10 October 2026
    TPCA Show 2026 to spotlight AI computing, Unimicron chair keynote
    As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...
    Saturday 10 October 2026
    Semco moves glass substrates to package-level testing
    Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...
    Saturday 10 October 2026
    JNTC bets US$259 million on glass substrates ahead of 2028 ramp
    South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
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    Wednesday 14 October 2026
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    Hybrid Copper Bonding - A Manufacturing Lever for The AI Era