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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Thursday 23 July 2026
Laser source outsourcing pushes back CPO rollout
While the commercialization timeline for co-packaged optics (CPO) has not accelerated as expected from the AI data center-driven demand for high-speed transmission, industry players...
Thursday 23 July 2026
IQE lifts 2026 outlook as AI data centers accelerate indium phosphide demand

IQE has raised its 2026 revenue outlook as demand for artificial intelligence (AI) infrastructure and data centers continues to strengthen,...

Wednesday 22 July 2026
AI and satellite demand drive quartz components toward lower noise, jitter and higher precision

The rapid growth of AI data traffic is pushing quartz timing components toward three key technical upgrades: lower phase noise, reduced...

Wednesday 22 July 2026
HKC invests US$590M in advanced chip packaging to escape the LCD cycle

HKC, the world's third-largest LCD panel supplier, plans to invest CNY4 billion (approx. US$590 million) in a 12-inch chip packaging and...

Wednesday 22 July 2026
WAIC 2026: Enflame debuts China's first glass-based CoPoS AI chip sample

Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip...

Wednesday 22 July 2026
AI infrastructure spending is reshaping Southeast Asia's PCB supply chain

Rising investment in AI servers, high-speed networking, and satellite communications is accelerating a shift in Southeast Asia's electronics...

Wednesday 22 July 2026
'Two companies, one business': how Zeiss and ASML are riding the AI boom to dominate EUV

Zeiss, the exclusive supplier of ASML's extreme ultraviolet (EUV) optical systems, says the two companies operate as though they were...

Tuesday 21 July 2026
Haesung DS lands CXMT as DDR5 substrate customer, weighs panel production for DDR6

Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business...

Tuesday 21 July 2026
Google developing 'frozen' chip that embeds Gemini models for efficiency gains

Google is reportedly developing a new chip that embeds information from its Gemini AI models directly onto the silicon to boost efficiency...

Tuesday 21 July 2026
Ishihara Sangyo doubles high-purity titanium dioxide capacity on AI server demand

Ishihara Sangyo Kaisha plans to double production capacity for high-purity titanium dioxide used to make dielectric materials for multilayer...

Tuesday 21 July 2026
Samsung, SK Hynix and Micron pull back on in-house CXL controller plans

Samsung Electronics, SK Hynix and Micron Technology are reportedly scaling back or shelving plans to commercialize internally developed...

Tuesday 21 July 2026
China's EUV gap keeps semiconductor catch-up in check
As the US continues to tighten export controls on advanced semiconductor equipment to China, questions are mounting over whether China can narrow the gap with leading-edge manufacturing...
Tuesday 21 July 2026
How AI boom spurs Taiwan's PCB makers to rethink their Southeast Asia playbook

Amid the global boom in AI infrastructure investment, Southeast Asia is evolving from an electronics-component manufacturing base into...

Tuesday 21 July 2026
Elite Material, TUC race ahead in AI CCL push

As AI server products accelerate their generational shift and demand higher-frequency, higher-speed transmission, the upgrade cycle...

Tuesday 21 July 2026
Glass substrates poised to be chip packaging's next battleground: Trumpf

AI and high-performance computing are pushing chip packages beyond the limits of conventional materials, and German laser equipment...