Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business...

Google is reportedly developing a new chip that embeds information from its Gemini AI models directly onto the silicon to boost efficiency...

Ishihara Sangyo Kaisha plans to double production capacity for high-purity titanium dioxide used to make dielectric materials for multilayer...

Samsung Electronics, SK Hynix and Micron Technology are reportedly scaling back or shelving plans to commercialize internally developed...

Amid the global boom in AI infrastructure investment, Southeast Asia is evolving from an electronics-component manufacturing base into...

As AI server products accelerate their generational shift and demand higher-frequency, higher-speed transmission, the upgrade cycle...

AI and high-performance computing are pushing chip packages beyond the limits of conventional materials, and German laser equipment...

The global wave of AI data center construction continues to accelerate, driving structural growth across the PCB and passive component...

AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry...

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...