CONNECT WITH US
NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 30 June 2026
Ability Opto-Electronics targets CPO growth with V-groove and MT lines

Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged...

Tuesday 30 June 2026
Samsung Electro-Mechanics targets AI server growth with MLCC talks, substrate push

Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for...

Tuesday 30 June 2026
Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes

As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals...

Monday 29 June 2026
Kyocera to invest JPY650 billion in chip equipment and data center components

Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment...

Monday 29 June 2026
Niching targets higher margins as heat spreader orders extend through year-end
Advanced packaging is driving demand for heat spreaders, and semiconductor packaging and testing materials supplier Niching Industrial said its acquisition of Ming Chun Yuan Micro...
Monday 29 June 2026
Infineon counters Innoscience claim after China GaN patent setback
Infineon and Innoscience are locked in a global legal battle over alleged infringement involving gallium nitride (GaN) technology, with courts across multiple jurisdictions becoming...
Sunday 28 June 2026
LG Chem weighs CCL expansion as AI chip demand strains supply

LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as...

Sunday 28 June 2026
Kaori fuel cell orders extend to 1 year; expanding capacity in Taiwan and overseas
Fuel cells are emerging as one of the key solutions for future energy supply. Kaori Heat Treatment, one of the suppliers in the Bloom Energy supply chain, said that its fuel cell order...
Friday 26 June 2026
AuthenX targets AI data center interconnects with plug-and-play FAU for CPO
AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration...
Friday 26 June 2026
Corning weighs South Korea site as chip packaging race turns to glass

Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass...

Friday 26 June 2026
Academia Sinica readies Taiwan-made quantum chip for engineering push
Academia Sinica has built a 20-qubit quantum chip from scratch, and the team now says the next phase is less about lab breakthroughs and more about engineering a scalable, reproducible...
Friday 26 June 2026
Academia Sinica targets quantum chip manufacturing scale with Taiwan's semiconductor tool base
Academia Sinica's Center for Quantum Computer is focusing only on hardware, not algorithms or applications, and executive director Chii-Dong Chen said that approach is similar to the...
Friday 26 June 2026
How Optivision is speeding up the shift from LCD optical films to high-end auto applications
As growth in the traditional consumer electronics market slows and industry competition intensifies, LCD optical film manufacturer Optivision Technology is accelerating its transition...
Thursday 25 June 2026
IntelliEPI targets record 2026 revenue amid InP substrate shortages
Compound semiconductor epitaxial wafer maker IntelliEPI said AI-driven high-speed transmission demand continues to lift the indium phosphide (InP) market, and it expects revenue to...