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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Saturday 27 September 2025
Infineon, Rohm sign MOU to support flexible SiC power device shipments
Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate...
Friday 26 September 2025
Anpec says share price undervalued in Yageo public tender offer
Taiwanese passive components maker Yageo, on September 11, 2025, unilaterally announced plans to invest over NT$4.8 billion (US$158 million) to acquire a major stake in power management...
Friday 26 September 2025
Ennostar advances AI optical communication with X-Celeprint partnership to promote SiPh integration
Ennostar, a Taiwan-based developer of optoelectronic semiconductors, is actively expanding its presence in the AI optical communication market. It has announced a collaboration with...
Thursday 25 September 2025
Memory shortage drives BT substrate orders, boosting 4Q25 growth momentum
The memory market shortage has reignited a new wave of price increases. As supply tightens for NAND flash storage memory, traditional hard disk drives (HDD) and solid-state drives...
Wednesday 24 September 2025
Taiwan's three major science parks report chip-driven record revenue in 1H25
The National Science and Technology Council's three major science parks achieved a combined revenue of NT$2.74 trillion (approximately US$90.6 billion) in the first half of 2025,...
Wednesday 24 September 2025
Why your next PC or smartphone will cost more: chipmakers, suppliers raise prices amid AI frenzy
Escalating tariffs, high inflation, and a shift in supply chains to the US are driving up manufacturing costs, leaving little room for prices on consumer electronics and business...
Tuesday 23 September 2025
Nvidia-Intel alliance to boost long-term demand for ABF substrates
Nvidia and Intel have announced a rare partnership to jointly develop next-generation AI data center and PC platform chips. Despite predominantly negative market interpretations,...
Tuesday 23 September 2025
Yole Group CEO interview (Part 1): TSMC dominates AI era as supply chain dynamics undergo massive shifts
The semiconductor industry is experiencing its most dramatic transformation in decades, driven by artificial intelligence's relentless demand for computing power. Traditional boundaries...
Tuesday 23 September 2025
Episil bets on SiC and GaN for Q4 rebound as compound semiconductor market bottoms out

Episil and its epitaxy-focused subsidiary Episil Precision, spanning both silicon (Si) and wide-bandgap semiconductors such as silicon...

Monday 22 September 2025
Murata doubles down on quality as Chinese rivals expand in MLCC market
Murata Manufacturing, the world's largest MLCC producer, is reinforcing its strategy around quality in the face of intensifying competition from Chinese manufacturers. The company...
Sunday 21 September 2025
Huawei patents SiC cooling tech to power next-gen AI chips
Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...
Sunday 21 September 2025
Non-China market opportunities remain despite no involvement in advanced packaging, say Episil and EPI
The surge of 12-inch silicon carbide (SiC) materials entering advanced packaging processes has drawn significant market attention to Episil Technology, which spans first- and third-category...
Saturday 20 September 2025
TSC expands overseas presence, optimistic for double-digit growth in 2026
Topco Scientific (TSC) is actively expanding its global footprint. Chairman Jeffery Pan stated that following the layout of global semiconductor clusters, besides establishing locations...
Friday 19 September 2025
A trio of factors tips Shibaura to Yageo in takeover fight
After months of back-and-forth in the takeover battle for Japanese negative temperature coefficient (NTC) thermistor manufacturer Shibaura Electronics, Taiwanese passive component...
Friday 19 September 2025
Samsung, Wolfspeed escalate silicon carbide race as EV and AI demand climbs
Samsung Electronics is accelerating its research into silicon carbide (SiC), a next-generation power semiconductor material, as competition heats up across the industry.