News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Tuesday 5 May 2026

CHPT posts record April revenue on AI-driven HPC demand

Semiconductor test interface provider Chunghwa Precision Test Tech (CHPT) said its revenue in April 2026 continued to set a new all-time monthly high, driven by rising demand for semiconductor...

Tuesday 5 May 2026

Intel's revival runs on politics and promises — but supply bottlenecks tell a different story

Intel's share price has hit historic highs as the semiconductor industry draws significant investor attention. But is this hype justified? DIGITIMES analyst Luke Lin took a deep dive...

Monday 4 May 2026

Win Semiconductors: GaAs and InP supply still meets production demand

Rising raw material prices have pushed up gallium arsenide (GaAs) substrate costs, squeezing a key material used in power amplifiers (PA). Win Semiconductors said that its scale gives...

Monday 4 May 2026

AI's 1.6T shift turns InP into optical supply chain bottleneck

The transition from 800G to 1.6T optical modules is no longer an upgrade cycle — it is a physics-driven inflection point.

Monday 4 May 2026

Yageo's Pierre Chen says AI hardware boom is lifting passive component demand

Yageo chairman Pierre Chen said the rise of AI applications is driving stronger demand not only for advanced semiconductors and memory,...

Monday 4 May 2026

BenQ Materials unit Cenefom enters memory supply chain with CMP brush wheels

BenQ Materials is accelerating its expansion into semiconductor materials as its subsidiary Cenefom officially begins operations at its new Guangyuan plant. The facility's chemical...

Monday 4 May 2026

AI chip demand ignites embedded substrate race among Samsung, Ibiden, Unimicron

Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...

Monday 4 May 2026

Zhen Ding expands NTHU partnership with new five-year research program

PCB maker Zhen Ding Technology has launched the second phase of its joint research center with National Tsing Hua University, aiming to deepen collaboration on advanced PCB and IC...

Saturday 2 May 2026

Yageo AI revenue reaches 15% as chair says sector remains early in cycle

Yageo chairman Pierre Chen said the company has undergone a major transformation over the past eight years, driven in part by the rise of AI applications.

Saturday 2 May 2026

Samsung Electro-Mechanics tops US$2 billion quarterly sales, flags ABF substrate shortage

Samsung Electro-Mechanics (Semco) reported its first-ever quarterly revenue exceeding KRW3 trillion (approx. US$2.2 billion), driven by expanding AI infrastructure investment and rising...

Friday 1 May 2026

Samsung Electro-Mechanics weighs MLCC price hike of 5–10% as supply tightens

Samsung Electro-Mechanics is considering raising prices for multilayer ceramic capacitors (MLCCs) by about 5% to 10% as demand from artificial intelligence (AI) infrastructure tightens...

Thursday 30 April 2026

Chang Wah Technology forecasts double-digit growth in the second quarter on EMC LED strength

Packaging leadframe maker Chang Wah Technology Co., Ltd. reported that it achieved NT$3.672 billion (US$116 million) in revenue in the first quarter of 2026, its fourth-highest quarterly...

Wednesday 29 April 2026

Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key

Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...

Wednesday 29 April 2026

PCB industry urges four policy moves in Thailand expansion

Amid global supply chain restructuring, Asia's PCB industry is moving toward closer regional collaboration. Industry experts say that as southbound expansion in the PCB sector takes...

Tuesday 28 April 2026

AI chip testing complexity lifts probe card and upstream supply chain demand

As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook