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    Memory shortage reshapes smartphone SoC market as MediaTek and Qualcomm lose share
    59min ago
    Lightelligence's HK listing signals China’s CPO push gaining momentum
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    Samsung highlights 4nm FinFET as AI chip demand rises
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    South Korea's OLED share rebounds to 68.7% in 2025
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    Taiwan and Europe push localised drone countermeasure tech
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    Low-Earth-orbit satellite market takes shape as Taiwan suppliers secure positions
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    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Wednesday 22 April 2026
    Nvidia-linked Chinese PCB maker jumps on Hong Kong stock debut, targets AI expansion

    Victory Giant Technology, a China-based PCB maker and Nvidia supply chain partner, debuted on the Hong Kong Stock Exchange on April 21,...

    Wednesday 22 April 2026
    Powerchip returns to profitability in 1Q26 following fab sale to Micron
    Powerchip Semiconductor Manufacturing (PSMC) reported revenue of NT$13.57 billion (approx. US$432 million) in the first quarter of 2026, up 6% from the previous quarter and 22% year...
    Tuesday 21 April 2026
    APAC advances CPO positioning: ELSFP beings small-volume shipments, in-house COC line set for 3Q26 completion
    Optical communications company APAC Opto Electronics reported that its inventory digestion phase is nearing completion, with market demand showing a clear rebound. Looking ahead to...
    Tuesday 21 April 2026
    Semiconductor materials supply shifts to risk sourcing under price and geopolitical pressure
    In 2026, critical semiconductor materials face a perfect storm of rising prices, shortages, and geopolitical disruption. Lead times for multilayer ceramic capacitors (MLCCs) and power...
    Tuesday 21 April 2026
    Foxconn Industrial Internet to mass-produce CPO all-optical switches in 3Q26 with over 10,000 units target
    Brand Cheng, chairman of Foxconn Industrial Internet (FII), a cloud networking business under Foxconn, recently announced ongoing advancements in technologies, including co-packaged...
    Monday 20 April 2026
    AI chip rivalry escalates: ABF substrate sells out for Unimicron, Kinsus, Nan Ya PCB
    AI GPUs, CPUs, and ASICs are driving demand for increasingly larger sizes and higher layer counts in substrate technology. The supply-demand gap for high-end ABF substrates continues...
    Monday 20 April 2026
    Zhen Ding plans Hong Kong listing for subsidiary to boost global IC substrate presence
    Printed circuit board (PCB) giant Zhen Ding Technology held a board meeting on April 17 and approved plans for its subsidiary, Leading Interconnect Semiconductor Technology (LIST),...
    Monday 20 April 2026
    Taiyo Yuden raises MLCC prices, Murata takes the lead, Samsung to follow suit
    Japanese electronic components maker Taiyo Yuden recently issued a price increase notice, announcing that it will raise prices on some products starting in May, specifically in the...
    Sunday 19 April 2026
    Corning leads glass substrate race as South Korea's KCC and LX Glass face steep challenges
    Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...
    Sunday 19 April 2026
    ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries
    AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
    Saturday 18 April 2026
    VLSI TSA 2026 explores quantum architecture and AI healthcare innovations
    The 2026 International Symposium on VLSI Technology, Systems and Applications (VLSI TSA) kicked off on April 14, gathering over 800 semiconductor professionals worldwide. The conference...
    Saturday 18 April 2026
    bEMC advances Micro LED optical transmission with key POC validation
    The surge in AI data center demand is rapidly accelerating the need for high-speed data transmission, prompting LED manufacturers to target opportunities in optical communications...
    Friday 17 April 2026
    MLCC, inductor prices climb as AI demand meets cost pressure
    Global passive component prices are rising, led by Japanese suppliers, with the trend spreading across China and Taiwan. Higher raw material costs and AI-driven demand are tightening...
    Friday 17 April 2026
    Topoint bond deal signals wider supply risk for global AI hardware makers
    The surge in AI-grade high-speed computing is pushing printed circuit board manufacturing toward thicker, higher-layer designs, creating a strategic, global shortage of advanced coated...
    Friday 17 April 2026
    Tongfu Microelectronics profit jumps on AI chip packaging, AMD demand

    Tongfu Microelectronics posted strong 2025 results, supported by AI and automotive chip demand, while reinforcing its position in the...

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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook