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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Wednesday 16 September 2026
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
Wednesday 16 September 2026
Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs

Global cloud service providers are continuing to expand AI infrastructure, driving a surge in demand for high-frequency, high-speed...

Wednesday 16 September 2026
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
Wednesday 16 September 2026
Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...
Wednesday 16 September 2026
FSC teams with South Korean maker on TGV equipment for glass substrates
Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
Wednesday 16 September 2026
A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors
High-end multilayer polymer capacitors (MLPCs) — increasingly critical to power delivery in AI servers and high-wattage GPUs and CPUs — have historically been dominated...
Wednesday 16 September 2026
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
Tuesday 15 September 2026
Murata considers bigger MLCC expansion as AI server demand extends beyond 2028

Murata Manufacturing is considering a new, potentially larger expansion of multilayer ceramic capacitor (MLCC) capacity beyond its existing...

Tuesday 15 September 2026
AI servers are eating MLCC capacity, Chinese suppliers are taking what's left

AI servers are reshaping the global multilayer ceramic capacitor (MLCC) market. Murata Manufacturing and Samsung Electro-Mechanics (SEMCO)...

Tuesday 15 September 2026
Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

Tuesday 15 September 2026
AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows
Taiwan's copper-clad laminate (CCL) makers significantly outpaced printed circuit board (PCB) and IC substrate suppliers in August, as stronger server demand, pricing and product-mix...
Tuesday 15 September 2026
Chinese chip tools reach 35% of equipment installed at local fabs
Chinese-made semiconductor equipment accounted for roughly 35% of tools installed at fabs in China in 2025, up from about 25% a year earlier, as domestic suppliers gain ground in key...
Tuesday 15 September 2026
Inside CIOE: takeaways from China's biggest optoelectronics show
Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE),...