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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Thursday 2 July 2026
GIS pivots to semiconductors and optics as memory shortages hit touch demand

Touch module maker General Interface Solution Holding (GIS) said the second half of 2026 will be more challenging as global memory...

Thursday 2 July 2026
GaAs and InP price hikes hit Taiwan supply chain
Compound semiconductor epitaxy makers are raising prices again for gallium arsenide (GaAs) and indium phosphide (InP) epi wafers, as persistent raw material cost increases, supply...
Wednesday 1 July 2026
Yageo chairman takes control of Anpec board
After Yageo confirmed its stake in Taiwanese power management IC maker Anpec, attention has turned to whether the group will deepen its involvement in Anpec's operations as part of...
Wednesday 1 July 2026
Yageo to raise capacitor prices, extending AI cost pressure to EMS and OEM customers
Leading passive components supplier Yageo is reportedly set to raise capacitor prices across the board from July 1, according to supply chain sources. The price hikes will cover tantalum...
Wednesday 1 July 2026
AI fuels OSAT pricing power as chip packaging orders fill through 2027
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since...
Wednesday 1 July 2026
AI chip complexity stretches electronic materials order windows to six months, DuPont spinoff warns

As the AI wave drives rapid growth across the global semiconductor industry, the upstream electronic materials supply chain has become...

Wednesday 1 July 2026
LCD TV panel makers face a softer peak season as demand weakens and costs climb
Liquid-crystal-display (LCD) TV panel makers face a muted peak season in the second half of 2026, as weaker demand, rising material costs, and looser supply-demand conditions put pressure...
Wednesday 1 July 2026
SK Hynix talent hunt targets HBM's next frontiers while drawing Samsung employees' attention

SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than...

Tuesday 30 June 2026
Ability Opto-Electronics targets CPO growth with V-groove and MT lines

Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged...

Tuesday 30 June 2026
Samsung Electro-Mechanics targets AI server growth with MLCC talks, substrate push

Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for...

Tuesday 30 June 2026
Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes

As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals...

Monday 29 June 2026
Kyocera to invest JPY650 billion in chip equipment and data center components

Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment...

Monday 29 June 2026
Niching targets higher margins as heat spreader orders extend through year-end
Advanced packaging is driving demand for heat spreaders, and semiconductor packaging and testing materials supplier Niching Industrial said its acquisition of Ming Chun Yuan Micro...
Monday 29 June 2026
Infineon counters Innoscience claim after China GaN patent setback
Infineon and Innoscience are locked in a global legal battle over alleged infringement involving gallium nitride (GaN) technology, with courts across multiple jurisdictions becoming...
Sunday 28 June 2026
LG Chem weighs CCL expansion as AI chip demand strains supply

LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as...