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    OpenClaw downloads eclipse Linux's 30-year reach in three weeks, Nvidia CEO flags AI agent surge
    1min ago
    Asus and Foxconn lead Taiwan's AI City National Team as Middle East conflict escalates
    22min ago
    Oracle says AI will augment, not kill, enterprise SaaS
    32min ago
    China leads nuclear power revival as US and Europe talent and supply chain gaps widen
    Mar 10, 19:54
    Japanese automakers reintroduce US-spec left-hand drive cars to domestic market amid trade tensions
    Mar 10, 19:54
    Samsung's Taylor fab to focus on HPC and automotive chips, foundry clients rise to 121
    Mar 10, 19:54
    Nvidia conducted final verification visits to Samsung's Cheonan packaging plant for HBM4 supply
    Mar 10, 19:54
    Sercomm expects memory shortages and price hikes to last until end of 2026
    Mar 10, 19:54
    OpenClaw surge drives Mac mini shortage in China with high computing costs
    Mar 10, 19:40
    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Tuesday 3 March 2026
    Fulltech plans THB3.1 billion Thailand plant to support CCL southward shift
    Taiwan-based Fulltech Fiber Glass (FFG) said it approved a capex plan via its Thailand subsidiary to build a new plant with about THB3.1 billion (approx. US$99 million) in investment,...
    Monday 2 March 2026
    Daxin Materials eyes 30% revenue growth in key raw materials by 2026
    Daxin Materials achieved strong gains in semiconductor materials in 2025, expanding its product lineup to 12 items. The company plans to introduce three to five new products in 2026,...
    Monday 2 March 2026
    Rohm integrates TSMC GaN process to scale production and meet AI server demand by 2027
    Rohm has reached an agreement to integrate its internal development and manufacturing capabilities for gallium nitride (GaN) power devices with process technology from Taiwan Semiconductor...
    Friday 27 February 2026
    Taiwan's patent race heats up: TSMC reigns, records tumble
    Taiwan's innovation engine ran hot in 2025. The Taiwan Intellectual Property Office (TIPO) announced on February 26, 2026, that Taiwan Semiconductor Manufacturing Company (TSMC) topped...
    Friday 27 February 2026
    Yageo sees strong 1Q26 on AI orders; memory shortage yet to hit demand

    Yageo CEO David Wang said that although seasonal factors reduced working days from the previous quarter, capacity utilization is expected...

    Thursday 26 February 2026
    AI server surge lifts high-voltage MOSFET, fan demand at Taiwan power device maker APEC

    Advanced Power Electronics Co. (APEC) said high-power AI servers are driving demand for medium- and high-voltage power devices, and expects...

    Thursday 26 February 2026
    Taiwan Mask posts nearly NT$100m profit in January, advanced packaging to boost revenue in 2H26
    Benefiting from its group integration strategy, Taiwan Mask Corporation (TMC) is seeing operations that are gradually recovering. The parent company's core business has seen five consecutive...
    Thursday 26 February 2026
    Fiberglass shortage persists in 2026, Unimicron increases substrate price
    As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly...
    Thursday 26 February 2026
    Yageo posts 82% profit jump in 4Q25 on AI-driven product mix
    Taiwanese passive component giant Yageo reported a strong operational rebound in the fourth quarter of 2025, driven by continued growth in demand related to artificial intelligence...
    Wednesday 25 February 2026
    Unimicron names UMC's SC Chien chair in substrate strategy shift
    Unimicron held an investor conference on 25 February 2026. A day earlier, its board approved the appointment of UMC co-president SC Chien as chairman and group chief strategy officer...
    Wednesday 25 February 2026
    Chart: Why Taiwan's OSAT sector just flipped the switch

    The latest January revenue data for Taiwan's Outsourced Semiconductor Assembly and Test (OSAT) sector—disclosed this month—confirms...

    Wednesday 25 February 2026
    Unimicron's 4Q25 profit surpasses combined earnings of first 3 quarters; 2026 capex raised to NT$34 billion
    Given the steady demand for AI and high-performance computing (HPC) chips, Unimicron stated that orders for IC substrates and PCBs have picked up. This has not only steadily increased...
    Wednesday 25 February 2026
    Walsin Technology boosts Matsuo Electric stake to expand product lines
    Walsin Technology Corporation announced plans to invest JPY508 million (US$3.27 million) to increase its shareholding in Japan's Matsuo Electric, a move the passive components maker...
    Wednesday 25 February 2026
    MLCC prices to climb as AI demand hits full capacity
    The global multilayer ceramic capacitor (MLCC) market is on the brink of a price surge as Japanese and Korean giants grapple with record demand from AI data centers. Samsung Electro-Mechanics...
    Wednesday 25 February 2026
    ASE accelerates panel-level packaging push with fully automated 310mm line by 2026
    AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...
    2/46 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook