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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Wednesday 16 July 2025
Samsung, S&S Tech advance EUV mask localization to reduce reliance on Japan's Hoya
Samsung Electronics is accelerating efforts to localize the production of extreme ultraviolet (EUV) blank masks in South Korea through a collaboration with domestic partner S&S...
Wednesday 16 July 2025
Taiwan's PCB supply chain gains momentum as AI & ASIC server shipments surge
AI server GB200 has begun volume shipments, and cloud service providers (CSPs) are ramping up demand for servers equipped with their own ASICs. Despite reciprocal tariffs and New...
Wednesday 16 July 2025
Lee Jae-yong’s global sprint: Samsung chair courts partnerships in US, China, and Japan

Samsung Electronics Executive Chairman Lee Jae-yong returned to South Korea on July 14 following a whirlwind trip to the exclusive Sun...

Tuesday 15 July 2025
Nvidia caught between Washington's warnings and Beijing's welcome
As US-China tech tensions deepen, Nvidia CEO Jensen Huang has once again found himself at the center of a geopolitical storm — this time, not for launching a groundbreaking...
Tuesday 15 July 2025
US tariffs disrupt China's PCB expansion plans in Thailand
China has hit a roadblock in its printed circuit board (PCB) industry on its way to expand to Southeast Asia. Starting on August 1, 2025, the US will impose tariffs of up to 36% on...
Monday 14 July 2025
Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation...

Sunday 13 July 2025
Top Bright's 1+3 strategy drives growth as HVLP5+ copper foil set for 4Q25 mass production
The stability of the weighing scale market and increasing investment in its new materials business have allowed Top Bright to yield positive results. During the company's earnings...
Friday 11 July 2025
Niching sees stellar 2Q25 results from AI, HPC, and advanced packaging applications
Materials supplier Niching is aiming to hit record-high revenue this year after strong performance in the first half of 2025, boosted by continued growing demand in the AI, high performance...
Friday 11 July 2025
Innolux completes management overhaul as plant closure accelerates
Taiwan's Innolux has completed a senior management restructuring following the departure of key executives, with the company accelerating plans to close its fifth-generation display...
Friday 11 July 2025
Advanced packaging crisis hits as Asahi Kasei halts PSPI supply
Risks continue emerging one after another as the supply shortage of essential advanced packaging materials from Japan's chemical giant Asahi Kasei continues to escalate.
Thursday 10 July 2025
Mixed outlook for substrate market in 2H25: Price hikes mainly reflect rising costs
As the calendar moves into the second half of 2025, the traditional consumer peak season is gradually unfolding. The market expects that due to continuous increases in operating costs...
Thursday 10 July 2025
Stay or relocate: Taiwan makers weigh exodus amid weak government support
The free trade agreement (FTA) between the US and South Korea has now become irrelevant under Donald Trump's administration. Taiwan's tech products also face the possibility of losing...
Thursday 10 July 2025
Yageo-Shibaura merger talks shift to Taipei, signaling strategic pivot in acquisition push
Taiwan-based passive component manufacturer Yageo Corporation is advancing its bid to acquire Japan's Shibaura Electronics following multiple deadline extensions and a surprise bid...
Thursday 10 July 2025
Phison 2Q25 revenue hits record as NAND controller shipments surge
NAND flash manufacturers have been implementing production cuts, leading to urgent orders to surge and leaving a supply shortage for NAND controllers. Phison CEO K.S. Pua explained...
Wednesday 9 July 2025
South Korea's Hana cracks TGV glass substrate market with eye on AI chip boom
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...