News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Tuesday 1 September 2026

India expands chip ambitions with full Semicon 2.0 notification

India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...

Tuesday 1 September 2026

Taiwan's G2C+ Alliance members target global markets

Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...

Tuesday 1 September 2026

Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts

Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...

Tuesday 1 September 2026

Acme sees years of SiC growth as data center demand builds

Capex by the world's nine largest cloud service providers (CSPs) is expected to rise about 90% year over year in 2026, while AI servers are growing faster than conventional servers,...

Tuesday 1 September 2026

Kaimei sees 2H26 momentum strengthen as AI demand lifts orders and resistor price hikes take effect

Kaimei Electronics, a Yageo Group company, said order visibility remains strong for the second half of 2026 as AI server demand continues to ramp and automotive and industrial-control...

Monday 31 August 2026

Unimicron search puts spotlight on cross-border manufacturing for Taiwan's electronics sector

Unimicron, a major Taiwanese IC substrate maker, came under intense supply chain scrutiny last week after reports that prosecutors and investigators searched the company over a suspected...

Monday 31 August 2026

Unimicron stock prices fall 10% daily limit, says origin probe covers PCBs, not substrates

Unimicron Technology shares plunged to Taiwan's 10% daily downside limit on August 31, the first trading session after prosecutors disclosed...

Monday 31 August 2026

Kingboard Laminates raises prices again as CCL shortages deepen

Kingboard Laminates, a leading Chinese copper-clad laminate (CCL) maker, has issued another price increase notice as shortages of core materials such as fiberglass cloth and copper...

Monday 31 August 2026

South Korea risks 'HBM 2.0' trap in emerging CPO market

Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...

Monday 31 August 2026

China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

Saturday 29 August 2026

Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM

The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...

Friday 28 August 2026

Update: ABF substrate maker Unimicron searched in origin-labeling probe

(The latest status of the probe as of August 29th is updated below.)

Friday 28 August 2026

Long-term contracts tie up InP capacity due to data center optics demand

Compound semiconductor supply-chain players say China has recently eased some substrate export controls, but the upgrade of high-frequency transmission in AI data centers toward 200G...

Thursday 27 August 2026

HBM hybrid bonding delayed by 300°C heat and CMP dishing

As high-bandwidth memory (HBM) stack counts continue to rise, the industry originally anticipated that hybrid bonding (HB), a next-generation packaging solution, would be officially...

Thursday 27 August 2026

Doosan thins memory-package CCL insulation to 13µm

Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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