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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 13 April 2026
Global chip sales expect to top US$1 trillion in 2026 on AI demand

Taiwan's semiconductor supply chain posted stronger-than-expected results in the first quarter of 2026, as artificial intelligence (AI)...

Monday 13 April 2026
Weekly news roundup: Shortages spread to MLCCs; SK Hynix reportedly in talks with Microsoft and Google
Below are the most-read DIGITIMES Asia stories from the week of April 6-April 13, 2026:
Monday 13 April 2026
TPK and ASE to launch advanced semiconductor TGV packaging with 3Q26 pilot line
Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates...
Monday 13 April 2026
Nan Pao posts record March and 1Q26 revenue driven by semiconductors and new products
Nan Pao Resins Chemical Group reported a historic revenue high for March, reaching NT$2.4 billion (approx. US$75.3 million), up 17.4% year-over-year, fueled by raw material price fluctuations...
Saturday 11 April 2026
BenQ Materials expands into semiconductor processes, targets advanced nodes

BenQ Materials is expanding into semiconductor materials, with president Ray Liu saying the company has entered CMP cleaning brush rollers...

Friday 10 April 2026
Eclat Forever Machinery secures large IC substrate orders with visibility to 2027
High-end ABF substrate wet process equipment maker Eclat Forever Machinery (EF) announced that, driven by clear expansion momentum from domestic IC substrate customers, capital expenditures...
Friday 10 April 2026
Cmsemicon seeks suppliers to expand MCU production as supply tightness remains primary limitation
Shenzhen China Micro Semicon (Cmsemicon) chairman and general manager Yang Yong announced that the microcontroller unit (MCU) market is gradually recovering and that prices are gradually...
Friday 10 April 2026
Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...
Friday 10 April 2026
Demand for AI infrastructure spreads shortages beyond memory chips to MLCCs

As global corporations accelerate spending on artificial intelligence (AI) infrastructure, supply constraints are no longer limited to...

Friday 10 April 2026
AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth
AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...
Thursday 9 April 2026
Transcend posts record March sales, 1Q26 revenue hits nearly 80% of 2025
Memory module maker Transcend reported a new monthly revenue high in March 2026 of NT$5.7 billion (approx. US$178.8 million), up 78.6% month-over-month and 3.8 times year-over-year...
Thursday 9 April 2026
AI chip demand tightens ABF substrate supply, three-year upcycle in sight
As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously,...
Wednesday 8 April 2026
Taiwan's Zhen Ding projects AI-driven surge as next-gen platforms hit production

Looking ahead, Taiwan's printed circuit board giant Zhen Ding Technology expects a strong growth trajectory beginning in the second quarter,...

Wednesday 8 April 2026
Rising gallium costs force price increases across GaAs chip supply chain

Prices for gallium arsenide (GaA) substrates — a key material used in power amplifiers for wireless communications — are rising,...

Wednesday 8 April 2026
Analysis: ASML earnings preview; SK Hynix and TeraFab already facing EUV capacity difficulties
Compared to short-term geopolitical turbulence, the AI megatrend represents a once-in-a-generation business opportunity. In the past, TSMC often took the lead during earnings season...