Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products...

Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for...

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization...

The AI boom is tightening an important but often overlooked part of the chip supply chain, with global readers likely to feel the effects...