To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
China's 6-inch silicon carbide (SiC) substrate market is undergoing a structural supply-demand reversal. Driven by strengthening downstream demand and limited production restarts,...
Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...
Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public...
Samsung Electro-Mechanics (SEMCO) is set to expand the scope of its price increases, with market reports saying the company will raise direct-supply prices for multilayer ceramic capacitors...
Exhibiting in the AI Technology Zone at Semicon Taiwan 2026, Zhen Ding Technology (ZDT) Group highlights two core product lines: 800G, 1.6T, XPO, and NPO high-end optical transceiver...
Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...
Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...
Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC...
Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global manufacturing footprint. Its Japan plant is expected to complete...
Samsung Electro-Mechanics disclosed on September 1 that it has concluded a single sales and supply contract worth KRW1.072 trillion (about US$778.9 million) for MLCCs, equal to 9.5%...
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
