Passive component manufacturer Yageo said robust AI demand is driving shipments of multilayer ceramic capacitors (MLCCs) and tantalum capacitors, pushing AI-related applications to...
Semiconductor epitaxy maker Episil-Precision said a localized fire broke out on October 28 at its plant on Innovation First Road in Hsinchu Science Park, but caused no injuries or...
The Taiwan Semiconductor Industry Association (TSIA) expects its members' total output to exceed NT$9.1 trillion (US$279.5 billion) in 2026, a 40.9% year-over-year increase driven...
AI is driving strong demand for silicon photonics, but LandMark Optoelectronics' planned sixfold capacity expansion over two years still falls short of customer requirements. The optical...
A fire broke out at the Innovation Plant of semiconductor epitaxial wafer maker Episil on October 28. The extent of equipment damage, the scope of production stoppages, and the recovery...
Global server CPU shipments are projected to surpass the 50 million-unit milestone for the first time in 2027, reaching 52.6 million units as demand accelerates alongside the industry-wide...
As Nvidia introduces a new generation of AI chips each year, gains in computing performance are driving increasingly demanding thermal management requirements.
Applications for silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding across the electronics industry, affecting not only component selection but also product...
Samsung Electro-Mechanics (SEMCO) told investors on October 28 that long-term agreements are expected to account for more than 60% of its multilayer ceramic capacitor (MLCC) revenue...
Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking...
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...
Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain as surging AI and high-performance computing...
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion...
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
