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    NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
    Friday 24 April 2026
    MCU supplier Artery weighs price hikes on AI capacity squeeze, new applications drive growth

    Microcontroller supplier Artery Technology (Arterytek or Arterychip) delivered a strong start to 2026, posting first-quarter consolidated...

    Thursday 23 April 2026
    Zhen Ding will build 10 new factories for global expansion
    Taiwan-based PCB maker Zhen Ding Tech has stated that as customers' next-generation product platforms gradually enter mass production starting from the second quarter of 2026, its...
    Thursday 23 April 2026
    Zhen Ding breaks ground on new China site; Zhongji Innolight chairman attends to show support
    Taiwanese printed circuit board (PCB) giant Zhen Ding Technology Group held a groundbreaking ceremony for the HD Campus of the "Zhen Ding Technology Group Huai'an Tech City" in Huai'an,...
    Wednesday 22 April 2026
    Powerchip DRAM foundry price hike to boost June revenue; IPD to drive Intel demand in 2H27
    Powerchip Semiconductor Manufacturing (PSMC) held an earnings call on April 21 to address developments in memory and logic foundry services, as well as its future business outlook...
    Wednesday 22 April 2026
    ASM International reports 16% growth in 1Q26 revenue driven by booming AI market
    ASM International reported a high revenue in the first quarter of 2026, driven by surging AI demand and its need for advanced...
    Wednesday 22 April 2026
    Nvidia-linked Chinese PCB maker jumps on Hong Kong stock debut, targets AI expansion

    Victory Giant Technology, a China-based PCB maker and Nvidia supply chain partner, debuted on the Hong Kong Stock Exchange on April 21,...

    Wednesday 22 April 2026
    Powerchip returns to profitability in 1Q26 following fab sale to Micron
    Powerchip Semiconductor Manufacturing (PSMC) reported revenue of NT$13.57 billion (approx. US$432 million) in the first quarter of 2026, up 6% from the previous quarter and 22% year...
    Tuesday 21 April 2026
    APAC advances CPO positioning: ELSFP beings small-volume shipments, in-house COC line set for 3Q26 completion
    Optical communications company APAC Opto Electronics reported that its inventory digestion phase is nearing completion, with market demand showing a clear rebound. Looking ahead to...
    Tuesday 21 April 2026
    Semiconductor materials supply shifts to risk sourcing under price and geopolitical pressure
    In 2026, critical semiconductor materials face a perfect storm of rising prices, shortages, and geopolitical disruption. Lead times for multilayer ceramic capacitors (MLCCs) and power...
    Tuesday 21 April 2026
    Foxconn Industrial Internet to mass-produce CPO all-optical switches in 3Q26 with over 10,000 units target
    Brand Cheng, chairman of Foxconn Industrial Internet (FII), a cloud networking business under Foxconn, recently announced ongoing advancements in technologies, including co-packaged...
    Monday 20 April 2026
    AI chip rivalry escalates: ABF substrate sells out for Unimicron, Kinsus, Nan Ya PCB
    AI GPUs, CPUs, and ASICs are driving demand for increasingly larger sizes and higher layer counts in substrate technology. The supply-demand gap for high-end ABF substrates continues...
    Monday 20 April 2026
    Zhen Ding plans Hong Kong listing for subsidiary to boost global IC substrate presence
    Printed circuit board (PCB) giant Zhen Ding Technology held a board meeting on April 17 and approved plans for its subsidiary, Leading Interconnect Semiconductor Technology (LIST),...
    Monday 20 April 2026
    Taiyo Yuden raises MLCC prices, Murata takes the lead, Samsung to follow suit
    Japanese electronic components maker Taiyo Yuden recently issued a price increase notice, announcing that it will raise prices on some products starting in May, specifically in the...
    Sunday 19 April 2026
    Corning leads glass substrate race as South Korea's KCC and LX Glass face steep challenges
    Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...
    Sunday 19 April 2026
    ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries
    AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook