Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.
Both TSMC and UMC are expected to sustain full capacity utilization for 28nm manufacturing process at their 8-inch and 12-inch fabs throughout third-quarter 2021, with gross margins...
Japan-based IDM Renesas Electronics has been aggressively seeking support from its backend partners in Taiwan for next year to meet increasing demand for automotive MCUs and power...
Automotive OEMs, as well as first-tier suppliers, have seen their production disrupted by shortages of MCUs and other related ICs, according to industry sources.
International IDMs are keenly developing GaN-on-SiC RF and PA components to tap immense opportunities from communication applications, and Taiwan's III-V players including foundry...
Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...
NXP Semiconductors and TSMC have announced a collaboration agreement to adopt the latter's 5nm technology forthe former's next generation high-performance automotive platform.
The PC and handset supply chains are being hard hit by the ongoing coronavirus outbreak, but the server sector has been almost unscathed, as the epidemic has spurred stay-at-home...
Shenzhen Goodix Technology has reached a definitive agreement with NXP Semiconductors under which it will acquire all assets of NXP's voice and audio solutions (VAS) business, according...
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its innovative SpiStack dual-die NOR+NAND code storage product has...
NXP Semiconductor's Immersiv3D audio solution for the smart home market is expected to drive the growth in demand for home-use audio equipment thanks to its high cost-efficiency,...
As smart applications cannot overly rely on cloud computing, equipping edge devices with machine learning and computing capabilities is giving rise to new market demand, but what...
Marvell has entered into a definitive agreement under which NXP will acquire its Wi-Fi connectivity business in an all-cash, asset transaction valued at US$1.76 billion, according...
Renesas is reportedly moving toward a fab-lite business model by temporarily shutting down some frontend and backend fabs, with its Taiwan-based OSAT partners including ASE, Ardentec,...
Taiwan-based Ardentec is set to implement its expansion project in 2019, with the additional capacity to start generating revenues as early as the first quarter of 2020, according...
