Thursday 24 June 2021
Taiwan OSATs see car ICs demand promising for next 3-4 years
Taiwan-based OSATs and chip probing service providers are upbeat about backend demand for automotive chips over the next three to four years, as international IDMs such as Renesas...
Thursday 17 June 2021
Infineon, NXP strike long-term deals with Taiwan foundries
Automotive chip specialists Infineon and NXP have both struck long-term deals with Taiwan-based pure-play foundries, according to industry sources.
Tuesday 15 June 2021
Malaysia lockdown may affect capacity sufficiency at IDMs
The ongoing lockdown in Malaysia is posing new variables to capacity deployments at many international automotive IDMs, further fueling competitions between ICT and auto makers for...
Thursday 3 June 2021
New NXP automotive processors built using TSMC 16nm FinFET process
NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...
Monday 31 May 2021
Highlights of the day: NXP reportedly commits to UMC fab expansion project
The car industry, hit hard by chip shortages, has been scrambling for foundry capacity support. UMC's latest US$3.5 billion fab expansion project has already obtained pre-payment...
Monday 31 May 2021
New EV vendors fall behind in vying for foundry support
Most EV startups are expected to see their growth momentum dented by the increasing difficulty in obtaining foundry capacity support for chips they need, according to industry sour...
Monday 31 May 2021
NXP is yet another vendor striking long-term deal with UMC
NXP Semiconductors is another chip vendor which has struck a long-term deal with United Microelectronics (UMC) under which the pure-play foundry will have some of its newly-established...
Friday 21 May 2021
Taiwan at last mile to smart auto light market, says SAC CEO
Global business opportunities for smart auto lights are emerging rapidly, and Taiwan stands a good chance to benefit significantly as a major supply source if the semiconductor, optics...
Friday 22 January 2021
NXP to highlight 5G PA modules, Wi-Fi 6E SoCs in 2021
Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.
Monday 18 January 2021
TSMC, UMC to see full capacity utilization for 28nm node through 3Q21
Both TSMC and UMC are expected to sustain full capacity utilization for 28nm manufacturing process at their 8-inch and 12-inch fabs throughout third-quarter 2021, with gross margins...
Tuesday 8 December 2020
Renesas seeking support from Taiwan OSAT for auto components
Japan-based IDM Renesas Electronics has been aggressively seeking support from its backend partners in Taiwan for next year to meet increasing demand for automotive MCUs and power...
Tuesday 8 December 2020
Car vendors see production disrupted by IC shortages
Automotive OEMs, as well as first-tier suppliers, have seen their production disrupted by shortages of MCUs and other related ICs, according to industry sources.
Wednesday 14 October 2020
IDMs, III-V players gearing up for GaN-on-SiC RF, PA components
International IDMs are keenly developing GaN-on-SiC RF and PA components to tap immense opportunities from communication applications, and Taiwan's III-V players including foundry...
Tuesday 1 September 2020
USI obtains new SiP orders for Wi-Fi 6E modules
Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...
Monday 15 June 2020
NXP selects TSMC 5nm process for next-gen high performance automotive platform
NXP Semiconductors and TSMC have announced a collaboration agreement to adopt the latter's 5nm technology forthe former's next generation high-performance automotive platform.