Tuesday 16 November 2021
NXP, Ford collaborate for connected car
NXP Semiconductors has announced a collaboration with the Ford Motor to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including...
Monday 15 November 2021
IDMs focus on cybersecurity for automotive semiconductors
Cybersecurity is becoming increasingly important in autonomous vehicles (AV), as level 2 (L2) AVs become more widespread. Regional regulations and technological limitations are also...
Thursday 21 October 2021
Automotive IDMs to raise chip prices by 10-20% in 2022
Automotive IDMs have notified their clients about 10-20% price hikes for their chips starting 2022 as they continue to face mounting costs for raw materials, according to industry...
Friday 23 July 2021
Automotive IC IDMs in talks with OSATs about demand in 2022
First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...
Thursday 15 July 2021
Wafer probing houses see order visibility for car chips strenghtened
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
Monday 12 July 2021
Vendors of third-gen semiconductors enhance regional production, sales schemes
Vendors of third-generation semiconductors including GaN and SiC (silicon carbide) are stepping up regional production and marketing deployments to better explore immense demand for...
Tuesday 6 July 2021
NXP and Jio Platforms collaborate for 5G in India
NXP Semiconductors and Jio Platforms (JPL), a subsidiary of Reliance, have announced a collaboration to implement a 5G NR O-RAN small cell solution that incorporates NXP's Layerscape...
Thursday 24 June 2021
Taiwan OSATs see car ICs demand promising for next 3-4 years
Taiwan-based OSATs and chip probing service providers are upbeat about backend demand for automotive chips over the next three to four years, as international IDMs such as Renesas...
Thursday 17 June 2021
Infineon, NXP strike long-term deals with Taiwan foundries
Automotive chip specialists Infineon and NXP have both struck long-term deals with Taiwan-based pure-play foundries, according to industry sources.
Tuesday 15 June 2021
Malaysia lockdown may affect capacity sufficiency at IDMs
The ongoing lockdown in Malaysia is posing new variables to capacity deployments at many international automotive IDMs, further fueling competitions between ICT and auto makers for...
Thursday 3 June 2021
New NXP automotive processors built using TSMC 16nm FinFET process
NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...
Monday 31 May 2021
Highlights of the day: NXP reportedly commits to UMC fab expansion project
The car industry, hit hard by chip shortages, has been scrambling for foundry capacity support. UMC's latest US$3.5 billion fab expansion project has already obtained pre-payment...
Monday 31 May 2021
New EV vendors fall behind in vying for foundry support
Most EV startups are expected to see their growth momentum dented by the increasing difficulty in obtaining foundry capacity support for chips they need, according to industry sour...
Monday 31 May 2021
NXP is yet another vendor striking long-term deal with UMC
NXP Semiconductors is another chip vendor which has struck a long-term deal with United Microelectronics (UMC) under which the pure-play foundry will have some of its newly-established...
Friday 21 May 2021
Taiwan at last mile to smart auto light market, says SAC CEO
Global business opportunities for smart auto lights are emerging rapidly, and Taiwan stands a good chance to benefit significantly as a major supply source if the semiconductor, optics...