54 news items tagged nxp
NXP to highlight 5G PA modules, Wi-Fi 6E SoCs in 2021
Friday 22 January 2021Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.
TSMC, UMC to see full capacity utilization for 28nm node through 3Q21
Monday 18 January 2021Both TSMC and UMC are expected to sustain full capacity utilization for 28nm manufacturing process at their 8-inch and 12-inch fabs throughout third-quarter 2021, with gross margins...
Renesas seeking support from Taiwan OSAT for auto components
Tuesday 8 December 2020Japan-based IDM Renesas Electronics has been aggressively seeking support from its backend partners in Taiwan for next year to meet increasing demand for automotive MCUs and power...
IDMs, III-V players gearing up for GaN-on-SiC RF, PA components
Wednesday 14 October 2020International IDMs are keenly developing GaN-on-SiC RF and PA components to tap immense opportunities from communication applications, and Taiwan's III-V players including foundry...
USI obtains new SiP orders for Wi-Fi 6E modules
Tuesday 1 September 2020Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...
NXP selects TSMC 5nm process for next-gen high performance automotive platform
Monday 15 June 2020NXP Semiconductors and TSMC have announced a collaboration agreement to adopt the latter's 5nm technology forthe former's next generation high-performance automotive platform.
Server sector unscathed by coronavirus outbreak
Thursday 5 March 2020The PC and handset supply chains are being hard hit by the ongoing coronavirus outbreak, but the server sector has been almost unscathed, as the epidemic has spurred stay-at-home...
Goodix to acquire NXP voice and audio solutions biz
Tuesday 20 August 2019Shenzhen Goodix Technology has reached a definitive agreement with NXP Semiconductors under which it will acquire all assets of NXP's voice and audio solutions (VAS) business, according...
Space-saving Winbond NOR+NAND dual-die memory chip now supports NXP Layerscape LS1012A
Thursday 8 August 2019Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its innovative SpiStack dual-die NOR+NAND code storage product has...
NXP Immersiv3D audio solution to spur sales of home acoustic systems
Tuesday 4 June 2019NXP Semiconductor's Immersiv3D audio solution for the smart home market is expected to drive the growth in demand for home-use audio equipment thanks to its high cost-efficiency,...
Edge computing can maximize AI operation efficiency, says NXP executive
Monday 3 June 2019As smart applications cannot overly rely on cloud computing, equipping edge devices with machine learning and computing capabilities is giving rise to new market demand, but what...
NXP to acquire Marvell Wi-Fi connectivity business
Friday 31 May 2019Marvell has entered into a definitive agreement under which NXP will acquire its Wi-Fi connectivity business in an all-cash, asset transaction valued at US$1.76 billion, according...
Renesas migration to fab-lite model to benefit Taiwan OSAT firms
Thursday 18 April 2019Renesas is reportedly moving toward a fab-lite business model by temporarily shutting down some frontend and backend fabs, with its Taiwan-based OSAT partners including ASE, Ardentec,...
NXP launches new radar solution
Thursday 4 October 2018NXP Semiconductors has expanded its radar ecosystem with an automotive radar solution that combines its S32R processors, RF transceiver and antenna design on a new reference platfo...
Stay focused: Q&A with NXP executive Steve Owen
Tuesday 18 September 2018NXP Semiconductors has gone through several periods of restructuring since its departure from Philips, followed by privatization, and mergers and acquisitions. Steve Owen, executive...
NXP, FII partners on IIoT
Friday 7 September 2018NXP Semiconductors will provide Foxconn Industrial Internet (FII) with its iIndustrial Internet of Things (IIoT) platform solutions and technical support., according to an MOU signed...
NXP acquires OmniPHY to accelerate autonomous driving and vehicle networks
Wednesday 5 September 2018NXP Semiconductors has disclosed it has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. OmniPHY's expertise includes automotive Ethernet, a technology that...
AI-based xPUs proliferating as new growth driver for IC supply chains
Thursday 19 July 2018With the advent of the 5G era, artificial intelligence (AI) applications will be in full swing, prompting chipmakers to develop multiple xPU chips beyond Intel's CPU and Nvidia's...
Automotive IC market to top US$40 billion in 2018, says Digitimes Research
Thursday 29 March 2018The global market scale for automotive semiconductors is estimated to surpass US$40 billion in 2018 after surging 11% on year to US$35.7 billion in 2017 from US$32.2 billion, according...
Qualcomm enters into amended definitive agreement with NXP
Wednesday 21 February 2018Qualcomm has announced that Qualcomm River Holdings, an indirect wholly-owned subsidiary of Qualcomm, has reached an agreement with NXP Semiconductors to increase to US$127.50 per...
Higher-end MOSFET chip prices may stay put in 1Q18
Tuesday 23 January 2018With the global PC market entering the traditional slow season and demand from China's automotive electronics market turning weak, medium- to high-power MOSFET chips have seen shipment...
Automotive MCU market to see 3% CAGR for 2017-2021, says Digitimes Research
Wednesday 3 January 2018Thanks to the growing development of smart and autonomous vehicles, the global market demand for automotive microcontrollers (MCU) is estimated to expand at a CAGR of 3% during 2017-2021,...
NXP pushing partnerships with China developers
Thursday 14 December 2017NXP Semiconductors has announced a strategic partnership with Alibaba Cloud, the cloud computing and business unit of Alibaba Group. The two companies are working together to enable...
Taiwan IC packagers eyeing auto chip orders from IDMs
Friday 8 December 2017As the automotive-use chip sector is emerging as a new niche market with great development potential, Taiwan IC packaging and testing service providers are gearing up to scramble...
Power chip packager GEM sees record revenues for 4Q17
Thursday 7 December 2017Taiwan power semiconductor packaging and testing specialist GEM Services is expected to see its revenues for the fourth quarter of 2017 hit a new quarterly high of NT$800 million...