First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
Vendors of third-generation semiconductors including GaN and SiC (silicon carbide) are stepping up regional production and marketing deployments to better explore immense demand for...
NXP Semiconductors and Jio Platforms (JPL), a subsidiary of Reliance, have announced a collaboration to implement a 5G NR O-RAN small cell solution that incorporates NXP's Layerscape...
Taiwan-based OSATs and chip probing service providers are upbeat about backend demand for automotive chips over the next three to four years, as international IDMs such as Renesas...
The ongoing lockdown in Malaysia is posing new variables to capacity deployments at many international automotive IDMs, further fueling competitions between ICT and auto makers for...
NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...
The car industry, hit hard by chip shortages, has been scrambling for foundry capacity support. UMC's latest US$3.5 billion fab expansion project has already obtained pre-payment...
Most EV startups are expected to see their growth momentum dented by the increasing difficulty in obtaining foundry capacity support for chips they need, according to industry sour...
NXP Semiconductors is another chip vendor which has struck a long-term deal with United Microelectronics (UMC) under which the pure-play foundry will have some of its newly-established...
Global business opportunities for smart auto lights are emerging rapidly, and Taiwan stands a good chance to benefit significantly as a major supply source if the semiconductor, optics...
Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.
Both TSMC and UMC are expected to sustain full capacity utilization for 28nm manufacturing process at their 8-inch and 12-inch fabs throughout third-quarter 2021, with gross margins...
Japan-based IDM Renesas Electronics has been aggressively seeking support from its backend partners in Taiwan for next year to meet increasing demand for automotive MCUs and power...
