Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.

Both TSMC and UMC are expected to sustain full capacity utilization for 28nm manufacturing process at their 8-inch and 12-inch fabs throughout third-quarter 2021, with gross margins...

Japan-based IDM Renesas Electronics has been aggressively seeking support from its backend partners in Taiwan for next year to meet increasing demand for automotive MCUs and power...

International IDMs are keenly developing GaN-on-SiC RF and PA components to tap immense opportunities from communication applications, and Taiwan's III-V players including foundry...

Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...

NXP Semiconductors and TSMC have announced a collaboration agreement to adopt the latter's 5nm technology forthe former's next generation high-performance automotive platform.

The PC and handset supply chains are being hard hit by the ongoing coronavirus outbreak, but the server sector has been almost unscathed, as the epidemic has spurred stay-at-home...

Shenzhen Goodix Technology has reached a definitive agreement with NXP Semiconductors under which it will acquire all assets of NXP's voice and audio solutions (VAS) business, according...

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its innovative SpiStack dual-die NOR+NAND code storage product has...

NXP Semiconductor's Immersiv3D audio solution for the smart home market is expected to drive the growth in demand for home-use audio equipment thanks to its high cost-efficiency,...

As smart applications cannot overly rely on cloud computing, equipping edge devices with machine learning and computing capabilities is giving rise to new market demand, but what...

Marvell has entered into a definitive agreement under which NXP will acquire its Wi-Fi connectivity business in an all-cash, asset transaction valued at US$1.76 billion, according...

Renesas is reportedly moving toward a fab-lite business model by temporarily shutting down some frontend and backend fabs, with its Taiwan-based OSAT partners including ASE, Ardentec,...

NXP Semiconductors has expanded its radar ecosystem with an automotive radar solution that combines its S32R processors, RF transceiver and antenna design on a new reference platfo...

NXP Semiconductors has gone through several periods of restructuring since its departure from Philips, followed by privatization, and mergers and acquisitions. Steve Owen, executive...

NXP Semiconductors will provide Foxconn Industrial Internet (FII) with its iIndustrial Internet of Things (IIoT) platform solutions and technical support., according to an MOU signed...

NXP Semiconductors has disclosed it has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. OmniPHY's expertise includes automotive Ethernet, a technology that...

With the advent of the 5G era, artificial intelligence (AI) applications will be in full swing, prompting chipmakers to develop multiple xPU chips beyond Intel's CPU and Nvidia's...

The global market scale for automotive semiconductors is estimated to surpass US$40 billion in 2018 after surging 11% on year to US$35.7 billion in 2017 from US$32.2 billion, according...

Qualcomm has announced that Qualcomm River Holdings, an indirect wholly-owned subsidiary of Qualcomm, has reached an agreement with NXP Semiconductors to increase to US$127.50 per...

With the global PC market entering the traditional slow season and demand from China's automotive electronics market turning weak, medium- to high-power MOSFET chips have seen shipment...

Thanks to the growing development of smart and autonomous vehicles, the global market demand for automotive microcontrollers (MCU) is estimated to expand at a CAGR of 3% during 2017-2021,...

NXP Semiconductors has announced a strategic partnership with Alibaba Cloud, the cloud computing and business unit of Alibaba Group. The two companies are working together to enable...

As the automotive-use chip sector is emerging as a new niche market with great development potential, Taiwan IC packaging and testing service providers are gearing up to scramble...

Taiwan power semiconductor packaging and testing specialist GEM Services is expected to see its revenues for the fourth quarter of 2017 hit a new quarterly high of NT$800 million...