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NEWS TAGGED HBM
Wednesday 13 August 2025
Samsung bets big on DRAM overhaul to reclaim HBM crown
Samsung Electronics is doubling down on its bet to regain leadership in high-bandwidth memory (HBM), the ultra-fast chip architecture powering next-generation artificial intelligence...
Tuesday 12 August 2025
Micron reportedly trims China workforce, focusing on R&D and support functions
Micron Technology has reportedly launched a new round of layoffs in its China operations, starting August 11, 2025, affecting embedded research and development, testing, and technical...
Tuesday 12 August 2025
Micron raises outlook on strong DRAM pricing, AI demand
Micron Technology has lifted its guidance for the fourth quarter of fiscal 2025, citing improved memory pricing and robust execution, particularly in its DRAM business. The revised...
Monday 11 August 2025
AI memory revolution: Sandisk and SK Hynix define new standard for HBF
SK Hynix is partnering with flash memory manufacturer Sandisk to jointly promote the standardization of High Bandwidth Flash (HBF) technology. The two companies plan to leverage synergies...
Monday 11 August 2025
Taiwan chipmakers sidestep HBM giants with tailored edge-AI memory
Taiwanese memory chipmakers are intensifying efforts to capture growth in customized AI applications, unveiling low-power, high-bandwidth alternatives to High Bandwidth Memory (HBM)...
Monday 11 August 2025
Samsung, SK Hynix rush to secure Nvidia's SOCAMM supply chain — before it becomes the next HBM

After vying for leadership in the high-bandwidth memory (HBM) market, South Korea's top memory chipmakers, Samsung Electronics and SK...

Thursday 7 August 2025
Samsung denies HBM3E price-cut rumors amid Nvidia approval delay
Samsung Electronics has secured an order from Tesla for artificial intelligence (AI) chips, offering a renewed boost to its foundry business. However, the company continues to face...
Wednesday 6 August 2025
SK Hynix tops Samsung in 2Q25 on Nvidia-fueled HBM surge

SK Hynix overtook Samsung Electronics in global memory chip revenue for the first time in the second quarter of 2025, powered by its...

Tuesday 5 August 2025
Broadcom unveils Jericho4 at OCP Taipei, pushes Ethernet as backbone of next-gen AI infrastructure
Broadcom has unveiled Jericho4, its latest AI fabric router chip designed to connect geographically dispersed data centers, reinforcing the company's belief that Ethernet—not...
Monday 4 August 2025
Hanmi confident in securing all HBM4 equipment orders as half of 1H25 sales go to Taiwan
Benefiting from the development of the high-bandwidth memory (HBM) market, Hanmi Semiconductor's second quarter 2025 performance continues to hit new highs, with overseas markets...
Friday 1 August 2025
US sanctions stall CXMT's DRAM expansion, giving Samsung and SK Hynix breathing room
ChangXin Memory Technologies (CXMT), China's leading DRAM manufacturer, is under renewed pressure as the US escalates export controls on advanced chipmaking equipment. The tightened...
Friday 1 August 2025
Major IPC suppliers begin new certification; DDR4 price surge expected to last until late 2025
Leading memory manufacturers have successively announced end-of-life (EOL) plans for DDR4 DRAM, with memory module vendors reporting strong order momentum from end customers in the...
Thursday 31 July 2025
Samsung sees memory rebound, eyes HBM3E growth and 3Q25 price surge
Samsung Electronics experienced a rebound in its memory business during the second quarter of 2025, driven by AI-led demand and rising legacy DRAM prices. The company expects further...
Thursday 31 July 2025
Hanmi reportedly planning US$71 million hybrid bonding investment amid HBM surge
South Korea's Hanmi Semiconductor is reportedly planning to invest KRW100 billion (US$71.4 million) in hybrid bonding technology, with commercial equipment targeted for release by...
Thursday 31 July 2025
Samsung's Lee Jae-yong visits DC with US tariff negotiations ongoing, eyes further Texas investment
Samsung Electronics Chairman Lee Jae-yong recently made a spontaneous trip to Washington, DC, to assist South Korea in ongoing reciprocal tariff negotiations with the US. As AI semiconductors...