Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
Samsung Electronics announced at its shareholders' meeting that it is investing in the development of an AI accelerator, MACH-1, aiming to challenge Nvidia, and further revolutionize...
Samsung Electronics significantly expanded its DRAM market share in the fourth quarter of 2023, extending its lead over SK Hynix to 14 percentage points from a quarter earlier. While...
Samsung Electronics is reportedly pushing to establish an HBM development unit to increase Samsung's competitiveness in High-Bandwidth Memory (HBM). In other words, the recently formed...
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
Refuting a Reuters report citing five people stating that Samsung Electronics will apply Mass Reflow Molded Underfill (MR-MUF) technology, which is the process used by SK...
The Artificial Intelligence (AI) frenzy intensifies the competition for High Bandwidth Memory (HBM). A South Korean court recently approved an order application by SK Hynix to prohibit...
Wuhan Xinxin Semiconductor Manufacturing (XMC) reportedly has sent out an invitation to bid for a high-bandwidth memory (HBM) project. This suggests that the Chinese memory sector,...
Penetration of DDR5 in the memory market is poised to accelerate and reach double digits in the second half of 2024, thanks to demand from Generative AI (GenAI), according to market...
The DRAM market demand is picking up, and Samsung Electronics and SK Hynix, which previously adopted a production reduction strategy, have recently shown signs of resuming equipment...
