SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the...
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
The Trump administration has escalated its tech crackdown on China with a sweeping ban on Electronic Design Automation (EDA) software exports. On May 29, 2025, Synopsys, Cadence,...
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...
South Korean semiconductor equipment manufacturers are seeing a surge in demand from Chinese memory chipmakers, according to a report from Hankyung. ChangXin Memory Technologies...
China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK...
Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is...
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...
In response to intensified US export controls on advanced semiconductor shipments to China, major chipmakers Nvidia and AMD are reportedly adopting Samsung Electronics' GDDR7 graphics...
Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The...
In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to...
The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor...
ChangXin Memory Technologies (CXMT), China's top DRAM supplier, is reportedly preparing to phase out DDR4 products for server and PC use by mid-2026. As the company pivots to DDR5...
