Nvidia has launched its latest Rubin CPX GPU aimed at applications in the era of large-scale inference for AI. According to research firm SemiAnalysis, the launch represents a new...
As Nvidia raises the performance threshold for fourth-generation high-bandwidth memory (HBM4), reports suggest that Micron Technology may be struggling to meet these standards. Industry...
US export controls have capped the performance of Nvidia's "China-only" GPUs, opening the door for domestic chipmakers to compete. Huawei's Ascend roadmap, announced at its 2025 Connect...
Huawei unveiled its next-generation Ascend AI chip roadmap at the 2025 Connect summit, highlighting a milestone for China's semiconductor ambitions. Starting in early 2026, the Ascend...
Huawei is pressing ahead with its in-house chip and AI infrastructure strategy despite escalating US–China tech tensions. At Huawei Connect 2025 in Shanghai, deputy and rotating...
Global DRAM shipments saw their sharpest increase in nearly two years during the second quarter of 2025, solidifying SK hynix's lead over Samsung Electronics. The surge was driven...
In the first half of 2025, SK Hynix recorded the highest operating profit and the largest corporate tax payment among South Korean companies. The surge in demand for high-bandwidth...
Nvidia is preparing a potential shake-up in the AI semiconductor memory market with the introduction of its next-generation AI processor, Rubin CPX, which is designed for large-context...
SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial...
Nvidia has reportedly requested Samsung Electronics Co. to significantly expand its procurement of GDDR7 graphics memory, a move expected to enhance Samsung's memory business revenue...
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON...
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...
China's state-backed DRAM maker CXMT is rapidly advancing in high-bandwidth memory (HBM), a market long controlled by Samsung Electronics and SK Hynix. Citing SemiAnalysis, South...
