Rebellions, a rising South Korean AI chipmaker, has become a focal point in the rivalry between Samsung Electronics and SK Hynix as the two giants compete for leadership in next-generation...
South Korea's multi-chip packaging (MCP) exports continued to climb sharply in August 2025, with the share of high-bandwidth memory (HBM) exports to Taiwan steadily increasing.
While geopolitical tensions push many companies away from China, South Korean chip equipment maker Nextin is doubling down with a new factory in Wuxi, betting big on a market that...
Samsung Electronics and SK Hynix are reportedly pushing back plans to phase out DDR4 DRAM, extending production until 2026 after prices for the older chips surged past next-generation...
The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized"...
Yangtze Memory Technologies Corp. (YMTC), China's largest NAND flash producer, is expanding into the DRAM sector as part of Beijing's broader drive to compete in advanced memory markets...
SK Hynix is expected to retain more than half of the global high-bandwidth memory (HBM) market through at least 2027, cementing its role as Nvidia's top supplier while broadening...
South Korea-based optical wafer inspection equipment manufacturer Nextin has made strides in the high-bandwidth memory (HBM) segment, gaining traction after launching its dedicated...
China's drive for self-sufficiency in AI has taken a new turn with Huawei's launch of AI solid-state drives (SSDs), aimed at easing severe shortages of high-bandwidth memory (HBM)...
As artificial intelligence and high-performance computing continue to advance rapidly, high-bandwidth memory (HBM) paired with GPUs has become a critical battleground in the semiconductor...
Huawei is preparing to commercialize solid-state drives tailored for artificial intelligence, a move that industry analysts say could challenge the dominance of high-bandwidth memory...
The AI infrastructure arms race is escalating at an unprecedented pace. At Hot Chips 2025, Google unveiled more details about its next-generation TPU platform, Ironwood, and how it...
