Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
Samsung Electronics is transforming its Pyeongtaek Campus Line 4 (P4) in South Korea into a manufacturing base focusing on HBM4 production. Analysts indicate that Samsung is increasing...
Samsung Electronics reached a historic milestone as its market value exceeded KRW600 trillion (US$420 billion) for the first time, driven by a sharp rebound in the global memory market...
To meet the growing demand for HBM, SK Hynix is accelerating the construction of its DRAM production base, M15X plant in Cheongju, South Korea. According to Yonhap News and...
As demand for memory surges alongside the build-out of AI infrastructure and soaring data volumes from AI agents developed by OpenAI, Google, and others, consumption has spiked not...
LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The company plans to gradually localize production...
Longtime rivals Samsung Electronics and Hanmi Semiconductor may be wiping the slate clean and possibly teaming up after South Korea's 27th Semiconductor Exhibition (SEDEX...
HBM continues to be a critical resource as the AI boom is further tightening supply and demand in the memory industry. Memory leader Samsung Electronics is fixated on reclaiming its...
SK hynix Inc. announced today that it presented its next-generation NAND storage product strategy at the '2025 OCP (Open Compute Project) Global Summit', held in San Jose, California,...
High-bandwidth memory (HBM) has become the latest competitive front for global DRAM manufacturers. As Samsung, SK Hynix, and Micron gear up for HBM4 mass production in 2026, China's...
Samsung Electronics and SK Hynix unveiled their next-generation high-bandwidth memory (HBM4) at SEDEX 2025 in South Korea, marking Samsung's first public display of an HBM4 sample...
SK Hynix is positioned to thoroughly capitalize on the ongoing memory supercycle, driven by its superior DRAM technology and mass production capabilities, according to analysts.
Micron is joining the LPCAMM2 race dominated by Samsung and SK Hynix in the next-generation AI notebook memory market. Following the high-bandwidth memory (HBM) surge, the AI notebook...
