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NEWS TAGGED HBM
Thursday 22 May 2025
Nvidia CEO shows support for SK Hynix, praises 'beautiful' HBM4 at Computex 2025
Nvidia CEO Jensen Huang made a special visit to the SK Hynix booth at Computex 2025, leaving messages of support and showing the close cooperative relationship between the two comp...
Thursday 22 May 2025
From volume to value: Samsung retreats from legacy DRAM facing Chinese price war
Samsung Electronics has sharply reduced its memory chip production—by more than 100 billion units in a year—raising eyebrows across South Korea's tech industry. The unexpected...
Tuesday 20 May 2025
SK Hynix places orders for HBM equipment with Hanwha Semitech and Hanmi Semiconductor amid patent disputes
South Korean chip giant SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor,...
Tuesday 20 May 2025
Apple reportedly eyes major iPhone overhaul by 2027 as pressure of innovation grows
As Apple marks the 20th anniversary of the iPhone in 2025, the tech giant is preparing for sweeping technological upgrades to its flagship product—some of which may not fully...
Monday 19 May 2025
South Korea intercepts SK Hynix HBM China-bound tech leak
South Korean authorities arrested a former subcontractor employee at Incheon International Airport for allegedly attempting to smuggle SK Hynix's proprietary high-bandwidth memory...
Thursday 8 May 2025
AP Memory bets on next-gen wearables and AI chips to drive 2025 growth

AP Memory, a leading Taiwanese designer of specialty memory ICs and intellectual property (IP), said it remains optimistic about growth...

Thursday 8 May 2025
SK Hynix to end DDR4 production by 2Q26, sparks supply crunch
The two major South Korean DRAM manufacturers are each preparing to discontinue their older DDR4 production lines. Following Samsung Electronics' early April announcement of its end-of-life...
Tuesday 6 May 2025
SK Hynix-Hanmi Semiconductor dispute escalates, Hanwha Semitech poised to gain
A brewing conflict between SK Hynix and its long-time supplier, Hanmi Semiconductor, over thermal compression bonder (TC Bonder; TCB) equipment has intensified, potentially reshuffling...
Friday 2 May 2025
Samsung chip earnings nosedive 62%: HBM edge ceded to SK Hynix?
Samsung Electronics beat expectations in the first quarter of 2025, posting revenue of KRW79.1 trillion (US$55 billion) and operating profit of KRW6.7 trillion. However, its Device...
Wednesday 30 April 2025
Samsung reportedly exits HBM2E under Chinese price offensive, shifts focus to high-end market
Samsung Electronics is cutting production of mature-node DDR4 memory and reportedly scaling back its third-generation high-bandwidth memory (HBM2E) business to focus resources on...
Wednesday 30 April 2025
Made in America, delayed by parts
Taiwan's electronics manufacturing services (EMS) providers are accelerating their North American production plans in response to tariff threats, but component shortages and capacity...
Tuesday 29 April 2025
Samsung shifts focus to 3D DRAM in intensifying competition from SK Hynix and Chinese rivals
Samsung Electronics has reportedly decided to adopt Vertical Channel Transistor (VCT) DRAM as its core next-generation memory product, with plans to begin mass production within the...
Friday 25 April 2025
Exclusive: Google considers HBM3E supplier change
Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
Friday 25 April 2025
JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
Wednesday 23 April 2025
Hanmi reshapes South Korea's HBM arena, eyes Samsung alliance as SK Hynix ties fray
The South Korean semiconductor industry is abuzz with intrigue as Hanmi Semiconductor's once-ironclad relationship with SK Hynix frays over the supply of thermal compression bonders...