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    Taiwan prosecutors indict three over TSMC trade secret theft for overseas use
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    India turns US 50% tariff blow into reform push under Modi's leadership
    1h 3min ago
    Hesai wins CSRC approval for Hong Kong IPO after turning quarterly profit
    1h 21min ago
    Xiaomi and Gree competing fiercely over Chinese consumer electronic market
    Aug 27, 18:39
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    Aug 27, 18:37
    Broadcom open philosophy drives strategy amid nuanced Nvidia collaboration
    Aug 27, 17:59
    VMware targets private AI as next growth area following private cloud success
    Aug 27, 17:58
    After failed Siemens acquisition, what is BenQ's doing now?
    Aug 27, 17:58
    Micron CEO met with Samsung MX head to strengthen partnership for Galaxy series
    Aug 27, 17:58
    NEWS TAGGED HBM
    Wednesday 30 July 2025
    SK Hynix rewards generous bonuses, silence from Samsung
    Thanks to AI in generating robust revenues, SK Hynix has announced it would issue performance bonuses equivalent to 1.5 months' salary, but many employees are still pushing for more...
    Tuesday 29 July 2025
    LG makes semiconductor comeback with HBM Bet

    More than two decades after being pushed out of the chip industry, LG Electronics is making a surprise return—this time with its...

    Sunday 27 July 2025
    Missed connection with Nvidia haunts Samsung as Lee Jae-yong marks 1000 days of leadership
    Samsung Electronics Chairman Lee Jae-yong recently marked his 1,000th day in office, a tenure that Korean media describes as filled with challenges and crises. Even though Lee officially...
    Friday 25 July 2025
    SK Hynix accelerates investment for 2025 HBM boom as Samsung targets Nvidia certification in third quarter
    The surge in demand for high-bandwidth memory (HBM) driven by AI servers has positioned SK Hynix as the clear leader in the HBM market, with Micron also posting strong operational...
    Thursday 24 July 2025
    Samsung delays HBM4 rollout to 2026 due to yield challenges, all while SK Hynix strengthens lead in AI memory

    Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, signaling...

    Thursday 24 July 2025
    SK Hynix reassures on China fabs with stable VEU status amid US AI chip export easing
    SK Hynix addressed concerns about the potential impacts of tightening US export controls on its fabrication operations in China, adding no change in the company's validated end user...
    Thursday 24 July 2025
    SK Hynix optimistic on HBM demand amid AI growth, highlights next-gen DRAMs
    In SK Hynix's second-quarter earnings call, the company emphasized strong confidence in the sustained growth of HBM, driven by increasing AI workloads and emerging applications like...
    Thursday 24 July 2025
    SK Hynix rides DRAM wave, doubles down on HBM with capex boost
    SK Hynix reported second-quarter 2025 revenue of KRW22.23 trillion (US$16.17 billion), up 35% year-over-year, driven by surging demand for AI and high-performance DRAM. The company...
    Thursday 24 July 2025
    Samsung plans HBM4 comeback with advanced chip technology
    Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
    Wednesday 23 July 2025
    SK Group chairman meets OpenAI CEO Sam Altman to deepen AI, HBM ties
    SK Group chairman Chey Tae-won recently visited OpenAI's headquarters in San Francisco for a private meeting with CEO Sam Altman, according to reports from South Korean outlets Maeil...
    Wednesday 23 July 2025
    Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?
    Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
    Wednesday 23 July 2025
    Samsung bets on GAA and HBM4 to retake AI crown
    The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
    Tuesday 22 July 2025
    HBM equipment race intensifies as newcomers battle for market entry
    Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
    Tuesday 22 July 2025
    China's emerging memory titan duo disrupts DRAM's current big three
    China's top memory chipmakers, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technology Corp. (YMTC), have nearly doubled their output in just over a year. Their rapid expansion...
    Monday 21 July 2025
    Weekly news roundup: Nvidia partners with Micron, Huawei's 'Little HiSilicon' launches, GB300 production begins
    Below are the top DIGITIMES Asia stories from July 14 to 20, 2025. The top three topics include Nvidia teams up with Micron for a major SOCAMM rollout, aiming to challenge high-bandwidth...
    4/40 pages
    Asiawebinar0926
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 13 August 2025
    Advanced WLP and back-end solutions at SEMICON Taiwan 2025
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 13 August 2025
    Alif Semiconductor vying for market dominance in battery-powered generative AI applications and Edge AI
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES