China's major AI chipmakers, including HiSilicon, Cambricon Technologies, Horizon Robotics and DeePhi Tech, are expected to reap rich harvests in 2018 from their launch of various...

Eyeing the explosive demand for automotive-use chips fueled by rapid development of electric vehicles, driverless cars and drones, Globalfoundries has created a brand-new automotive...

Globalfoundries (GF) will have its 12-inch wafer fabs in Dresden, Germany focus on using FD-SOI (fully-depleted silicon-on-insulator) process technology to fabricate automotive-use...

Taiwan Semiconductor Manufacturing Company (TSMC) will see its 12-inch wafer fab in Nanjing, China start volume production in May 2018, more than one quarter ahead of its original...

Samsung Electronics announced recently that its foundry business has commenced mass production of system-on-chip (SoC) products built on its second generation 10nm FinFET process...

Semiconductor Manufacturing International Corp (SMIC), China's largest foundry, will kick off volume production of 14nm FinFET process technology in 2019 and launch its second-generation...

Globalfoundries will first use EUV lithography technology in its 7nm FinFET node, and has started to work with AMD in the process development, said company CTO Gary Patton at a recent...

The global smartphone applications processor (AP) market declined 5% on year to reach US$9.4 billion in the first half of 2017, according to Strategy Analytics. Qualcomm maintained...

Taiwan Semiconductor Manufacturing Company (TSMC) has revised upward its forecasts for global foundry and overall IC market outlook for 2017 to a 7% and 16% growth, respectively,...

Mong-song Liang, who had overseen advanced process R&D at TSMC and Samsung Foundry, has recently begun his new stint at another IC foundry, SMIC. In his new role, Liang is expected...

Samsung Electronics' 8nm FinFET process technology, the 8LPP (Low Power Plus), has been qualified and is ready for production, according to the company.

Taiwan Semiconductor Manufacturing Company (TSMC) has recently decided to set up the world's first 3nm wafer fab in the Southern Taiwan Science Park (STSP) after gaining government...

A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI (touch with display driver) chips, will enable Taiwan-based IC backend firms to enjoy a particularly...

Etching equipment demand for the manufacture of 3D NAND flash memory and FinFET chips is expected to grow in 2018 and 2019, according to Tokyo Electron, which expects its share of...

Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...