Synopsys has announced the successful tape-out of a broad portfolio of DesignWare Foundation and Interface PHY IP for TSMC's 7nm process technology, including logic libraries, embedded...
Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...
Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...
At the ongoing SEMICON Taiwan 2017, KLA-Tencor is showcasing its new FlashScan reticle blank inspection product line which represents the company's entry into the dedicated reticle...
Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...
Xilinx, ARM, Cadence Design Systems and TSMC have announced a collaboration to build the first CCIX (cache coherent interconnect for accelerators) test chip in TSMC 7nm FinFET process...
AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...
Qualcomm has announced that its premium mobile platform is powering Samsung's latest flagship smartphone for select regions. The Samsung Galaxy Note8 is powered by the Qualcomm Snapdragon...
China's semiconductor industry could have a chance of strengthening its position in the post-Moore's Law era, according to Shang-yi Chiang, former executive VP and co-chief operating...
Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...
With volume production for its Kirin 970-series chips kicking off, HiSilicon Technologies has become one of Taiwan Semiconductor Manufacturing Company's (TSMC) top-5 customers, according...
Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...
Taiwan Semiconductor Manufacturing Company (TSMC) will enter volume production of chips built using its 12nm FinFET process in the fourth quarter of 2017, according to a recent Chinese-language...
MediaTek plans to transfer part of its 28nm mobile chip orders, including those for the Amazon Echo Dot, to United Microelectronics (UMC) from Taiwan Semiconductor Manufacturing Company...
