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NEWS TAGGED FINFET
Thursday 20 July 2017
TSMC InFO packaging brings more competitiveness to its 7nm process technology
Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...
Wednesday 19 July 2017
Upcoming Meizu Pro 7 series reportedly to utilize MediaTek chips
Meizu is scheduled to introduce its new Pro 7 and Pro 7 Plus smartphone series on July 26. The Pro 7 model is expected to feature MediaTek's 16nm Helio P25 SoC chip while the Pro...
Wednesday 19 July 2017
FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...
Monday 3 July 2017
Globalfoundries CEO predicts a golden decade for semiconductors
The semiconductor industry will enter a golden age in the next decade, driven by robust chip and memory demand for ultra-large data centers and artificial intelligence (AI) applications,...
Monday 3 July 2017
Credo partnering with Foxconn to deliver 10M 100G active copper cable solutions
Credo Semiconductor, a developer of serializer-deserializer (SerDes) circuits, technology and IP cores, and Foxconn Interconnect Technology, a supplier of interconnect solutions,...
Thursday 29 June 2017
Qualcomm expanding mobile chip offering for mid-range smartphones
Qualcomm has introduced its Snapdragon 450-series mobile chips, a new entry to the Snapdragon 400 mobile platform tier designed for mid-range smartphones and tablets. The Snapdragon...
Friday 16 June 2017
7nm foundry market to heat up in 2018
IC foundries are gearing up for mass production of 7nm chips in 2018, as well as production for 7nm process technology using extreme ultraviolet (EUV), according to market observers...
Wednesday 14 June 2017
Globalfoundries launches 7LP FinFET process
Globalfoundries has announced the availability of its 7nm leading-performance (7LP) FinFET semiconductor technology, delivering a 40% generational performance boost to meet the needs...
Monday 5 June 2017
IBM, Globalfoundries and Samsung build new transistor for 5nm technology
IBM on June 5 announced that the company and its research alliance partners Globalfoundries and Samsung, and equipment suppliers have developed an industry-first process to build...
Thursday 1 June 2017
MediaTek to enter mass production of 12nm mobile chips by end of 2017
MediaTek is expected to start mass production of 12nm mobile chips manufactured by Taiwan Semiconductor Manufacturing Company around the end of 2017, according to industry sources...
Tuesday 30 May 2017
TSMC to start equipment move-in at Nanjing plant in September
Taiwan Semiconductor Manufacturing Company's (TSMC) new 12-inch plant in Nanjing, China will be ready for equipment move-in in September 2017, according to the Taiwan-based foundry...
Friday 5 May 2017
SMIC urges Taiwan chipmakers to partner with China-based peers
The Taiwan government should encourage its local chipmakers to collaborate with their China-based peers to create a win-win for both sides' semiconductor industries, according to...
Tuesday 25 April 2017
Ardentec breaks ground for new plant in Nanjing
Taiwan-based Ardentec, which specializes in testing services for logic and memory chips, has recently broken ground for a new plant in Nanjing, China where Taiwan Semiconductor Manufacturing...
Tuesday 25 April 2017
TSMC talks about its next growth drivers
Taiwan Semiconductor Manufacturing Company (TSMC) is seeing robust growth in demand from the mobile computing, automotive electronics, IoT and high-performance computing sectors,...
Friday 21 April 2017
Samsung completes qualification of 2nd-gen 10nm process technology
Samsung Electronics has announced that its second-generation 10nm FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement...