The production value of the global foundry industry is expected to grow by a CAGR of 6.2% to reach US$81.94 billion in 2023, the final year of a five-year forecast period, driven...

Taiwan Semiconductor Manufacturing Company (TSMC) held a ceremony on October 31 to mark the opening of its 12-inch wafer plant in Nanjing, China. Company chairman Mark Liu and CFO...

Samsung Electronics has started wafer production of its 7nm LPP with extreme ultraviolet (EUV) lithography technology, according to the company.

The production value of the global foundry industry is expected to grow by a CAGR of 6.2% to reach US$81.94 billion in 2023, the final year of a five-year forecast period, driven...

With sub-10nm node manufacturing requiring huge capex, a number of foundries have slowed down their investment pace while fabless chipmakers stick with 14/12nm products for cost reasons...

Globalfoundries is reshaping its technology portfolio to intensify its focus on delivering differentiated offerings for clients in high-growth markets, according to the pure-play...

EDA vendor Cadence Design Systems is scheduled to start operating a new subsidiary in Nanjing, China in September, according to industry sources.

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post a revenue decline of 4-6% sequentially in the third quarter of 2018, with gross margin...

Innosilicon, which designs and develops cryptocurrency mining ASIC products, has announced its Terminator Sha256 Bitcoin mining ASIC series utilizes Samsung Foundry's advanced low-power...

IC testing service provider King Yuan Electronics (KYEC) is expected to report about 10% sequential growth in third-quarter revenues, driven by a ramp-up of orders for artificial...

Semiconductor Manufacturing International (SMIC) held a ceremony recently to mark the start of equipment move-in at the new facilities of its 8-inch wafer plant in Tianjin, China,...

Samsung Electronics has announced that its strategic foundry collaboration with Arm will be expanded to 7/5-nanometer (nm) FinFET process technology to remain a step ahead in the...

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.

Applied Materials has announced a breakthrough in materials engineering that accelerates chip performance in the big data and AI era.

MediaTek is expected to introduce an enhanced version of its Helio P60 SoC designed for midrange smartphones that come with artificial intelligence (AI) features in the second half...