Taiwan-based memory module vendors Adata Technology and Team Group Inc. saw notable revenue gains in May 2025, driven by continued price increases for DRAM and NAND flash. Adata reported...
Academia Sinica announced on June 10, 2025, the successful development of several advanced fabrication processes for superconducting qubits on an automated 8-inch platform, positioning...
IC substrate manufacturer Nan Ya PCB announced that company president Andy Tang will retire and step down on June 16, 2025. The company has yet to announce a successor.
Memory manufacturers are reducing production capacity for older processes, driving DDR4 prices to skyrocket. Although Samsung Electronics' last buy order (LBO) for DDR4 was originally...
Taiwan's Executive Yuan announced a NT$300 billion (approx. US$9.3 billion) semiconductor subsidy program running through 2033, the island's largest-ever government investment in...
PCB wet process equipment and semiconductor materials agent Ampoc recently announced a strategic technical partnership with South Korean semiconductor materials leader DCT Material...
India-based RIR Power Electronics has begun shipping 1200V silicon carbide (SiC) diodes from Taiwan, marking a key step in its global expansion strategy. The milestone follows a partnership...
The American Chamber of Commerce in Taiwan has elevated energy supply to its top policy priority, warning that power shortages could undermine the island's position as a global technology...
Japan has made meaningful strides in reclaiming its semiconductor competitiveness with the establishment of the Leading-edge Semiconductor Technology Center (LSTC) and Rapidus, aiming...
In a sign of China's accelerating ambitions in the semiconductor race, ChangXin Memory Technologies (CXMT), the country's leading DRAM manufacturer, is rapidly advancing development...
Taiwan's National Development Council (NDC) Chairman Chin-Ching Liu accepted the American Chamber of Commerce in Taipei's 2025 Taiwan White Paper, as US technology companies including...
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is...
Marking the first anniversary of China's "Eight Measures for the STAR Market"—a landmark reform package aimed at boosting tech innovation and industrial upgrading—the...
Samsung Electronics' foundry division is targeting the artificial intelligence (AI) chip market with a new collaboration alongside Groq, aiming to bring their jointly developed chip...
