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Thursday 19 December 2024
Micron is optimistic about HBM demand and AI growth despite market challenges
After revealing the latest financial results, Micron held an earnings call, discussing the recovery paces across markets. The company is optimistic about the demand for HBM as it...
Thursday 19 December 2024
Kioxia develops OCTRAM and new memory tech to reduce NAND reliance
Japanese NAND flash manufacturer Kioxia has announced plans to produce three additional types of memory, targeting next-generation products driven by artificial intelligence (AI)...
Thursday 19 December 2024
2nm race heats up: Japan enters as Samsung, Intel scramble against TSMC
The competition for advanced logic processes at the 2-nanometer level will enter its production phase in 2025. Following their absence in the 5nm and 3nm generations, both Intel and...
Wednesday 18 December 2024
Amkor progresses with US$1.6 billion Vietnam factory, workforce cut anticipated
US-based IC backend house Amkor Technology is advancing its US$1.6 billion factory in Bac Ninh, Vietnam. However, it expects much fewer employees to be required for the facility inaugurated...
Wednesday 18 December 2024
AMEC, IDG Capital removed from US military blacklist
On December 17, 2024, the US Department of Defense (DoD) confirmed the removal of Advanced Micro-Fabrication Equipment Inc. (AMEC) and IDG Capital from its Chinese Military Companies...
Wednesday 18 December 2024
Onsemi's dual focus on automotive electrification and AI data centers sharpens with China push
Amid shifting dynamics in the power semiconductor market, Onsemi is leveraging China as a key growth driver for its dual focus on automotive electrification and AI data centers. Celebrating...
Wednesday 18 December 2024
US tightened chip controls put Samsung's China operations at risk
The US Department of Commerce's Bureau of Industry and Security (BIS) has expanded semiconductor export controls to include high bandwidth memory (HBM), a crucial component for artificial...
Wednesday 18 December 2024
Ventec new Thailand plant set for volume production in 1Q26
Following other PCB firms' expansion moves, niche copper-clad laminate (CCL) specialist Ventec announced plans in November for a production base in Thailand, which will begin volume...
Wednesday 18 December 2024
US reportedly investigates Chinese semiconductors with possible tariffs amid dominance concerns
The US reportedly plans to invoke Section 301 of the Trade Act to investigate Chinese semiconductors, focusing on mature process chips in medical devices, cars, and smartphones. The...
Wednesday 18 December 2024
GlobalWafers receives US$406 million Chips Act funding for Texas and Missouri plants
GlobalWafers has disclosed that its two US subsidiaries will receive up to US$406 million in direct funding from the US Department of Commerce under the Chips Act.
Wednesday 18 December 2024
Qualcomm-Arm licensing dispute heads to court amid settlement speculation
Major semiconductor design titans Qualcomm and Arm have begun their legal battle this week in the US court, with both sides presenting their arguments in a case that centers on licensing...
Wednesday 18 December 2024
Chipmaker Kioxia advances in Tokyo debut after jumbo IPO
Memory-chip maker Kioxia rose in its debut on the Tokyo Stock Exchange on Wednesday, underscoring decent investor demand for new shares in Japan. After initially dropping, the company...
Wednesday 18 December 2024
Mature manufacturing process prices expected to dip in 2025
Industry sources indicate that prices for mature semiconductor manufacturing process tape-outs will likely decrease in 2025, primarily driven by higher tape-out demand from integrated...
Wednesday 18 December 2024
Toppan participates in US-JOINT for advanced packaging technologies
In a press release dated December 10, Toppan, a subsidiary of Toppan Holdings, announced its participation in the US-JOINT initiative. This initiative is a consortium between the...
Wednesday 18 December 2024
Rapidus partners with EDA leaders to accelerate 2nm chip design
Rapidus has established strategic partnerships with two leading electronic design automation (EDA) companies to expedite the mass production of next-generation semiconductor chips.