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Monday 27 April 2026
Broadcom, Marvell set to benefit as 1.6T optical modules near mass production
1.6T optical communication modules are set for broad adoption in AI data centers in 2026, with optical transceiver vendors and key IC design houses preparing for shipments. Broadcom's...
Monday 27 April 2026
HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor...
Monday 27 April 2026
Denso weighs Rohm bid withdrawal as support stalls

Japanese auto parts supplier Denso said on April 27 that it is considering all options, including withdrawing its acquisition proposal...

Monday 27 April 2026
ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging...
Monday 27 April 2026
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...
Monday 27 April 2026
Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
Monday 27 April 2026
DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?
As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position.
Monday 27 April 2026
MediaTek ASIC revenue may overtake smartphone chips amid Google's TPU ramps
MediaTek's application-specific integrated circuit (ASIC) business is drawing market attention as volume production of Google's tensor processing units (TPUs) is expected to ramp from...
Monday 27 April 2026
South Korea and Vietnam deepen tech and supply chain cooperation amid global uncertainty
South Korea and Vietnam have expanded cooperation across technology, energy, and infrastructure, signing dozens of agreements during Korean President Lee Jae-Myung's visit to Hanoi,...
Monday 27 April 2026
India roundup: Micron ramp, Dholera SEZ push India toward full-stack chip manufacturing

India is accelerating its semiconductor ambitions, from Micron Technology's Sanand ramp to new...

Monday 27 April 2026
NEO Semiconductor advances 3D DRAM with POC validation
Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years...
Monday 27 April 2026
Cerebras files for IPO after AI chip breakthrough, G42 partnership shapes supply chain
Cerebras Systems filed for an initial public offering (IPO) on April 17, 2026, aiming to list on the Nasdaq. The company reversed its fortunes with US$510 million in revenue and a...
Monday 27 April 2026
Tata's India chip fab faces leadership churn and engineering hurdles amid uneven but continuing progress
Tata Electronics' flagship semiconductor fabrication project in Dholera, Gujarat—long viewed as India's most ambitious attempt to build a domestic chip manufacturing ecosystem—continues...
Monday 27 April 2026
Innolux enters leading tier of advanced packaging with new RDL and TGV technology
Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
Sunday 26 April 2026
Samsung, Kingston reportedly lift SSD prices by over 10% as supply tightens

Samsung Electronics and Kingston Technology have reportedly notified distributors of price increases of more than 10% across their solid-state...