Last week, India cleared a proposal for a new chip plant to be developed by HCL Group and Taiwanese electronics giant Foxconn.

Julian Hetherington, director of Automotive Transformation at Advanced Propulsion Centre (APC), elaborated on the development of the UK's automotive and semiconductor sectors during...

At the Computex 2025 keynote address, MediaTek's CEO, Rick Tsai, unveiled the company's inaugural 2nm chip, poised for tape-out in September of this year. Based on MediaTek's development...

MediaTek CEO Rick Tsai delivered a keynote speech at Computex 2025, revealing that MediaTek's first 2nm chip will officially be taped out in September 2025, signifying that the company's...

Taiwan-based high-density interconnect (HDI) board manufacturer Compeq Manufacturing has reported robust growth in its low-earth orbit (LEO) satellite communications segment, which...

As semiconductors evolve into critical assets for national security and sovereign AI ambitions intensify, TSMC has emerged as a strategic lynchpin in the global chip race. While the...

Just one day after announcing plans to deploy 3,000 Huawei Ascend-powered AI servers by 2026, Malaysia's Deputy Communications Minister Teo Nie Ching abruptly retracted the statement...

Zeiss made its debut at Computex 2025, unveiling industrial metrology tools designed for AI server manufacturing, including CT scanners, 3D scanning systems, and industrial microscopes...

Of the seven semiconductor fabs completed in Japan during fiscal 2023–2024 (April 2023 to March 2025), only three had begun mass production by April 2025. New facilities from...

China's Ministry of Commerce has denounced new US restrictions targeting Huawei's artificial intelligence (AI) chips, arguing the move threatens the recently established trade consensus...

TSMC is fast-tracking its capacity expansion with plans to build nine new facilities in 2025, including eight wafer fabs and one advanced packaging plant. The move has energized sentiment...

In a keynote on May 19, 2025, Nvidia CEO Jensen Huang focused on AI infrastructure, AI agents, and physical AI (robots). He highlighted that AI agents require significantly more computing...

South Korean chip giant SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor,...

At this year's COMPUTEX keynote, Nvidia CEO Jensen Huang unveiled NVLink Fusion, a new initiative to open the company's proprietary NVLink interconnect to third-party ASICs and CPUs...