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Thursday 4 September 2025
Korean industry sees US VEU revocations as rare earth talk leverage
Analysts say the US government's decision to revoke Verified End-User (VEU) authorizations for semiconductor equipment exports to Samsung Electronics and SK Hynix's Chinese factories...
Thursday 4 September 2025
Why the US revoking TSMC’s Nanjing license may matter less than it seems
The US Commerce Department has told TSMC it will revoke the company's Verified End-User (VEU) status for its Nanjing factory by December 31, 2025. TSMC said on September 2 that the...
Thursday 4 September 2025
Chunghwa Precision Test reports 37% revenue increase in August fueled by AI and mobile chip demand
Taiwan-based chip probing and testing solution provider Chunghwa Precision Test announced a 37% year-over-year revenue increase in August 2024, driven by rising demand for next-generation...
Thursday 4 September 2025
Taiwan govt stresses cooperation as US strips TSMC Nanjing's VEU
The US has revoked TSMC Nanjing's Verified End-User status, effective as of the end of 2024, requiring case-by-case approval for US equipment imports. Taiwan's Economic Minister Kung...
Thursday 4 September 2025
Odisha secures semiconductor deals at Semicon India 2025
Odisha emerged as a key player in India's semiconductor landscape at Semicon India 2025, securing multiple high-value investment commitments and unveiling ambitious manufacturing...
Thursday 4 September 2025
GlobalFoundries finds new road in China: Zensemi partnership anchors auto chip strategy
GlobalFoundries (GF), the US-based contract chipmaker, is accelerating its "China for China" strategy through a partnership with Guangzhou Zen Semiconductor (Zensemi). The collaboration...
Thursday 4 September 2025
China's SiC substrate industry faces setback, seeks strategic pivot
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
Thursday 4 September 2025
Acer targets AI inference market with new launches partnered with MediaTek and Nvidia
Acer is making a strong push into the AI inference market through strategic collaborations with MediaTek and Nvidia. On the eve of the Berlin IFA, Acer held its "next@acer" global...
Thursday 4 September 2025
Hermes Testing expands probe solution business amid AI-driven semiconductor demand
Hermes Testing, a testing solutions provider under Hermes Epitek, is leveraging its machine engineering services and customized equipment manufacturing to address growing demand in...
Thursday 4 September 2025
Commentary: TSMC's Songjiang escape highlights Korean chipmakers' China trap
The US Department of Commerce's Bureau of Industry and Security (BIS) has revoked the "Validated End-User" (VEU) status for Samsung Electronics and SK Hynix, ending a key exemption...
Thursday 4 September 2025
Tech Forum 2025: TSMC faces the next decade of chip war from Arizona to Beijing
Taiwan Semiconductor Manufacturing Co. (TSMC) has begun mass production and turned a profit at its Arizona plant in 2025, a milestone that marks not only a breakthrough in its global...
Thursday 4 September 2025
Dai Nippon Printing to open first overseas R&D center in the Netherlands, focused on co-packaged optics
Starting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven...
Thursday 4 September 2025
Tech Forum 2025: China's SiC surge leaves Wolfspeed struggling beyond bankruptcy
Wolfspeed's recovery from bankruptcy protection remains uncertain, with core problems expected to extend beyond its anticipated year-end exit. The US power semiconductor firm is struggling...
Thursday 4 September 2025
Tech Forum 2025: Qualcomm and MediaTek take smartphone rivalry to the cloud in AI chips
With global smartphone sales leveling off, Qualcomm and MediaTek are taking their long-running rivalry into the fast-growing cloud AI ASIC market. DIGITIMES Research estimates MediaTek...
Thursday 4 September 2025
Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race
The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized"...