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Friday 7 November 2025
Hanmi to launch Wide TC Bonder for HBM5 high stacking in 2026
Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM)...
Friday 7 November 2025
Trump's trade policies trigger Taiwan's US$400 billion US investment surge
Amid US President Donald Trump's tariff threats and new incentives under the US "One Big Beautiful Bill Act," foreign companies are increasingly planning major investments in the...
Friday 7 November 2025
ASE unveils AI-enhanced IDE 2.0 to accelerate chip design and packaging
ASE has announced a significant upgrade to its in-house integrated design ecosystem (IDE) platform, introducing IDE 2.0, which features AI integration to speed up design iterations...
Friday 7 November 2025
“Call the mayor”: Jensen Huang’s Computex quip triggers a months-long land tussle for Nvidia’s Taipei HQ
When Nvidia CEO Jensen Huang took the stage at Computex in Taipei on May 19, 2025, his remarks about the company's new Taiwan headquarters—called "Nvidia Constellation"—sparked...
Thursday 6 November 2025
SK Hynix tight-lipped on Nvidia supply terms as HBM4 prices climb
SK Hynix has reportedly increased the price of its sixth-generation high-bandwidth memory (HBM4) supplied to Nvidia by over 50% compared to the previous generation HBM3E. Industry...
Thursday 6 November 2025
Winbond's DRAM bit supply to double as structural shortage extends through 2027
Continuous upgrades in memory technology have created a structural imbalance in supply and demand. Nevertheless, memory supplier Winbond Electronics delivered strong earnings in the...
Thursday 6 November 2025
Samsung's HBM4 yields surge toward Nvidia certification, SK Hynix keeps edge
Nvidia's evaluation of sixth-generation high-bandwidth memory (HBM4) has sparked a fierce contest among suppliers. ETNews reports that the company plans to finish testing...
Thursday 6 November 2025
Nvidia CEO credits Taiwan partners for US AI chip success, warns China's advancement
Nvidia CEO Jensen Huang has acknowledged the critical role of Taiwanese partners in domestic AI chip production in the US, while cautioning that China's technological progress has...
Thursday 6 November 2025
Commentary: Is Trump's Blackwell ban handing China the AI chip crown on a platter?
Since US President Donald Trump took office in January 2025, his administration has escalated technology export restrictions with unprecedented aggression. Beyond raising overseas...
Thursday 6 November 2025
China bans Nvidia from state data centers, mandates domestic AI chips
China has escalated its campaign to reduce dependence on foreign technology. The country now requires all new state-funded data centers to use domestically produced artificial intelligence...
Thursday 6 November 2025
Arm raises forecast after record quarter fueled by soaring AI demand
Arm Holdings raised its revenue outlook on Nov. 5 after posting record quarterly results, citing a broad-based surge in demand for its technology driven by artificial intelligence.
Thursday 6 November 2025
Samsung Electro-Mechanics reportedly joins Broadcom supply chain amid AI chip surge
Samsung Electro-Mechanics is reportedly set to supply advanced semiconductor glass substrates to Broadcom. The move comes as Broadcom, a key chip supplier for tech giants like Google...
Thursday 6 November 2025
Arm touts AI efficiency as 'power bottleneck' hits data centers
Arm Holdings is positioning its energy-efficient chip designs as the essential solution to the global AI industry's growing power crisis, a strategy that fueled record quarterly results...
Thursday 6 November 2025
Advantech says tight DDR4 supply and rising SSD prices squeeze industrial PC margins
Global memory supply constraints continue to pressure the industrial PC (IPC) market, with Taiwanese technology company Advantech Co. reporting that tight DDR4 memory availability...
Thursday 6 November 2025
ASML reframes its China strategy with advanced packaging debut of TWINSCAN XT:260
ASML has introduced the TWINSCAN XT:260, its first lithography system purpose-built for 3D integration and advanced packaging. The launch marks a major step beyond front-end wafer...