JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift...
South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device...
Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
A South Korean-Indian joint venture has completed a semiconductor materials plant in South Korea, aiming to strengthen regional supply chains for photoresist materials and reduce reliance...
China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
Taiwan's Ministry of Economic Affairs has approved a NT$9.835 billion (approx. US$310 million) capital injection by Lam Research into its Taiwanese subsidiary, Lam Research Taiwan,...
Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
Nvidia's US$3.5 billion investment in MediaTek's overseas convertible bonds marks more than a financial bet. It underscores how the chip leader is trying to anchor its AI infrastructure...
Nvidia and MediaTek are widening a global AI partnership that could reshape data center, edge, and PC hardware markets. MediaTek's US$3.9 billion overseas convertible bond sale, largely...
As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...
Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
Capex by the world's nine largest cloud service providers (CSPs) is expected to rise about 90% year over year in 2026, while AI servers are growing faster than conventional servers,...
AI-driven demand for optical transceiver modules is rising rapidly, and LuxNet said its business in the second half of 2026 will grow sharply from the first half. With capacity coming...
