CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Friday 17 July 2026
China's DRAM milestone arrives with CXMT IPO; HBM now separates contenders from leaders

ChangXin Memory Technologies (CXMT) opened subscriptions for its STAR Market IPO on July 16, launching one of China's largest A-share listings...

Friday 17 July 2026
TSMC says A14 process on track for 2028 volume production
TSMC said at its earnings call on July 16 that its A14 process technology is developing as planned, with risk production set for 2027 and volume production slated to begin in 2028.
Friday 17 July 2026
Analysis: Unveiling the low-profile engineer building China's CXMT into a DRAM heavyweight

ChangXin Memory Technologies' (CXMT) STAR Market IPO is more than just one of China's biggest semiconductor listings. It also marks...

Friday 17 July 2026
Interview: QuantumDiamond's EU-backed quantum leap in chip inspection lands in Taiwan

The global tech landscape is currently dominated by two massive tides: the race for semiconductor supremacy and the long-promised dawn...

Friday 17 July 2026
Power component prices keep rising as supply tightens

Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products...

Friday 17 July 2026
Tata's India chip debut reportedly to lean on 90nm, a humbler start than its 28nm pledge
India's first large-scale wafer fab will begin production on decades-old 90nm technology rather than the 28nm node the Tata group publicly touted, a step that underscores how far the...
Friday 17 July 2026
SK Group chair floats 'memory as a service' model for SK Hynix

SK Group chairman Chey Tae-won has floated a "memory as a service" model for SK Hynix, saying the memory chipmaker needs to build a...

Friday 17 July 2026
Exclusive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027
Chinese DRAM maker ChangXin Memory Technology's (CXMT) IPO has entered its final stage, drawing close market attention. PC supply chain sources said the US had briefly planned to add...
Friday 17 July 2026
Hygon forecasts higher first-half 2026 revenue and profit
Hygon Information Technology said its first-half 2026 results are expected to rise sharply, signaling continued demand for domestic high-end chips as AI, cloud computing, and localization...
Friday 17 July 2026
TSMC welcomes EMIB relief as MediaTek pressure eases

TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the...

Friday 17 July 2026
TSMC boosts US manufacturing as Taiwan chip designers wait on moving production

TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several...

Friday 17 July 2026
TSMC's US$100 billion bet: AI growth, US pressure and the cost of staying ahead
Taiwan Semiconductor Manufacturing Company (TSMC) posted record second-quarter earnings for 2026, issued third-quarter revenue guidance above market expectations, and raised its full-year...
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
Taiwan backs TSMC's US expansion while reaffirming advanced chip leadership at home
TSMC said on July 16 that it will add US$100 billion to its US investment, bringing the total to US$265 billion. Taiwan's Executive Yuan said it respects companies expanding in the...
Friday 17 July 2026
Micron locks in automotive supply agreements as vehicle tech grows smarter
Micron Technology said it has completed strategic customer agreements with several tier 1 suppliers and ecosystem partners serving the global automotive industry, including Qualcomm,...