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Tuesday 21 July 2026
How AI boom spurs Taiwan's PCB makers to rethink their Southeast Asia playbook

Amid the global boom in AI infrastructure investment, Southeast Asia is evolving from an electronics-component manufacturing base into...

Tuesday 21 July 2026
Pat Gelsinger: Intel missed GPU boom, warns Taiwan energy risk

Former Intel CEO Pat Gelsinger has criticized Intel's past strategy in a recent interview, revisiting the company's history with Nvidia...

Tuesday 21 July 2026
Memory shortage could turn into a glut by 2028 as chipmakers expand

A powerful rally in memory-chip stocks has stalled as investors reconsider whether record spending on AI data centers could eventually...

Tuesday 21 July 2026
Samsung keeps High-NA EUV rollout cautious as foundry profitability remains the focus

Samsung Electronics is taking a slower approach than Intel to High-NA extreme ultraviolet (EUV) lithography for advanced chip production,...

Tuesday 21 July 2026
TSMC sees structural AI growth, expands Arizona capex

TSMC Chief Financial Officer Wendell Huang said the company expects AI chip demand to remain strong for years, prompting it to keep...

Tuesday 21 July 2026
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...

Tuesday 21 July 2026
Elite Material, TUC race ahead in AI CCL push

As AI server products accelerate their generational shift and demand higher-frequency, higher-speed transmission, the upgrade cycle...

Tuesday 21 July 2026
Befar begins production of 6N hydrogen fluoride gas for chipmaking

Befar Group has begun producing semiconductor-grade hydrogen fluoride gas with a claimed purity of 6N, or 99.9999%, expanding the Chinese...

Tuesday 21 July 2026
Advanced Echem Materials to invest NT$4.52 billion in Longtan plant
Advanced Echem Materials (AEMC), a semiconductor specialty chemicals materials maker, plans to invest roughly NT$4.52 billion (approx. US$139.66 million) in Taiwan's Longtan Science...
Tuesday 21 July 2026
Glass substrates poised to be chip packaging's next battleground: Trumpf

AI and high-performance computing are pushing chip packages beyond the limits of conventional materials, and German laser equipment...

Tuesday 21 July 2026
Samsung could overtake SK Hynix in the HBM market by 2027
Samsung Electronics could overtake SK Hynix to lead the global high-bandwidth memory market in 2027 as shipments of HBM4 expand, according to forecasts from UBS cited by Money...
Tuesday 21 July 2026
AI boom may reshape SK Siltron sale as chairman reportedly rethinks
SK Group chairman Chey Tae-Won is reportedly making a final decision on the sale of semiconductor silicon wafer subsidiary SK Siltron, as surging AI chip demand raises doubts about...
Tuesday 21 July 2026
VSMC warns AI-ready MES is becoming essential for wafer fabs, with China accelerating adoption

TSMC's sustained capital spending highlights the two foundations of its competitive strength: technology leadership and manufacturing excellence...

Monday 20 July 2026
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...
Monday 20 July 2026
Alibaba open-sources AI chip software, launches Zhenwu cloud supernode service
Alibaba Group's chip design unit, T-Head, has open-sourced the software stack behind its Zhenwu AI processors while extending the platform from individual accelerators into rack-scale...