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    SMIC's 7nm process edges Intel 18A on pitch, but trails in transistor density
    Jun 17, 16:54
    ENF Technology enters SK Hynix supply chain, supplying self-produced hydrofluoric acid
    Jun 17, 16:54
    Iran–US ceasefire eases pressure on global auto supply chains
    Jun 17, 16:51
    SK Hynix reportedly to make JSC's LPDDR5 in a rare foundry move
    Jun 17, 16:51
    AI-driven memory price surge pushes Samsung's budget phones higher
    Jun 17, 16:51
    NEWS TAGGED CHIPS + COMPONENTS
    Monday 27 April 2026
    Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
    Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
    Monday 27 April 2026
    Thailand's PCB industry moves upmarket, local supply gaps persist

    Thailand is fast emerging as a critical hub for high-end electronics manufacturing, as global supply chains shift and demand for AI computing...

    Monday 27 April 2026
    TSMC trade secret theft ends in 10-year sentence, $4.6M fine against Tokyo Electron
    A Taiwanese court handed down its harshest ruling yet in a semiconductor trade secret case on Monday, sentencing a former TSMC engineer to 10 years in prison and fining Japanese equipment...
    Monday 27 April 2026
    Meta signs deal for AWS's Graviton CPUs as inferential and agentic AI enter the scene
    Meta and Amazon announced on April 24 that Meta will use Graviton5 CPUs made by Amazon Web Services (AWS). The deal illustrates the growing importance of CPU chips for increasingly...
    Monday 27 April 2026
    Broadcom, Marvell set to benefit as 1.6T optical modules near mass production
    1.6T optical communication modules are set for broad adoption in AI data centers in 2026, with optical transceiver vendors and key IC design houses preparing for shipments. Broadcom's...
    Monday 27 April 2026
    HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
    The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor...
    Monday 27 April 2026
    Denso weighs Rohm bid withdrawal as support stalls

    Japanese auto parts supplier Denso said on April 27 that it is considering all options, including withdrawing its acquisition proposal...

    Monday 27 April 2026
    ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
    Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging...
    Monday 27 April 2026
    TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
    ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...
    Monday 27 April 2026
    Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
    Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
    Monday 27 April 2026
    DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?
    As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position.
    Monday 27 April 2026
    MediaTek ASIC revenue may overtake smartphone chips amid Google's TPU ramps
    MediaTek's application-specific integrated circuit (ASIC) business is drawing market attention as volume production of Google's tensor processing units (TPUs) is expected to ramp from...
    Monday 27 April 2026
    South Korea and Vietnam deepen tech and supply chain cooperation amid global uncertainty
    South Korea and Vietnam have expanded cooperation across technology, energy, and infrastructure, signing dozens of agreements during Korean President Lee Jae-Myung's visit to Hanoi,...
    Monday 27 April 2026
    India roundup: Micron ramp, Dholera SEZ push India toward full-stack chip manufacturing

    India is accelerating its semiconductor ambitions, from Micron Technology's Sanand ramp to new...

    Monday 27 April 2026
    NEO Semiconductor advances 3D DRAM with POC validation
    Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook