CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Sunday 26 April 2026
Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling
Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix,...
Sunday 26 April 2026
Nvidia and OpenAI both make US$20 billion bets on AI chip startups: what's the common factor?
2026 has become a major year for IPO fundraising among leading AI players. At the end of 2025, Nvidia CEO Jensen Huang spent US$20 billion to acquire the IP and talent of AI chip startup...
Sunday 26 April 2026
Samsung bets its HBM leverage can hold Nvidia's LPU orders — but TSMC is pushing back
The AI era has officially shifted from training to inference and agent-centric computing, prompting Nvidia's strategic acquisition of Groq to integrate LPUs into its own platform....
Saturday 25 April 2026
LandMark Optoelectronics ramps up semiconductor-grade equipment for 6-inch SiPh amid surging demand
Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer...
Saturday 25 April 2026
China's Horizon Robotics aims at Tesla with new self-driving platform

As competition in intelligent electric vehicles shifts from incremental feature upgrades to full system-level redesign, China's Horizon...

Friday 24 April 2026
Chipmakers face higher cost pressure as packaging outpaces foundry price hikes
In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers...
Friday 24 April 2026
Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure
At Google Cloud Next 26, Google Cloud announced a strategic shift in its AI hardware approach by introducing two distinct eighth-generation Tensor Processing Units: the TPU v8t for...
Friday 24 April 2026
M31 and TSMC complete eUSB2V2 tapeout on N2P process
IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely...
Friday 24 April 2026
Memory price surge reshapes global notebook competition in 2026
The global notebook market is undergoing a structural shift in competitive dynamics in 2026, moving from product specifications and pricing battles to group-level integrated capabilities...
Friday 24 April 2026
Strait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow

Geopolitical tensions in the Middle East and the blockade of the Strait of Hormuz since early March 2026 are beginning to ripple through...

Friday 24 April 2026
STMicroelectronics tops 1Q26 guidance, sees data center revenue surpass US$1 billion by 2027
STMicroelectronics reported first-quarter 2026 revenue of US$3.10 billion, up 23% year over year, with results coming in above the midpoint of its guidance as growth in personal electronics...
Friday 24 April 2026
TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker
The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
Friday 24 April 2026
SK Hynix deepens TSMC ties with HBM4, advances memory-logic integration

SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting...

Friday 24 April 2026
Texas Instruments eyes further price hikes amid strong data center, industrial chip demand
Texas Instruments (TI) reported robust results for the first quarter of 2026 on April 23, driven by surging AI data center demand and a notable rebound in industrial control applications...
Friday 24 April 2026
AI PCB supply crunch squeezes margins on rising materials and energy costs
A tightening supply of high-end materials is emerging as a key constraint just as PCB specifications and manufacturing processes move into a new upgrade cycle. Shortages span from...