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NEWS TAGGED CHIPS + COMPONENTS
Tuesday 13 January 2026
Winbond Electronics and Transcend report strong growth as memory shortage
Memory chip manufacturers Winbond Electronics and Transcend Information posted significant profit increases in late 2025, driven by heightened demand and ongoing supply constraints...
Monday 12 January 2026
Qatar, UAE join US-led Pax Silica supply chain pact
Qatar and the United Arab Emirates are set to join a US-led initiative to secure artificial intelligence and semiconductor supply chains, expanding a framework Washington views as...
Monday 12 January 2026
China-style NXP model? Unigroup Guoxin buys WeEn to build a design-to-fab power chip platform

Unigroup Guoxin Microelectronics has launched a stock-and-cash deal to acquire control of WeEn Semiconductors, a China-owned power semiconductor...

Monday 12 January 2026
CES 2026: Chip giants spread out, visual AI dominates the smaller players
At CES 2026, chipmakers remained at the center of attention. Nvidia CEO Jensen Huang and AMD CEO Lisa Su both delivered keynote speeches, while Lenovo hosted a major event at the Sphere,...
Monday 12 January 2026
Musk vows to build 2nm fab, claims industry got cleanroom wrong
Elon Musk recently declared that the semiconductor industry has erred in cleanroom design. As CEO of Tesla and SpaceX, Musk promised that once Tesla establishes a 2nm process wafer...
Monday 12 January 2026
HP seeks Chinese memory suppliers as DRAM shortage bites
HP is reportedly evaluating Chinese memory suppliers as a global shortage of DRAM tightens supply for consumer devices, according to analyst commentary citing discussions with Bank...
Monday 12 January 2026
Synnex reports strong December revenue growth driven by memory prices and AI demand
Distribution giant Synnex Technology International Corp. posted robust revenue growth in December 2025, benefiting from rising memory prices and increased demand for AI server applications...
Monday 12 January 2026
Etron showcases integrated AI memory solution at CES 2026 amid rising DRAM costs
Taiwanese semiconductor firm Etron Technology is presenting its MemorAiLink platform at the CES 2026 event in the US, integrating technologies from multiple subsidiaries. The company's...
Monday 12 January 2026
Samsung reclaims top spot in global DRAM market with record quarterly revenue
Samsung Electronics has reclaimed its position as the world's leading DRAM supplier in the fourth quarter of 2025, reporting record revenue of KRW27.7 trillion (US$19.2 billion) in...
Monday 12 January 2026
South Korea accelerates SiC and GaN power chip production with new policy push
South Korea is stepping up policy support for next-generation power semiconductors as part of a broader push to strengthen domestic chip manufacturing and reduce reliance on overseas...
Monday 12 January 2026
India targets post-quantum secure chip personalization with Kaynes Semicon-SEALSQ joint venture
India's semiconductor ambitions are beginning to extend beyond fabrication and conventional packaging into secure chip personalization and cryptographic control, as Kaynes Semicon...
Monday 12 January 2026
Weekly news roundup: AI memory effects in DRAM, HBM4, and TSMC's global expansion
Below are the most-read DIGITIMES Asia stories of the first full week of 2026: January 5-11.
Monday 12 January 2026
Honey Hope Honesty posts 16% growth on surging AI server MLCC demand
Electronic component distributor Honey Hope Honesty Enterprise (3H) reported December 2025 revenue of NT$652 million (US$20.63 million), up 52.01% year over year. The strong growth...
Monday 12 January 2026
TSMC expands advanced packaging, reportedly set to name first 'general plant manager'
TSMC is rapidly expanding its advanced packaging operations and is reportedly poised to appoint its first-ever "general plant manager" to oversee all facilities. The role is expected...
Monday 12 January 2026
Top 10 Chart: Taiwan semiconductor manufacturing split in 2025
Taiwan's semiconductor manufacturing side turned in a distinctly split performance in December 2025. The month can be summed up as: AI keeping advanced logic and advanced packaging...