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    Samsung steadies 12-Layer HBM3E, eyes larger Google TPU orders
    1min ago
    Samsung nears deal to supply over 30% of Nvidia's HBM4 memory in 2026
    Dec 15, 18:57
    Shanghai's two AI conferences signal shift from models to embodied intelligence
    Dec 15, 18:57
    NEWS TAGGED CHIPS + COMPONENTS
    Friday 31 October 2025
    Why SK Hynix skipped the fried chicken and beer summit

    When Nvidia CEO Jensen Huang arrived in South Korea, global attention turned to a viral "chimaek" (fried chicken and beer) dinner on...

    Friday 31 October 2025
    Samsung Electro-Mechanics posts strong 3Q25 results, eyes double-digit MLCC growth in 2026
    Samsung Electro-Mechanics has reported robust financial results for the third quarter of 2025 and projects sustained strong demand for multilayer ceramic capacitors (MLCCs) in 2026,...
    Friday 31 October 2025
    Nvidia's Jensen Huang commits quarter-million AI chips to push South Korea's AI frontier
    Nvidia CEO Jensen Huang capped his week in Seoul with a sweeping series of agreements that could redefine South Korea's role in the global AI economy.
    Friday 31 October 2025
    Massive US investment highlights Texas Instruments' push for manufacturing resilience
    Texas Instruments (TI) unveiled a US$60 billion investment plan in June 2025 to expand its semiconductor manufacturing within the US, aiming to increase wafer capacity fivefold with...
    Friday 31 October 2025
    50,000 Nvidia GPUs power Samsung's dawn of AI-manufacturing
    Nvidia and Samsung Electronics have announced plans for an "AI Factory," a next-generation semiconductor manufacturing hub powered by over 50,000 Nvidia GPUs. The initiative marks...
    Friday 31 October 2025
    Yageo sees 12.9% profit rise in 3Q25 driven by AI demand
    Taiwanese passive component leader Yageo reported significant revenue growth in the third quarter of 2025, fueled by strong demand for artificial intelligence (AI) and high-end application-related...
    Friday 31 October 2025
    China's CXMT cracks LPDDR5X speed barrier, posing a new test for Samsung and SK Hynix

    Chinese memory maker ChangXin Memory Technologies (CXMT) has started mass production of LPDDR5X DRAM, marking a milestone in China's...

    Friday 31 October 2025
    AMD ties pay off: Tongfu Microelectronics reaps AI-driven profit surge
    Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing firm, posted record revenue and profit in the third quarter of 2025. Revenue for the first three quarters...
    Friday 31 October 2025
    Elan Microelectronics advances AI strategy with new smart campus, expanding product lines
    Elan Microelectronics has marked the progress of its new AI smart campus headquarters in Zhubei with a topping-off ceremony. The facility, slated for completion in 2026 and official...
    Friday 31 October 2025
    ASE's advanced packaging and testing revenue to rise by US$1 billion in 2026
    Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials...
    Friday 31 October 2025
    Shennan Circuits and China’s PCB sector gear up for the space economy

    As China accelerates its ambitions in low-Earth-orbit (LEO) communications, the country's push for homegrown satellite technology is...

    Friday 31 October 2025
    Onsemi introduces vertical GaN semiconductors for AI and electrification applications
    Onsemi has unveiled vertical gallium nitride (vGaN) power semiconductors built on GaN-on-GaN technology, targeting applications in AI data centers, electric vehicles (EVs), renewable...
    Friday 31 October 2025
    STM cuts 2025 capex on sluggish demand recovery for automotive and industrial chips
    STMicroelectronics (STM) has projected fourth-quarter 2025 revenue below market expectations and trimmed its capital expenditure plan for the year, signaling a weaker-than-anticipated...
    Friday 31 October 2025
    Skyworks–Qorvo merger creates RF chip powerhouse, pressuring Asian rivals
    US RF chipmaker Skyworks Solutions plans to acquire its domestic rival Qorvo in a cash-and-stock deal worth US$22 billion, forming one of the largest mergers in the RF semiconductor...
    Friday 31 October 2025
    ASE posts 11-quarter profit high on advanced packaging, stable FX in 3Q25
    ASE, a leader in semiconductor assembly and testing, reported stronger-than-expected overall operations in the third quarter of 2025, driven by growth in advanced packaging fueled...
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    BIZ FOCUS
    Dec 12, 08:00
    AWS Joint Innovation Center Kaohsiung Showcases Startups Accelerating Enterprise Modernization and Smart City Innovation
    Friday 12 December 2025
    DigiKey India Celebrates Official Launch in Bengaluru
    Thursday 11 December 2025
    MiTwell Unleashes Edge AI Computing Power: Building an OSM + AMC Modular Ecosystem
    Thursday 11 December 2025
    AGI Technology Gears Up for CES 2026, Debuting Ultra-Fast Gen5 SSD and DDR5 Innovations