中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED CHIPS + COMPONENTS
    Thursday 4 June 2026
    TSMC sees no sign of capex slowdown as demand stays strong
    TSMC chairman C.C. Wei told shareholders on June 4 that the company sees no reason to cut capital spending, citing strong demand for advanced chips, continuing expansion in the US,...
    Thursday 4 June 2026
    Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

    Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore...

    Thursday 4 June 2026
    The 'Wintel' of robotics? Nvidia allies with Unitree to standardize AI humanoid development
    In a move set to reshape the global robotics landscape, Nvidia announced at GTC Taipei that it will partner with Chinese humanoid robot pioneer Unitree Robotics to launch the world's...
    Thursday 4 June 2026
    EU launches Technology Sovereignty Package to strengthen chips, AI, and cloud infrastructure
    The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source...
    Thursday 4 June 2026
    Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
    Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
    Thursday 4 June 2026
    Exclusive: How China's subsidized SiC boom is driving global prices to the floor
    China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping...
    Thursday 4 June 2026
    Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
    At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a...
    Thursday 4 June 2026
    SK and TSMC deepen HBM, advanced packaging tie-up
    SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed...
    Thursday 4 June 2026
    xMEMS tackles data center heat with chip-level cooling tech
    Surging demand for artificial intelligence computing has accelerated the buildout of data centers, pushing system cooling closer to its limits. As power consumption rises, heat-related...
    Thursday 4 June 2026
    Broadcom says AI chip revenue on track to exceed US$100 billion in 2027, rules out rack business
    At the earnings call on June 3, Broadcom said its AI semiconductor business continued to accelerate in the fiscal second quarter, with revenue reaching a record US$10.8 billion, up...
    Thursday 4 June 2026
    Broadcom advances OpenAI custom chip program, expands Anthropic AI compute initiative
    Broadcom said its AI semiconductor business remained in an "insatiable" demand environment on its second quarter of fiscal 2026 earnings call on June 3, as it outlined progress with...
    Thursday 4 June 2026
    Broadcom forecasts strong third-quarter growth, but AI revenue outlook misses elevated expectations
    Broadcom reported record second-quarter revenue and raised expectations for the current quarter, but its outlook for artificial intelligence (AI) semiconductor sales fell short of...
    Thursday 4 June 2026
    BE Epitaxy Semiconductor targets 1.6T CPO with AMD, MediaTek
    Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed...
    Thursday 4 June 2026
    Goldkey targets NT$10B funding to lock in memory supply as prices surge
    Memory module maker Goldkey said it plans to raise NT$6 billion (US$191.4 million) to NT$10 billion in working capital in 2026 through multiple channels as tight supply and rising...
    Thursday 4 June 2026
    Chip test equipment makers hit by FPGA, CPU supply crunch

    Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs...

    50/407 pages
    biz
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    reportAIglasses