CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Monday 30 June 2025
From subsidies to subtraction: Lip-bu Tan rewrites Intel’s revival playbook
The semiconductor industry rarely sees such a stark contrast in leadership philosophy as the one emerging between Intel's current and former CEOs. Pat Gelsinger, who recently stepped...
Monday 30 June 2025
India roundup: Taiwanese firm on thin ice over Indian investments
Despite rising investments in India, Taiwanese companies remain cautious, treading carefully as if walking on thin ice.
Monday 30 June 2025
DDR4 memory shortage pushes prices up as industry moves faster to DDR5

Despite ongoing geopolitical uncertainty and a seasonal slowdown after the second-quarter stockpiling, memory chip suppliers remain cautiously...

Monday 30 June 2025
ASE COO flags potential setback to US$1 trillion semiconductor goal due to US tariffs and currency pressures
As the US enters a new phase of tariff enforcement—with the buffer period on reciprocal tariffs nearing expiration—concerns are growing that the global semiconductor industry's...
Saturday 28 June 2025
Nvidia storms back toward $4 trillion
Two years after Nvidia Corp. made history by becoming the first chipmaker to achieve a $1 trillion market capitalization, an even more remarkable milestone is within its grasp: becoming...
Saturday 28 June 2025
Marvell bets big on custom AI chips to challenge Broadcom's lead

While Broadcom remains a dominant force in the AI ASIC market, Marvell Technology is working hard to catch up, much like AMD's continued...

Friday 27 June 2025
As US and Japan expand EUV capabilities, South Korea faces semiconductor setback

As the global race to develop next-generation semiconductor technologies accelerates, the United States and Japan are investing heavily...

Friday 27 June 2025
BizLink positions for AI hardware upswing with new sites, localized output
Global interconnect solutions provider BizLink Group opened a new facility in Tainan on June 26, underscoring its focus on localized R&D and production. Chairman Roger Liang said...
Friday 27 June 2025
Renesas delays US$20 billion revenue goal, scales back power chip plans after EV setback
Renesas Electronics said on June 26, 2025, it is scaling back its power semiconductor business, postponing a key revenue goal by five years, and removing the executive overseeing...
Friday 27 June 2025
Yageo's acquisition of Shibaura approved by Taiwan's MOEA; takeover bid period extended three times
Taiwan-based passive components giant Yageo announced on June 25, 2025, that its previously disclosed tender offer to acquire Japan's Shibaura has received approval from Taiwan's...
Friday 27 June 2025
ASML bets on High-NA EUV as Intel, TSMC, Samsung delay mass adoption over cost and risk
ASML, the world's sole provider of extreme ultraviolet (EUV) lithography machines, is pressing ahead with its next-generation High-NA (numerical aperture) EUV systems—even as...
Friday 27 June 2025
Taiwan enlists Micron to lead central region manufacturing upgrade
Taiwan's government unveiled a plan to transform four central counties into global smart manufacturing hubs, with chipmaker TSMC and memory giant Micron Technology leading smaller...
Friday 27 June 2025
TSMC takes all: Google follows major smartphone chipmakers in embracing 2nm
Recent market reports indicate that leading companies such as Apple, Qualcomm, and MediaTek are highly likely to fully adopt 2nm chips by 2026. Google, having recently shifted its...
Friday 27 June 2025
Chip makers cash in on sixfold price surge from legacy memory shortage
NAND flash producers are reaping windfall profits from discontinued older chips as supply shortages push prices for legacy products to levels rivaling advanced semiconductors. The...
Friday 27 June 2025
SK Hynix debuts 16-layer HBM4, set to power AI chips in 2026
At HPE Discover 2025, SK Hynix unveiled its 16-layer sixth-generation high bandwidth memory (HBM4) for the first time, aiming to maintain its technological leadership in the HBM4...