CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Thursday 16 July 2026
CXMT IPO raises fresh capital, but its own prospectus map shows distance still to close
The IPO prospectus filed by Changxin Memory Technologies (CXMT) ahead of its planned listing on Shanghai's STAR Market offers an unusually candid portrait of the global DRAM industry...
Thursday 16 July 2026
Groups urge EU interim measures against Broadcom amid VMware antitrust case

A European industry group, the Cloud Infrastructure Services Providers in Europe (CISPE), has joined four other trade organizations...

Thursday 16 July 2026
MCU lead times stretch, but industry holds the line against a pandemic-style order rush

Microcontrollers (MCUs), widely used across industrial automation, medical devices, and consumer electronics, are experiencing longer...

Thursday 16 July 2026
Cadence launches agentic AI platform for PCB and package design
Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging...
Thursday 16 July 2026
Baiwei Storage forecasts sharp first-half profit surge on AI memory demand
Shenzhen Baiwei Storage Technology said its first-half 2026 revenue and profit are likely to rise sharply, highlighting how the global AI boom is reshaping demand for memory chips...
Thursday 16 July 2026
Hanmi, Hanwha clash in court over HBM equipment patents
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically...
Thursday 16 July 2026
India trims chip subsidies but widens their reach as it courts electronics supply chain away from China
India approved two large incentive packages on July 15 that together recast how New Delhi subsidizes electronics manufacturing: learner-per-project chip subsidies spread across a much...
Thursday 16 July 2026
CXMT outspends all peers on R&D as a share of revenue, IPO filing shows

Across almost every competitive metric disclosed in its STAR Market IPO prospectus, Changxin Memory Technologies (CXMT) trails the...

Thursday 16 July 2026
China's TPU path gains traction with low-cost AI inference challenging GPU economics

Generative AI applications are expanding rapidly, making computing costs a growing bottleneck to commercial AI deployment. The AI accelerator...

Thursday 16 July 2026
Samsung weighs outsourcing Google TPU back-end design as 2nm demand grows

Samsung Electronics is considering outsourcing some or all of the back-end design work for an input/output die in Google's reported...

Thursday 16 July 2026
CXMT IPO filing reveals Micron and Samsung alumni at heart of China's DRAM push

The IPO prospectus of Changxin Memory Technologies (CXMT), filed ahead of a planned listing on Shanghai's STAR Market, lays bare the...

Thursday 16 July 2026
Korean prosecutors raid Rambus, Montage, and Renesas as memory-interface chip probe goes global
South Korean prosecutors have opened a criminal front in a widening international investigation into alleged price-fixing of the small but critical chips that link AI processors to...
Thursday 16 July 2026
Jensen refutes Vera Rubin's delay, continuing Nvidia's running rebuttal of the rumor mill

Nvidia co-founder and chief executive Jensen Huang used a developer event in Tokyo on July 15 to reject reports that manufacturing...

Thursday 16 July 2026
Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem

CXMT's STAR Market IPO has become more than a fundraising exercise. The strategic placement roster shows how China's largest DRAM maker...

Thursday 16 July 2026
Commentary: Chip lead times extend as cloud AI squeezes capacity
Reports of longer chip lead times have been mounting. ADI has notified customers that, as recovering demand tightens supply, lead times for some analog chip products have stretched...