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Thursday 12 March 2026
Nvidia invests US$2 billion in Nebius to build next-generation hyperscale AI cloud
Nvidia and Nebius Group announced a strategic partnership to develop and deploy a next-generation hyperscale cloud for the AI market, designed to serve both AI-native and enterprise...
Thursday 12 March 2026
Daxin expands capacity to meet rising semiconductor material demand
Daxin, a key player in semiconductor materials, has seen rapid growth in recent years. Currently, wafer process materials account for a larger share of revenue than advanced packaging...
Thursday 12 March 2026
Jiu Han targets NT$10B revenue by 2030 with NT$11.6B orders in 1Q26
Jiu Han System Technology, a leading cleanroom and turnkey project contractor, reported strong profit growth in 2025 driven by peak construction periods and approval for large-scale...
Thursday 12 March 2026
AI demand tightens supply of high-end MLCCs; Nichidenbo sees limited US-Iran impact on tantalum capacitors
Managing director Yao-Kuo Yu of Nichidenbo, a passive component distributor, stated that the AI industry's growing demand for passive components continues to tighten supplies of high-end...
Wednesday 11 March 2026
MediaTek Genio platform launches new 3nm flagship targeting high-end AIoT image processing demands
This week at Embedded World 2026 in Nuremberg, Germany, MediaTek unveiled a series of new Genio platforms designed to empower various Internet of Things (IoT) products and applications,...
Wednesday 11 March 2026
WT Microelectronics posts 89% revenue surge in 2 months on AI and market recovery
IC distributor WT Microelectronics reported consolidated preliminary revenue of NT$104.4 billion (US$3.28 billion) for February 2026, up about 29% year over year. For the first two...
Wednesday 11 March 2026
ASE breaks ground on AI advanced packaging site in Southern Taiwan, set for 2Q28 completion
ASE Technology Holding has broken ground on its third technology park in Nanzi, Kaohsiung, focused on advanced semiconductor packaging and smart logistics, with construction to start...
Wednesday 11 March 2026
Samsung Taylor fab reportedly targets HPC, automotive chips; clients reach 121

Samsung Electronics plans to focus its new foundry plant in Taylor, Texas, on high-performance computing (HPC) and automotive semiconductors...

Wednesday 11 March 2026
JCET opens automotive and robotics chip packaging plant in Shanghai Lingang

JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics...

Wednesday 11 March 2026
Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says
Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the...
Wednesday 11 March 2026
Japan's investment list targets AI, quantum computing, and semiconductors
Japan selected 61 products and technologies for priority investment, including 27 items already under early review, such as physical AI systems, regenerative medicine, quantum computing,...
Wednesday 11 March 2026
Sercomm expects memory shortages and price hikes to last until end of 2026
Sercomm chairman James Wang predicted that memory shortages and price increases will persist through the end of 2026, influenced by Middle East conflicts affecting AI data center investments...
Wednesday 11 March 2026
Texas Instruments reportedly plan analog chip price hikes

Market sources say analog chip design leader Texas Instruments (TI) is preparing to raise prices on a range of semiconductor products...

Wednesday 11 March 2026
China reportedly accelerating nuclear expansion while Western revival faces structural challenges

The rapid growth of artificial intelligence (AI) and data centers is driving a sharp rise in global electricity demand, renewing interest...

Wednesday 11 March 2026
Applied Materials partners with Micron, SK Hynix on US$5B AI memory R&D hub

Applied Materials has partnered with memory chipmakers Micron Technology and SK Hynix to develop next-generation memory technologies for...