中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED CHIPS + COMPONENTS
    Wednesday 9 September 2026
    Realtek expands Wi-Fi 8, optical communications, ASICs, keeps Nvidia partnership low-profile
    ITRI held its 15th Laureate Ceremony on September 7, honoring three new laureates in 2026: TSMC executive vice president and co-COO Y.P. Chyn, Realtek chairman Sun-Chien Chiu, and...
    Wednesday 9 September 2026
    Samsung's Taylor fab reportedly fully booked before 2nm production begins
    Samsung Electronics' Taylor foundry fab in Texas has reportedly reached full booking before 2nm volume production begins, signaling stronger demand for the company's incoming US advanced-node...
    Wednesday 9 September 2026
    Lotte Energy Materials pivots from EV weakness to AI, ESS copper foil
    Cooling electric vehicle demand is forcing South Korean copper foil makers to rethink capital and capacity. Lotte Energy Materials has sold a 90% stake in its architectural exterior...
    Wednesday 9 September 2026
    LCD supply could tighten by 2028 as Taiwan sells its fabs to chipmakers
    LCD panel supply could tighten around 2028 as Taiwan manufacturers exit the segment faster than expected, while China uses profits from LCD to ramp OLED investment. The shift is being...
    Tuesday 8 September 2026
    Ma-tek August revenue hits record, eyes U.S. FA, MA service in 2027
    MA-tek, a semiconductor testing and analysis company, reported August revenue of NT$565 million, up 17.78% from a year earlier and marking a record high for the sixth straight month...
    Tuesday 8 September 2026
    US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
    South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
    Tuesday 8 September 2026
    PCB maker Zhen Ding tops US$634M August revenue on AI server, optical module demand
    PCB maker Zhen Ding Technology (ZDT) said business momentum is accelerating as demand strengthens during the traditional peak season. In addition to continued stocking for new mobile...
    Tuesday 8 September 2026
    What to expect at CIOE 2026, Shenzhen's optoelectronics mega-expo
    This week, DIGITIMES heads to Shenzhen to cover an expo showcasing the world of optoelectronics, a class of technologies that serves as the link between electricity and light. In today's...
    Tuesday 8 September 2026
    US chip investment push puts ownership at center of Korea's $200 billion deal

    A US push for additional Korean semiconductor manufacturing investment has entered bilateral negotiations just as the first project under...

    Tuesday 8 September 2026
    Samsung speeds silicon photonics test plan with TSMC-vetted probe vendors
    Samsung Electronics has moved to accelerate its silicon photonics push by using the same test partners selected by Taiwan Semiconductor Manufacturing Co. for key validation work, according...
    Tuesday 8 September 2026
    CXMT sees tight DRAM supply through 2H26, accelerates server memory and China-made tool validation
    Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the...
    Tuesday 8 September 2026
    ChenFull Precision expands from defense and semiconductor equipment into quantum computing
    ChenFull Precision has expanded rapidly in recent years from traditional precision manufacturing operations such as welding and surface treatment into the semiconductor process equipment...
    Tuesday 8 September 2026
    ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
    ASML issued joint statements with Intel Foundry, TSMC and Samsung Electronics on September 8, converging the three leading-edge chipmakers on a transition from the semiconductor industry's...
    Tuesday 8 September 2026
    CPO testing faces hurdles from Insertion 1 to 4, with '100% testing' expected to accelerate in 2027
    Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different...
    Tuesday 8 September 2026
    Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

    Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

    26/442 pages
    biz
    BIZ FOCUS
    Sep 24, 08:00
    FSP Debuts World's First 80 PLUS Ruby ATX PSU
    Wednesday 23 September 2026
    The Robot in the Supply Chain
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    Tuesday 22 September 2026
    AT&S Unveils Strategy to Drive AI Growth
    reportAIglasses