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Thursday 2 April 2026
Interview: How Europe's two-year AI lag is becoming a security liability
While North America and Asia race to deploy "physics-bending" AI hardware, Europe has opted for a "wait-and-see" approach, shielded by thick layers of regulation. In a DIGITIMES...
Thursday 2 April 2026
Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026
Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D...
Thursday 2 April 2026
Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior...

Thursday 2 April 2026
TSMC says COUPE platform set for production as Samsung outlines SiPh push

TSMC said its COUPE silicon photonics platform is set to enter volume production this year, as rising demand for high-speed interconnects...

Thursday 2 April 2026
Top 10 Chart: Markets signal AI shift as Taiwan IC designers decouple from early-year revenues

Taiwan's IC design sector is undergoing a decisive shift in 2026, with capital markets effectively validating an industry transition toward...

Wednesday 1 April 2026
Samsung auctions 123 chip tools during Xi'an NAND upgrade to V8
Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi'an as it shifts to more advanced process...
Wednesday 1 April 2026
SiPh and advanced packaging shine at Touch Taiwan
The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that...
Wednesday 1 April 2026
Nexchip applies for HK listing amid mature-node expansion
Chinese semiconductor foundry Nexchip has applied to list on the Hong Kong Stock Exchange's Main Board, Guandian.cn reported on March 31, as the company moves to consolidate...
Wednesday 1 April 2026
Fujitsu plans 1.4nm AI chip Japan-based production with Rapidus
Fujitsu plans to develop a 1.4nm artificial intelligence (AI) chip and outsource its production to Rapidus in Japan, according to Nikkei. The chip is designed for use in servers...
Wednesday 1 April 2026
AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy
Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment...
Wednesday 1 April 2026
South Korean chipmakers stockpile helium, diversify supply beyond Qatar
South Korean semiconductor manufacturers hold enough helium inventory to sustain production through at least June, easing concerns over potential supply disruptions, according to government...
Wednesday 1 April 2026
TSMC eyes SiPh breakthrough as industry consensus forms
TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
Wednesday 1 April 2026
Micron reportedly developing stacked GDDR to address shifting AI memory demand

Micron is reportedly developing vertically stacked graphics DRAM (GDDR) products to address shifting AI memory demand, according to...

Wednesday 1 April 2026
India accelerates semiconductor push with Kaynes plant launch
India is stepping up its semiconductor ambitions as a new domestic plant begins production, underscoring efforts to build a resilient supply chain and position the country as a global...
Wednesday 1 April 2026
SDI targets AI and heat spreader growth
Power leadframe manufacturer SDI said it is benefiting from the gradual ramp-up of new applications related to artificial intelligence (AI), with around 40 new AI product projects...