King Yuan Electronics (KYEC) has signed a prepayment agreement with Nvidia to support its wholly owned US subsidiary, AeternZ, in building local testing capacity, giving Nvidia early...
Taiwanese semiconductor testing services provider King Yuan Electronics (KYEC) is expanding its US footprint, with its board approving an advance payment agreement with Nvidia. Under...
China-based automakers are mounting an aggressive push into Europe, enjoying rapid early momentum. However, supply chain analysts note that the ultra-fast development model perfected...
AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
NTT Data and Anthropic are in final-stage negotiations to develop a data center in Osaka, Japan, with power capacity of up to 500MW, according to Nikkei. The project would...
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
Taiwan's semiconductor and information and communications technology industries are drawing engineering graduates into high-paying jobs, intensifying a shortage of doctoral students...
Hong Kong International Airport and Japan Airlines (JAL) Group are expanding sea-air and rail-air logistics networks to increase passenger and cargo flows, address transport bottlenecks...
ASE reported September revenue of NT$88.13 billion (US$2.7 billion), up 7.15% month-over-month and 45.52% year-over-year, marking a record high for the third consecutive month. Third-quarter...
Taisic Materials, a Foxconn-backed company under Kenmec Group, operates 65 crystal-growth furnaces as it expands silicon carbide (SiC) ingot and substrate production for AI data centers,...
Chenbro, a leading professional server chassis manufacturer, announced today its participation in the OCP Global Summit 2026, taking place from October 13 to 15 in San...
Samsung Electronics has begun dispatching advanced-process yield engineers from South Korea to its Taylor, Texas, foundry ahead of planned 2nm chip volume production in 2027, South...
As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention...
Rising capital expenditures by global cloud service providers (CSPs) are accelerating orders for AI computing infrastructure, boosting both the specifications and volumes of passive...
Nvidia and Cisco have introduced a new pluggable optics form factor to expand AI infrastructure without sharply increasing power use or network complexity. For global cloud operators,...
