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Wednesday 28 October 2026
Corning's AI fiber growth puts capacity delivery, customer funding in focus
Corning's third-quarter results show optical networking becoming a larger driver of the materials maker's business as AI infrastructure expands. Stronger sales and profitability support...
Wednesday 28 October 2026
SK Hynix's record quarter shows AI demand turning memory into a contracted, supply-limited business
SK Hynix's third quarter suggests that, for now, the memory industry's familiar boom-and-bust pattern is giving way to something closer to a contracted, supply-constrained business...
Wednesday 28 October 2026
Simmtech steps up SOCAMM investment as BT substrate supply tightens
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion...
Wednesday 28 October 2026
Semiconductor equipment is not AI chip growth's biggest bottleneck
AI is driving a steady upward revision in chip demand, but semiconductor equipment shortages are not the biggest obstacle to expanding AI chip production, according to industry sources...
Wednesday 28 October 2026
TLB develops SOCAMM3 substrates; Vietnam plant to break ground
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
Wednesday 28 October 2026
Google prioritizes frontier AI as cloud capacity runs short
Google recently unveiled its flagship AI model, Gemini 4 Argon. The model consumed an unprecedented 25 trillion tokens within 72 hours of launch—three times the volume recorded...
Wednesday 28 October 2026
Goke Microelectronics raises KGD packaging prices again
China-based IC design firm Goke Microelectronics will raise prices for its Known Good Die (KGD) packaged products by US$0.5 to US$1.5 per unit from November 2026, depending on capacity...
Wednesday 28 October 2026
MiCo Ceramics acquires idle LGD plant for KRW150 billion to boost semiconductor component capacity
South Korean semiconductor equipment component maker MiCo Ceramics is set to acquire an idle facility in Gumi, North Gyeongsang Province, from LG Display (LGD) for KRW150 billion (approx...
Wednesday 28 October 2026
CXMT reportedly prioritizes China demand, rejecting Apple's DRAM inquiry
China's CXMT has reportedly declined Apple's inquiry about purchasing DRAM, prioritizing supply to domestic customers instead. As global memory supplies tighten and prices rise, the...
Wednesday 28 October 2026
Macronix posts record 3Q26 profit as gross margin hits 70%
Memory maker Macronix International set a new quarterly record in the third quarter of 2026, with gross margin reaching 70.5% and net profit after tax totaling NT$109.5 billion (approx...
Wednesday 28 October 2026
Analysis: 3M's investment in Genius Electronic Optical puts EBO mass production to the test
US materials giant 3M recently entered into a strategic partnership with Taiwanese optical component manufacturer Genius Electronic Optical (GSEO), with plans to acquire a 4.7% stake...
Wednesday 28 October 2026
Analysis: What happens if Claude demand cools before its compute bills do?
Anthropic's IPO filing presents a company growing quickly enough to justify one of the AI industry's most aggressive infrastructure buildouts. But buried in the prospectus is a less...
Tuesday 27 October 2026
Anthropic IPO filing exposes massive compute buildout spanning TPUs, GPUs, and dedicated data centers
Anthropic's IPO filing reveals an infrastructure strategy extending far beyond conventional cloud procurement, as the Claude developer locks in hundreds of billions of dollars of compute...
Tuesday 27 October 2026
PSMC capacity crunch holds back Jeju Semiconductor's growth
South Korean memory chip designer Jeju Semiconductor is struggling to secure enough wafer capacity from Taiwan's Powerchip Semiconductor Manufacturing (PSMC), limiting its sales growth...