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Wednesday 9 September 2026
Samsung-led EUR3B funding round nearly doubles Mistral's valuation
French AI startup Mistral has raised EUR3 billion (US$3.5 billion) in a funding round led by Samsung Electronics, nearly doubling its valuation as the company seeks to strengthen its...
Wednesday 9 September 2026
Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage
Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure...
Wednesday 9 September 2026
CSPs expand Malaysia AI server hubs as Southeast Asia grows
According to the latest DIGITIMES Intelligence report, US-based cloud service providers (CSPs) are expanding their footprint in Malaysia, with Microsoft and Google driving the next...
Wednesday 9 September 2026
WinWay revenue surges on AI chip pin-count demand
Semiconductor test interface maker WinWay said AI-related orders drove August 2026 revenue to NT$1.706 billion (US$53.8 million), up more than 2x year-over-year and a record high for...
Wednesday 9 September 2026
OpenAI taps Firmus for Malaysia data center capacity
OpenAI has signed a multi-year agreement with Australian AI infrastructure developer Firmus for dedicated computing capacity at two data center sites in Malaysia, becoming an anchor...
Wednesday 9 September 2026
Samsung's Taylor fab reportedly fully booked before 2nm production begins
Samsung Electronics' Taylor foundry fab in Texas has reportedly reached full booking before 2nm volume production begins, signaling stronger demand for the company's incoming US advanced-node...
Wednesday 9 September 2026
Lotte Energy Materials pivots from EV weakness to AI, ESS copper foil
Cooling electric vehicle demand is forcing South Korean copper foil makers to rethink capital and capacity. Lotte Energy Materials has sold a 90% stake in its architectural exterior...
Wednesday 9 September 2026
LCD supply could tighten by 2028 as Taiwan sells its fabs to chipmakers
LCD panel supply could tighten around 2028 as Taiwan manufacturers exit the segment faster than expected, while China uses profits from LCD to ramp OLED investment. The shift is being...
Tuesday 8 September 2026
SmallSat 2026: Two bottlenecks and four trends reshaping satellite industry
The 40th Annual Small Satellite Conference, held August 23-26, 2026, in Salt Lake City, capped what has been a productive year for the space industry, marked by new payload technologies,...
Tuesday 8 September 2026
US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
Tuesday 8 September 2026
PCB maker Zhen Ding tops US$634M August revenue on AI server, optical module demand
PCB maker Zhen Ding Technology (ZDT) said business momentum is accelerating as demand strengthens during the traditional peak season. In addition to continued stocking for new mobile...
Tuesday 8 September 2026
CXMT sees tight DRAM supply through 2H26, accelerates server memory and China-made tool validation
Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the...
Tuesday 8 September 2026
Advantech to open North America HQ and expand US manufacturing
Advantech will open its new North America headquarters campus in Tustin, California, on October 21, Taipei time, adding localized manufacturing and service capacity as demand linked...
Tuesday 8 September 2026
Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

Tuesday 8 September 2026
Samsung allocates more than half of 4nm foundry capacity to HBM4
Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...