The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...
As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its efforts in advanced packaging and silicon photonics (SiPh)...
United Microelectronics Corporation (UMC) reported a moderate revenue increase in the fourth quarter of 2025, driven by favorable currency exchange rates and growth in its 22/28nm...
Microsoft's latest financial results point to accelerating demand for AI and cloud infrastructure, with Intelligent Cloud growth approaching 30% year on year. The figures underline...
As artificial intelligence (AI) and high-performance computing (HPC) expand rapidly, the global semiconductor industry is redirecting investments from advanced process nodes to advanced...
Seagate Technology posted record revenue, profit, and total storage capacity shipped in the second quarter of fiscal year 2026 (2QFY26, ended January 2), fueled by strong AI-driven...
ASML Holding's management says demand tied to artificial intelligence is proving more durable than previously expected, with customers accelerating capacity planning that is likely...
ASML reported stronger-than-expected bookings in the fourth quarter of 2025 as customers stepped up investment in artificial intelligence chipmaking capacity, according to Reuters...
ASML Holding NV (ASML) reported record financial results for 2025, supported by a significant rebound in fourth-quarter bookings as semiconductor manufacturers increased investments...
In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...
Memory giant Macronix (MXIC) has decided to resume its capital expenditure plan, allocating NT$22 billion (approx. US$704 million) in 2026 to aggressively expand its severely short-supplied...
TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers now face mounting pressure to diversify supply chains due...
Corning and Meta Platforms have agreed to a multiyear deal valued at up to US$6 billion to supply optical fiber, cable, and connectivity solutions for Meta's US data center expansion...
Samsung Electronics is emerging as the leading supplier of sixth-generation High Bandwidth Memory (HBM4) to Nvidia and AMD as of February 2026, backed by growing confidence in its...
