Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates...

PCB drill bit maker Topoint Technology saw its net profits decline 49.5% from a year earlier to NT$31 million (US$1 million) in the first quarter of 2019, with capacity utilization...

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post a revenue increase of 17-19% sequentially in the second quarter of 2019, with gross...

Taiwan IC designers are now moving to place additional orders with foundry houses and thicken their inventories lest they should suffer insufficient foundry capacity support in the...

Japan's Meiko Electronics has reportedly obtained major substrate-like PCB (SLP) orders from Samsung Electronics for its Galaxy devices, and plans to build additional SLP production...

Copper-clad laminate (CCL) specialist Iteq has reported net profit surged 40.4% from a year earlier to NT$506 million (US$16.4 million) in the first quarter of 2019. EPS for the quarter...

DMS (design and manufacturing services) provider Universal Scientific Industrial (USI) will continue focusing on enhancing its technologies such as system-in-package (SiP) for modular...

MOSFET chip specialist Excelliance MOS has reported net profits slipped 3.5% sequentially but surged 49% from a year earlier to NT$69.62 million (US$2.25 million) in the first quarter...

Taiwan PCB makers have to strengthen their investment in R&D of high-end processes to extend their technological lead over Chinese rivals who are fast catching up, CM Lee, chairman...

Global PV module production capacity will expand 30% annually to an estimated 234GWp by year-end 2019, 80% in excess of the global demand of 130GWp in the year, according to China...

The total memory market heavily influenced total IC market growth for the positive during the past two years but will likely have a very negative impact on total IC market growth...

Taiwan's supply chain makers for LCD manufacturing equipment and materials are set to see their sales momentum continue in 2019, with most of them having enjoyed strong sales last...

GlobalWafers' Novara plant in Italy dedicated to making 8-inch silicon wafers became the largest supplier of 8-inch silicon wafers in Europe in 2018, with a 24% market share, according...

Despite a ramp-up of orders for 7nm chips, TSMC is still seeing orders for other advanced process nodes remain sluggish which has kept its overall 12-inch fab capacity in oversupply,...

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...

Taiwan-based Tripod Technology has disclosed it has signed a contract worth NT$2 billion (US$64.8 million) for the construction of additional production lines at its manufacturing...

Powertech Technology (PTI) expects to post flat or slight sequential growth in revenues for the second quarter, followed by a substantial increase in the third quarter, accordin to...

TSMC will see its 7nm process utilization rate climb substantially in the second half of 2019, driven by a seasonal pick-up in demand for smartphones, as well as chip demand for HPC,...

Samsung Electronics has announced that its 5nm FinFET process technology is complete in its development and is ready for customers' samples.

Electric scooter (e-scooter) vendor Gogoro will invest NT$5.8 billion (US$188 million) to expand the network of its battery-swapping stations in Taiwan from 1,195 currently to 1,500...

Unclear product positioning and customer orders will likely leave a substantial portion of production capacity idle in China's IC foundry sector, where more 12- and 8-inch fabs are...

Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...

Asia Tech Image expanded monthly CIS (contact image sensor) production capacity at its factory in Myanmar to 900,000 modules at year-end 2018, and keeps expanding it to 1.10-1.15...

LFoundry, a Semiconductor Manufacturing International (SMIC) company, has entered into a binding agreement with SMIC for the latter to sell all of its stakes in the former to Jiangsu...

COG (chip-on-glass) packaging demand has picked up recently as some Taiwan-based suppliers of TDDI (touch and display driver integrated) chips adopt the method to replace COF (chip-on-film)...