Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials...
STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...
Global AI growth continues unabated, with Delta Electronics emerging as a key indicator of demand for AI server power and cooling systems. At its latest investor meeting, chairman...
Amazon highlighted its growing investments in artificial intelligence (AI) and cloud infrastructure during its third-quarter 2025 earnings call, underscoring a significant acceleration...
Australian rare earths producer Lynas Rare Earths announced plans to increase heavy rare earth processing capacity at its Malaysian facility to meet growing market demand. The company...
India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...
With newly added production capacity in place, growth in AI product shipments, and continued average selling price (ASP) increases, Lite-On achieved strong profits in the third quarter...
Memory chipmaker MXIC reported a net loss of NT$862 million (US$28.1 million) in the third quarter of 2025, marking its ninth consecutive quarterly deficit. Chairman Miin Wu candidly...
Microsoft kicked off its 2026 fiscal year with another blockbuster quarter. First quarter fiscal 2026 revenue reached US$77.7 billion, up 18% year-over-year, while operating income...
Meta Platforms' leadership has reaffirmed the company's deep commitment to advancing artificial intelligence, emphasizing large-scale infrastructure expansion and continued investment...
Apple's mobile DRAM orders are expected to increase significantly in 2026, and the South Korean industry predicts that Samsung Electronics will be the largest beneficiary. News...
Intel is planning to relocate part of its assembly, packaging, and testing capacity to Vietnam as part of a global strategic adjustment aimed at optimizing its manufacturing layout...
Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
Although the LCD industry supply chain has begun moving from China to Vietnam in the past two years, front-end panel processes remain mainly in China or Taiwan. Sarah Lin, president...
