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Thursday 9 April 2026
AI chip demand tightens ABF substrate supply, three-year upcycle in sight
As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously,...
Thursday 9 April 2026
Silicon Motion warns AI-driven NAND shortages will deepen in 2027, reshaping memory market
Silicon Motion said AI-driven NAND supply constraints are causing structural shifts in the memory industry and warned the imbalance will worsen in 2027 as cloud service provider demand...
Wednesday 8 April 2026
Europe's battery ambitions shrink as costs and China's dominance loom

Driven by the rapid shift toward automotive electronics and electrification, Europe moved earlier than the United States to localize lithium...

Wednesday 8 April 2026
Chinese SSD maker DapuStor sees rising QLC demand as AI drives storage growth
Chinese enterprise SSD (eSSD) maker DapuStor entered its IPO subscription phase in early April 2026, driven by rapid expansion in AI infrastructure. The company recently observed multiple...
Wednesday 8 April 2026
SK Hynix begins supply of 321-layer QLC cSSD for the AI PC era
SK Hynix has started global shipments of a next-generation compact SSD designed for AI-driven personal computers, a move that could reshape storage choices for device makers and end...
Wednesday 8 April 2026
Analysis: ASML earnings preview; SK Hynix and TeraFab already facing EUV capacity difficulties
Compared to short-term geopolitical turbulence, the AI megatrend represents a once-in-a-generation business opportunity. In the past, TSMC often took the lead during earnings season...
Tuesday 7 April 2026
FOPLP and WMCM emerge as key to fan-out packaging competitive field
The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
Tuesday 7 April 2026
Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers...

Tuesday 7 April 2026
MediaTek, Qualcomm reportedly cut smartphone AP orders with TSMC
Amid soaring memory prices, manufacturers have repeatedly lowered 2026 shipment targets for smartphones, PCs, and other consumer electronics, triggering a ripple effect across the...
Tuesday 7 April 2026
PCB bottlenecks, freight costs push electronics prices higher
The global electronics supply chain is facing a cost shock not seen in years. War in Iran, surging AI demand, and tight capacity are simultaneously driving up prices across raw materials,...
Tuesday 7 April 2026
Anthropic secures 3.5 GW of next-gen compute via landmark alliance with Google and Broadcom

Anthropic, Google, and Broadcom today announced a massive expansion of their strategic partnership, unveiling a multi-year roadmap that secures...

Tuesday 7 April 2026
CCL expansion triggers equipment shortages; lead times extend up to two years
Driven by applications such as AI high-speed computing, electric vehicles (EVs), and 5G/6G communications, demand for high-frequency, high-speed PCB materials has surged. Copper-clad...
Monday 6 April 2026
China 2.5D packaging demand surges, supporting Korean backend equipment growth
China's semiconductor equipment market is emerging as a critical growth engine for South Korean suppliers, driven by accelerating AI deployment and tighter restrictions on US vendors...
Monday 6 April 2026
India roundup: India ramps up electronics and chip ambitions with new approvals, local fabs, and supply chain curbs

India is accelerating its push to build a self-reliant electronics and semiconductor ecosystem,...

Sunday 5 April 2026
E Ink rides AI-driven power surge as energy concerns boost e-paper demand
E Ink Holdings (EIH) posted record revenue and operating profit in 2025, as rising AI-related power demand and energy constraints are driving adoption of low-power display technologies,...