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Thursday 5 November 2026
Syntec Technology's new factories in India, Malaysia to push capacity to more than double in 2027
Syntec Technology is actively advancing its global production capacity expansion and artificial intelligence (AI) technology deployment. The company announced on November 4 that its...
Thursday 5 November 2026
CXMT prepayments surge 16x with DRAM shortage lifting market share
Global memory supply constraints are creating opportunities for Chinese DRAM maker CXMT to expand its market share. As major international manufacturers prioritise high-bandwidth memory...
Thursday 5 November 2026
Corning starts optical connectivity output in western India, plans larger adjacent plant for 2027
Corning's move to begin making optical connectivity products in Pune and add a larger adjacent plant by 2027 shows the AI-driven surge in data center fiber demand, so far strongest...
Thursday 5 November 2026
Qualcomm wins Starlink Mobile infrastructure deal as SpaceX advances terrestrial network
Qualcomm has secured a role in SpaceX's planned US terrestrial mobile network, turning Starlink Mobile's ambitions for integrated satellite and ground-based connectivity into a named...
Thursday 5 November 2026
FPT starts chip-testing plant trials in northern Vietnam, plans packaging expansion
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging...
Thursday 5 November 2026
Google commits US$15 billion to expand Malaysian data centers in 2027 and 2028
Google's plan to invest US$15 billion in Malaysia over 2027 and 2028 deepens its bet on what AFP calls Southeast Asia's fastest-growing data center hub, and ties the expansion to commitments...
Thursday 5 November 2026
GlobalFoundries revenue rises 13% as data center demand offsets mobile decline
GlobalFoundries' third quarter showed the contract chipmaker's revenue base shifting from smartphones to AI-related networking, and that shift is now boosting profitability. Revenue...
Thursday 5 November 2026
Chicony Power profit hit by notebooks in Q3 2026
Chicony Power Technology Co. reported weaker quarterly results in the third quarter of 2026 as slowing notebook demand and severe memory shortages among customers weighed on performance...
Thursday 5 November 2026
Murata, Samsung Electro-Mechanics reportedly secure Winbond's silicon capacitor capacity
Murata Manufacturing and Samsung Electro-Mechanics (Semco) have reportedly secured silicon capacitor production capacity from Winbond Electronics to meet demand from their end customers,...
Thursday 5 November 2026
From assembly lines to front lines, defense opens new opportunities for automakers
As low capacity utilization, steep tariffs, and fierce competition from Chinese automakers pressure the industry, significant growth in European defense spending is opening new business...
Thursday 5 November 2026
Nvidia DSX POD leads modular wave as Taiwanese firms race into AI data-center integration
As AI data center construction continues to scale up, shortening build times and bringing computing capacity online faster have become key priorities for cloud service providers (CSPs)...
Wednesday 4 November 2026
Raydium faces 4Q26 slowdown after AI capacity fears fuel customer stockpiling
Display driver IC designer Raydium Semiconductor reported consolidated revenue of NT$6.57 billion (≈ US$200 million) for the third quarter of 2026, down 3.8% sequentially but...
Wednesday 4 November 2026
Samsung to reportedly make AMD, Nvidia HBM base dies at second Texas fab
Samsung Electronics plans to produce high-bandwidth memory (HBM) base dies for AMD at its second foundry plant in Taylor, Texas, with the US chipmaker accounting for most of the facility's...
Wednesday 4 November 2026
AI flash could cost 90% less per GB to make than HBM4 but squeeze NAND supply
High Bandwidth Flash (HBF) could give AI accelerators more memory at roughly one-tenth the manufacturing cost per gigabyte of HBM4. But producing it could consume far more wafer capacity...
Wednesday 4 November 2026
High-speed optical communications drive demand for mSAP competition among Taiwan PCB makers
As AI computing clusters continue to expand, data centers are demanding higher transmission speeds and greater bandwidth. To overcome the manufacturing bottlenecks of traditional high-density...