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    Samsung's trademark win leads TCL to drop 'NXT FRAME' at CES 2026
    3h 1min ago
    Memory prices surged, pressuring smartphone makers in early 2026
    3h 1min ago
    China launches anti-dumping probe on Japanese dichlorosilane amid local alternatives
    3h 1min ago
    China tests US-Japan-South Korea alliance with export controls
    3h 1min ago
    Google and Samsung team up to launch Android into wearable market in 2026
    3h 2min ago
    China's auto market sees disguised price cuts despite recent pricing ban
    3h 2min ago
    NEWS TAGGED CAPACITY
    Tuesday 6 January 2026
    Samsung to restart construction of Pyeongtaek P5 chip plant

    Samsung Electronics will resume structural construction at its Pyeongtaek P5 semiconductor plant next month. The company halted the project last...

    Tuesday 6 January 2026
    China accelerates semiconductor self-sufficiency through foundry M&A: updates on Hua Hong, SMIC
    China's semiconductor sector is entering a new phase of domestic consolidation, as leading foundries Hua Hong Semiconductor and SMIC move to tighten control over key manufacturing...
    Tuesday 6 January 2026
    HKC reportedly eyes OLED debut as industry pivots to bigger panels
    HKC, a major Chinese display manufacturer, is weighing a potential entry into organic light-emitting diode production through a proposed sixth-generation facility. The move would...
    Tuesday 6 January 2026
    Chang Wah interview: strong lead frame growth despite precious metals shortage
    Post-pandemic inventory digestion for mature semiconductor processes has come to an end. Market conditions have rebounded amid tariff-hedging and precautionary stocking, driving Taiwan's...
    Monday 5 January 2026
    Inpaq CEO Pei-Jen Chen launches resource realignment plan
    Inpaq Technology, a passive components maker under the Walsin Technology Group, has launched an internal resource realignment plan. Newly appointed CEO and president Pei-Jen Chen...
    Monday 5 January 2026
    Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

    China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing...

    Monday 5 January 2026
    NAFCO posts record December revenue and is optimistic for 2026
    The National Aerospace Fasteners Corporation (NAFCO) revenue for December 2025 hit a new record of NT$405 million (approx. US$12.9 million), up 7.84% month-over-month and 19.61% year-over-year...
    Monday 5 January 2026
    SK On slows investment and delays Seosan factory expansion with EV market uncertainty
    SK On, a battery unit of SK Innovation, has scaled back its investment plans and postponed the expansion of its new factory in Seosan, Chungcheongnam-do, South Korea, due to a slowdown...
    Monday 5 January 2026
    TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
    As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
    Monday 5 January 2026
    Taiwan ramps up drone procurement in 2026, testing mass-production capacity
    Taiwan is set to dramatically scale up its military drone production starting in 2026 as the Ministry of National Defense prepares to order nearly 50,000 units, a move intended to...
    Monday 5 January 2026
    India roundup: OSAT players claim legacy packaging price parity

    Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor...

    Saturday 3 January 2026
    Chang Wah accelerates Asia expansion as chip packaging booms
    Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity...
    Friday 2 January 2026
    Memory shortages to persist through 2026 as AI server demand surges

    Global memory markets are expected to remain tight through 2026 as aggressive spending by cloud service providers (CSPs) on AI infrastructure...

    Friday 2 January 2026
    IC substrates and networking PCBs grow; materials and equipment face shortages
    The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...
    Friday 2 January 2026
    China's CXMT moves toward IPO with global DRAM share nearing 4%
    China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to...
    2/50 pages
    NTN special report
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
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