In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...
Memory giant Macronix (MXIC) has decided to resume its capital expenditure plan, allocating NT$22 billion (approx. US$704 million) in 2026 to aggressively expand its severely short-supplied...
TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers now face mounting pressure to diversify supply chains due...
Corning and Meta Platforms have agreed to a multiyear deal valued at up to US$6 billion to supply optical fiber, cable, and connectivity solutions for Meta's US data center expansion...
Samsung Electronics is emerging as the leading supplier of sixth-generation High Bandwidth Memory (HBM4) to Nvidia and AMD as of February 2026, backed by growing confidence in its...
In mid-December 2025, TSMC chairman C.C. Wei disclosed details of a conversation with Elon Musk regarding future development priorities. The discussion centered not on automotive production,...
Texas Instruments (TI) signaled urgency around capacity planning, stressing that today's capital spending choices will determine its ability to serve demand years ahead, while downplaying...
NAND flash prices are soaring, with industry insiders expecting upstream contract prices to surge over 100% in the first quarter of 2026. As NAND manufacturers aggressively upgrade...
The chip resistor supply chain is seeing another round of price hikes as major passive component manufacturers Yageo and Walsin Technology initiated the first wave. Taiwanese firm...
A deepening global memory chip shortage is beginning to raise serious concerns within the automotive industry, as surging demand from artificial intelligence (AI) applications increasingly...
With strong demand for AI servers, TSMC—holding the vast majority of AI chip orders—is executing major expansions in advanced process technology and packaging capacity...
The rapid expansion of artificial intelligence (AI) computing is fueling a new wave of structural growth in the global printed circuit board (PCB) industry.
Nvidia and cloud computing firm CoreWeave have announced an expanded partnership to build more than 5 gigawatts of AI "factories" by 2030, aiming to support the rapid growth of artificial...
TSMC's recently announced capex surpassed market expectations by US$6 billion to US$8 billion, driven by factors that analysts had previously overlooked, DIGITIMES analyst Luke Lin...
