Vanguard International Semiconductor expects utilization of its 8-inch mature-node fabs to exceed 90% in the fourth quarter of 2026, as AI data center demand lifts orders for power...
Rising power demand at AI data centers is driving demand for power semiconductors used in server power supplies, grid equipment, and chip-level power delivery. Infineon Technologies...
Automotive powertrain and safety component maker Global PMX reported 3Q26 consolidated revenue of NT$2.417 billion (US$73.76 million), up 5.87% quarter-on-quarter and 24.59% year-on-year...
China's Lens Technology plans to build and operate its first through-glass via (TGV) glass substrate pilot line by the end of 2026 and is seeking partnerships with South Korean semiconductor...
On November 7, local US time, Elon Musk appeared remotely at the 33rd Baron Investment Conference in New York. During an hour-long conversation with Baron Capital founder Ron Baron,...
Samsung Electronics and SK Hynix are competing to secure extreme ultraviolet (EUV) lithography equipment from ASML as the Dutch supplier warns that its planned capacity will fall short...
Chang Wah Technology reported October consolidated revenue of NT$1.715 billion (US$52.2 million), up 0.09% month-over-month and 50.83% year-over-year, as demand remained strong despite...
Terafab, the chipmaking venture backed by Tesla and SpaceX, is reportedly planning memory output that would rival the world's largest DRAM maker. Japanese and Korean equipment and...
Surging demand for AI computing is accelerating data center construction in both the US and China, although the US is expected to retain a substantial lead in installed capacity through...
Microsoft is phasing out a rented compute capacity agreement with Oracle after deciding not to renew a contract with the cloud provider. The separation is a part of a larger rethinking...
Concerns over an overheating AI market have resurfaced, fueled by delays in data center construction, power and permitting bottlenecks, and the potential deferral of hundreds of billions...
Surging demand for advanced packaging driven by artificial intelligence (AI) has turned chip-on-wafer-on-substrate (CoWoS) from an "interesting" technology into a headache, making...
King Yuan Electronics (KYEC) general manager Gauss Chang said the company's plan to establish a US testing facility in Texas remains on schedule despite concerns that a shift in control...
India's push to expand semiconductor assembly and packaging capacity risks outpacing the development of its chip testing infrastructure, potentially increasing costs and prolonging...
Recent earnings reports from Apple and Intel highlight growing supply-chain strain driven by soaring memory costs and massive AI infrastructure build-outs. DIGITIMES analyst...
