Anthropic announced immediate increases to Claude service limits following a compute partnership with SpaceX that will deliver over 300 megawatts of new capacity within the month.
Fositek said strong demand from artificial intelligence (AI) infrastructure is driving rapid growth in its liquid cooling business and will prompt continued capacity expansion to meet...
A year of Intel-Apple negotiations and recent Samsung chatter amount to familiar supply-chain posturing—and TSMC's technical advantages remain unbeatable.
Autonomous driving and smart cockpit technologies are pushing vehicles to demand far more computing power and data processing. Memory has become a critical component in automotive...
Vanguard International Semiconductor (VIS) said on May 5 that it has secured support from TSMC for a new interposer foundry line at its 12-inch Singapore fab, alongside a broader push...
Buoyed by robust demand for artificial intelligence and the early success of price increases, Vanguard International Semiconductor Corporation (VIS) is projecting a stronger performance...
Global cloud service providers have recently raised capital spending to about US$725 billion, accelerating the shift of memory resources toward AI and prompting suppliers and customers...
In a recent assessment of the semiconductor landscape, GlobalFoundries emphasized the critical need for supply chain resilience amid a "fragmented geopolitical environment." The company...
Semiconductor silicon wafer supplier GlobalWafers said during its May 5 earnings call that it is advancing its next-generation compound semiconductor strategy. In response to advanced...
GlobalFoundries used its first-quarter 2026 earnings call to spotlight advances in silicon photonics (SiPh), co-packaged optics (CPO), and silicon-germanium (SiGe) development while...
Transcend Information posted consolidated revenue of NT$7.449 billion (roughly $235 million USD) in April 2026, marking its strongest month on record—nearly six times higher...
SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
