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Thursday 20 August 2026
Innolux turns panel fabs into FOPLP capacity, banking on sticky advanced packaging ties

Innolux is accelerating its dual-track transformation and asset-light strategy, with second-quarter 2026 earnings per share rising 185%...

Thursday 20 August 2026
WPG sees chip supply remaining tight into 2027, plans NT$15 billion convertible bond sale

Taiwan-based IC distributor WPG Holdings expects AI-driven semiconductor demand to remain strong into 2027, with capacity tight across...

Thursday 20 August 2026
High-end PCB supply tightens as CCL expansions face delays
As AI applications demand faster data transmission from PCBs, M8 and higher-grade copper-clad laminate (CCL) materials are becoming increasingly mainstream in server boards. The shift...
Thursday 20 August 2026
AI chip strategies echo StarCraft factions as memory bottleneck reshapes the race

The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained...

Wednesday 19 August 2026
Samsung Display restarts Asan OLED plant to meet foldable and IT demand
Samsung Display Co. is reported to be restarting construction of a new OLED plant in Asan, South Korea, after a five-year pause as demand rises for foldable phones and OLED panels...
Wednesday 19 August 2026
Elite Advanced Laser says AI optical Shortage could last for years as orders outpace capacity
Elite Advanced Laser Corp. said persistent shortages in the AI optical supply chain are likely to continue for years, as demand for high-speed connections continues to outpace supply...
Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

Wednesday 19 August 2026
Shikhar Malhotra named chairman of HCL-Foxconn chip venture as Jewar plant advances

India Chip Private Limited, the semiconductor joint venture between HCL Group and Hon Hai Technology Group (Foxconn), has appointed...

Wednesday 19 August 2026
Charts: New capacity is starting to show up in Taiwan's packaging and test revenue
Ardentec credits a new fab entering volume production for the sharpest monthly jump in the sub-sector; ELASER's revenue nearly doubled year on year on customer demand.
Tuesday 18 August 2026
Xintec readies 12-inch IVR backside copper for TSMC's next-gen AI chips

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging...

Tuesday 18 August 2026
Hushan eyes stronger 2H26 on drone cameras, OE push

Aftermarket (AM) parts and automotive camera maker Hushan Autoparts saw its first-half 2026 operations impacted by US tariff policies...

Tuesday 18 August 2026
South Korea's Gwangju chip hub faces looming water crunch as experts push underground storage and AI management
Samsung Electronics and SK Hynix are preparing to invest in four memory fabs in southwestern South Korea, but alongside power infrastructure, the semiconductor industry's uninterrupted...
Tuesday 18 August 2026
AI drives power semiconductors into at least a two-year shortage
The cloud AI data center boom is not close to bursting, according to chip supply-chain players. They say that analog ICs, including power semiconductors, will stay tight for years...
Tuesday 18 August 2026
Arm faces capacity squeeze as CPU demand tops US$2 billion

Arm Holdings' expansion from asset-light IP licensing into finished data center processors is putting the company into direct competition...

Tuesday 18 August 2026
Eiso Enterprise's Guishan plant expansion doubles PCB capacity, eyes AI, aerospace, defense markets

Niche printed circuit board (PCB) manufacturer Eiso Enterprise has officially opened the second-phase expansion of its new plant in...