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Wednesday 27 May 2026
AI infrastructure spending lifts Taiwan electronics sector outlook
Cloud providers' large-scale investments in AI infrastructure have strengthened demand for Taiwan's electronics supply chain, boosting optimism among local manufacturers, according...
Wednesday 27 May 2026
Aixtron wins orders from Lumentum for G10-AsP systems to expand InP production
Aixtron has received multiple orders from Lumentum for its G10-AsP MOCVD systems, a move that could boost global production of indium phosphide (InP) lasers and detectors for 800G...
Wednesday 27 May 2026
PCB drill bit maker Topoint raises NT$600 million, brings in PCB giants as strategic investors
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600...
Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
Tuesday 26 May 2026
Wiwynn expands US capacity as AI server boom strains power and supply chains

Taiwan-based AI server maker Wiwynn is accelerating its global expansion as surging demand for AI infrastructure creates mounting pressure...

Tuesday 26 May 2026
AMD and Nvidia deepen investments in Taiwan semiconductor ecosystem

When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners...

Tuesday 26 May 2026
Win Semiconductors bets on optical and satellite communications growth
Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of Win Semiconductors, said the company is actively advancing a range...
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...

Tuesday 26 May 2026
GlobalWafers rolls out phased GaN capacity expansion to ease supply crunch
Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing...
Tuesday 26 May 2026
Commentary: Stellantis' capital shift signals quiet reshaping of Europe's auto industry

In recent weeks, Stellantis, one of the world's five largest automakers, unveiled an ambitious five-year plan titled Fastlane 2030. At...

Tuesday 26 May 2026
GlobalWafers to increase prices, targets 4Q26 shipments for square wafers, Asia capacity fully booked
GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI...
Tuesday 26 May 2026
Taiwan MLCC makers plug into AI server demand
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20...
Tuesday 26 May 2026
TECO completes Malaysia's Dynaciate acquisition to boost data center build capacity
TECO Electric & Machinery announced on the 25th that it signed an agreement to acquire about 78% of Malaysian engineering firm Dynaciate Engineering Sdn. Bhd. for roughly 200 million...
Monday 25 May 2026
Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
Monday 25 May 2026
Lam Research CEO: New fabs alone will not solve chip bottlenecks
Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints,...