Cree has announced plans to build a new automotive-qualified 200mm power and RF wafer fabrication facility in Marcy, New York, complemented by its mega materials factory expansion...

DRAM chipmaker Nanya Technology, specialty DRAM and flash memory specialist Winbond Electronics and mask ROM and flash chipmaker Macronix International are expected to post substantial...

The emerging AI, IoT and 5G applications will be stimulating related chip and component demand, with a rebound likely to take place in the memory market next year, according to market...

Wafer reclaim and thinning specialist Phoenix Silicon International (PSI) has filed a lawsuit with the Taiwan IP court against Integrated Service Technology (iST) accusing it of infringing...

Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking...

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of...

PCB manufacturer Unitech Printed Circuit Board has seen revenue contribution for rigid-flex board shipments rise from 30% in 2018 to 50% currently, thanks to strong orders for TWS...

GaAs foundry Win Semiconductors plans to expand production capacity by around 5,000 6-inch wafers monthly in the second quarter of 2020 to meet ever-increasing compound semiconductor...

China- and US-based datacenter players are expected to replenish their HDD inventory beginning from fourth-quarter 2019 to first-quarter 2020, as demand for datacenter establishments...

The lead time for production of 7nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended to nearly six months from the previous two months because of strong demand,...

Investments in new fab projects starting construction in 2020 are expected to reach nearly US$50 billion, up about US$12 billion from 2019, according to SEMI.

Compal Electronics, in response to its major brand clients' requests, is moving production of their US-bound notebooks from Vietnam to Taiwan, which is expected to turn Taiwan into...

Tripod Technology has seen its HDI board production lines operate at full capacity, driven by an influx of short lead-time orders, according to the Taiwan-based PCB manufacturer.

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to see its capex this year reach around US$12.5 billion to satisfy robust chip demand in the 5G era, according to industry...

Macronix International and Winbond Electronics have reported sequential increases in August consolidated revenues of 24.9% and 3.1%, respectively.

COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may...

Unimicron Technology has maintained its huge capex budgets for 2019 and 2020 are meant to strengthen its IC substrates technology upgrades and production capacity for the emerging...

Development of 5G technologies and products has become a key direction for Huawei's operation with its orders for 5G-related...

IC backend houses Sigurd Microelectronics and Winstek Semiconductor both plan to expand production capacity aiming to satisfy growing demand for 5G-related chips and blockchain ASI...

General Interface Solution (GIS) is expanding its production capacity for in-display fingerprint sensors at its plant in Chengdu, China, with plans to ramp up its monthly output to...

LED automotive lighting module maker Excellence Optoelectronics is expanding production capacity by adding two LED automotive lighting module production lines at its factory in Taiwan...

With 5G business opportunities starting to emerge, CCL makers have been keenly increasing their capacity to satisfy...

Chip and component demand for 5G related applications, including network equipment, and antennas for handsets and IoT devices, is set to grow robustly starting 2020. In the PCB industry...

With CCL (copper clad laminate) deemed as the most crucial material for high-end PCBs for 5G applications, major CCL makers in Taiwan and China are actively proceeding with capacity...

A ramp-up in orders for NAND flash memory will boost revenues at backend houses ChipMOS Technologies and Orient Semiconductor Electronics (OSE) in the second half of 2019, according...