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Tuesday 9 September 2025
Microsoft signs US$19.4 billion deal with Nebius amid surging AI cloud demands
The artificial intelligence (AI) boom continues to drive unprecedented computing power demands. Microsoft has signed a five-year AI cloud computing agreement with Nebius valued at...
Tuesday 9 September 2025
Globalwafers chief warns materials, not process nodes, will decide chip industry's future
Speaking ahead of SEMICON Taiwan 2025, Globalwafers chairperson Doris Hsu said competition in semiconductors is shifting from process nodes and capacity to control of critical materials...
Tuesday 9 September 2025
CATL unveils Shenxing Pro battery, expands EU capacity with US$8.6 billion Hungary plant
CATL, the world's largest electric vehicle (EV) battery manufacturer, unveiled a major technological breakthrough in Munich on September 7, 2025, introducing its NP3.0 (No Propagation...
Tuesday 9 September 2025
TSMC and OSATs ramp up advanced semiconductor packaging amid AI-driven demand surge
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
Monday 8 September 2025
Taiwan PCB makers pivot to AI servers amid China exodus
As the four major cloud service providers (CSPs) aggressively ramp up their presence in the AI computing market, Taiwan's printed circuit board (PCB) industry is experiencing a clear...
Monday 8 September 2025
From cyclical swings to structural growth: Join GMIF2025 to unlock new opportunities for memory in the AI Wave
In the past decades, the memory industry has been one of the most volatile sectors in semiconductors, marked by price fluctuations, supply-demand imbalances, and rapid capacity shifts...
Saturday 6 September 2025
GCE plans to expand Taiwan capacity with NT$1.6B purchase of CMC Zhongli plant
As demand for AI servers drives full production capacity, PCB manufacturer Gold Circuit Electronics (GCE) announced on September 5, 2025, that its board of directors approved a NT$1.6...
Friday 5 September 2025
China's NEV market sees rising adoption of hybrid SiC tech amid price war
China's new energy vehicle (NEV) sector continues to face intense price competition, with domestic manufacturers pushing vehicle prices to unprecedented lows. This aggressive pricing...
Friday 5 September 2025
Asahi Kasei to double chip insulating material output by 2030 as AI data centers soar
Japan's semiconductor materials suppliers are racing to expand capacity as the AI data center build-out drives unprecedented demand for advanced chips and packaging inputs. Nikkei...
Friday 5 September 2025
South Korea doubles down on display research as China tightens grip on global market
South Korea plans to more than double its display research budget to counter China's growing dominance, as industry data indicate China could control up to 75% of global panel production...
Thursday 4 September 2025
Taiwan PCB supply chain tightens capex scale; leaders increase AI and SEA investments
Despite facing global end-market inventory adjustments and rising geopolitical uncertainties, Taiwan's printed circuit board (PCB) supply chain is shifting its capital expenditure...
Thursday 4 September 2025
India clears incentive scheme to boost critical mineral recycling
India has approved an incentive scheme worth INR15 billion (US$180 million) to expand the country's capacity to recycle critical minerals from secondary sources. The six-year program,...
Thursday 4 September 2025
Why the US revoking TSMC’s Nanjing license may matter less than it seems
The US Commerce Department has told TSMC it will revoke the company's Verified End-User (VEU) status for its Nanjing factory by December 31, 2025. TSMC said on September 2 that the...
Thursday 4 September 2025
Tech Forum 2025: TSMC faces the next decade of chip war from Arizona to Beijing
Taiwan Semiconductor Manufacturing Co. (TSMC) has begun mass production and turned a profit at its Arizona plant in 2025, a milestone that marks not only a breakthrough in its global...
Thursday 4 September 2025
Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race
The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized"...