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    Samsung could lead HBM market in 2027 as HBM4 prices may rise 2.5 times
    Jun 26, 17:54
    Johor data centers could consume 40% of power by 2035
    Jun 26, 17:54
    China’s 15th five-year energy plan targets AI power demand
    Jun 26, 17:53
    Winbond says memory has become a strategic material as AI reshapes the market
    Jun 26, 17:53
    Analysis: Why Onsemi acquires Synaptics in all-stock deal
    Jun 26, 17:53
    NEWS TAGGED CAPACITY
    Thursday 25 June 2026
    TSMC-Amkor alliance jolts packaging map as ASE races to expand
    The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
    Thursday 25 June 2026
    Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
    JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
    Thursday 25 June 2026
    TSMC 3nm lead times surpass one year as Samsung faces Intel in foundry push
    As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics'...
    Thursday 25 June 2026
    AI server demand drives sharp price gains in high-end MLCCs
    Rising demand for AI server builds is tightening the global supply of high-end MLCCs, driving steep price increases in China's electronics distribution market and exposing how quickly...
    Thursday 25 June 2026
    IC design firms race to secure packaging capacity
    IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...
    Thursday 25 June 2026
    Taiwan-US tariff deal cuts auto parts duties to 15% and reshapes supply chains
    Taiwan's agreement with the US to cap tariffs on auto parts at 15% is prompting suppliers to rethink production and shipping plans, with implications that extend beyond the island's...
    Thursday 25 June 2026
    China wafer champion turns to US$1.6B overhaul to stop losses
    National Silicon Industry Group, China's leading 12-inch silicon wafer maker, has announced a CNY11.45 billion (US$1.6 billion) capital injection into its core subsidiary Shanghai...
    Thursday 25 June 2026
    Phison says NAND shortage has no end in sight as orders are booked into 2Q27

    Phison Electronics CEO Khein-seng Pua said the NAND flash market is facing a supply crunch with "no end in sight," as AI continues to...

    Thursday 25 June 2026
    Power-Win expands into EV battery recycling as Jiadong plant ramps up
    Power-Win Technology Co. Chairman Lin Pei-yi said following the company's June 23 shareholders meeting that its core battery recycling and processing business has benefited from process...
    Thursday 25 June 2026
    Techzone builds circular economy to tap rising semiconductor expansion demand
    Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand...
    Wednesday 24 June 2026
    SK Hynix to issue US$29 billion in new shares for Nasdaq ADR listing on July 10
    SK Hynix disclosed in regulatory filings to South Korea's Financial Supervisory Service and the Korea Exchange on June 24 that its board has approved the issuance of new shares worth...
    Wednesday 24 June 2026
    Global market for advanced chip packaging set for rapid expansion
    The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
    Wednesday 24 June 2026
    Cerebras leans on OpenAI and AWS as anchor customers, raising questions about concentration
    Cerebras Systems' first public quarter highlighted its dependence on a small set of large partners — OpenAI and AWS anchor the business — even as management declined on...
    Wednesday 24 June 2026
    MediaTek price hike signals broader cost pressure for Taiwan IC design houses
    Reports of MediaTek price adjustments appear to confirm a broader pricing trend across Taiwan's IC design sector. Industry sources said many small and mid-sized chip suppliers have...
    Wednesday 24 June 2026
    SK Hynix reportedly eases HBM4 push as commodity DRAM margins surge

    SK Hynix is reportedly easing the pace of some HBM4 production conversions and redirecting more attention toward commodity DRAM, as a...

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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook