Tuesday 31 December 2013
SPIL looks to strong performance in 4Q13 and 1Q14
Siliconware Precision Industries (SPIL) is expected to perform better than expected in the fourth quarter of 2013 and the first quarter of 2014 as the IC backend service firm has...
Tuesday 31 December 2013
IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...
Monday 16 December 2013
TSMC adjusting capacity to meet rising orders for bumping services
TSMC expects its in-house capacity for wafer bumping services will fail to satisfy customer demand, and plans to outsource more orders for 8-inch wafers for use in the manufacture...
Friday 13 December 2013
ASE likely to lose orders as plants might shut down over toxic leaks
One or more factories of Taiwan-based Advanced Semiconductor Engineering (ASE), the world's largest IC packaging house, might receive a government order to suspend operations for...
Thursday 12 December 2013
TSMC builds up bumping capacity
Taiwan Semiconductor Manufacturing Company (TSMC) has built up its bumping capacity to 150,000 12-inch wafers a month with total shipments amounting to over five million units, according...
Tuesday 11 September 2012
Chipbond 12-inch gold bumping lines to operate at full capacity in September
LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...
Tuesday 21 August 2012
Chipbond 3Q12 sales driven by demand for small-size panel driver ICs
Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...
Friday 29 June 2012
Chipbond gold bumping capacity booked for iPhones, says report
Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...
Monday 4 June 2012
Chipbond lands 8-inch gold bumping orders from Samsung, says paper
LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...
Tuesday 3 January 2012
Chipbond, ChipMOS develop alternative to gold bumping
Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...
Friday 1 July 2011
PTI developing advanced packaging technologies
Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...
Monday 27 June 2011
Major Taiwan IC backend firms developing copper pillar bumping
Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...
Monday 14 March 2011
Shortage of iPad 2 bumping up gray import prices
Prices for Apple's iPad 2 in Korea or Hong Kong, where the device has not yet been launched, are being marked at about US$700-1,000, close to double Apple's original price, as Apple...
Thursday 3 March 2011
Chipbond gearing up to expand capacity for 12-inch wafers
With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...
Friday 12 November 2010
Taiwan-based LCD driver IC designers to adopt 12-inch processes soon
LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...
Arm Cortex -M0 series
Summary of Tech Supply Chain News!
Global chip firms tapping local talents and growing demands in Vietnam, says DIGITIMES Research
Fuel cell is pivotal for Taiwan's hydrogen industry, according to DIGITIMES Research
Silicon shield doesn't guarantee military deterrence for Taiwan, says DIGITIMES Research