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Wednesday 25 April 2018
SPIL 1Q18 profits fall to 9-quarter low
IC packaging specialist Siliconware Precision Industries (SPIL) has reported net profits of NT$240 million (US$8.1 million) for the first quarter of 2018, down 83.9% sequentially...
Friday 9 February 2018
SPIL spends NT$710 million on equipment for China subsidiary
IC packager Siliconware Precision Industries (SPIL) has disclosed it has spent a total of NT$710.71 million (US$24.3 million) on equipment from Kulicke and Soffa Industries for its...
Friday 2 February 2018
ASE expects revenues to pick up starting 2Q18
Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The...
Wednesday 31 January 2018
Logic IC packager Greatek upbeat about revenues for 2018
After scoring impressive revenue and profit records in 2017, Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI) , is quite optimistic...
Tuesday 30 January 2018
Taiwan IC packagers to cash in on mining craze in 2018
Taiwan IC backend service providers including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYE), are upbeat about their...
Monday 29 January 2018
SPIL posts EPS of NT$2.21 for 2017
IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits fall 30.5% on year to NT$6.9 billion (US$237 million) in 2017. EPS for the year came to NT$2.21...
Wednesday 17 January 2018
ChipMOS lands orders from new clients for gold bumping services
Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...
Tuesday 5 December 2017
Backend IC service provider Sigurd sees bright prospect in 2018
Taiwan-based IC packaging and testing house Sigurd Microelectronics is expected to enjoy strong revenue performance in 2018 due to more orders from Amazon for its smart speaker chips,...
Friday 24 November 2017
ChipMOS Shanghai to grab backend orders for China homegrown 3D NAND chips
ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...
Wednesday 25 October 2017
SPIL posts EPS of NT$1.74 for 1Q-3Q17
IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits for the first three quarters of 2017 decline 23.8% from a year earlier to NT$5.41 billion (US$178.7...
Friday 13 October 2017
Chipbond posts record 3Q17 revenues
Chipbond Technology's consolidated revenues climbed to a record high of about NT$5 billion (US$165.3 million) in the third quarter of 2017. Market watchers expect the company to post...
Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Friday 25 August 2017
Chipbond, ChipMOS see rising orders for TDDI chips
Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...
Tuesday 15 August 2017
SPIL to invest US$25 million in China
Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...
Wednesday 19 July 2017
Chipbond reportedly to sell partial stake in China subsidiary to BOE
Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...
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