Tuesday 23 March 2021
PTI to offer Renesas additional backend capacity support
Backend house Powertech Technology (PTI) will provide automotive chips vendor Renesas Electronics with additional capacity support starting April, as the IDM's backend bumping capacity...
Wednesday 27 January 2021
PTI set to boost logic IC backend revenue ratio to 50% in mid-2021
Memory backend specialist Powertech Technology (PTI) is gearing up to expand its business in the logic IC field in 2021 with focus placed on flip-chip packaging and bumping services,...
Thursday 7 January 2021
OSE seeking logic chips backend orders after allying with Chipbond
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Friday 4 December 2020
Chipbond to expand backend capacity for RF, PA devices, driver ICs
Taiwan's backend house Chipbond Technology has disclosed plans to build additional testing capacity to satisfy robust demand for display driver ICs, RF and PA components.
Monday 26 October 2020
Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
Friday 23 October 2020
PTI to gear up logic IC backend business expansion
Backend house Powertech Technology (PTI) will step up efforts to expand its logic IC business, aiming to boost the revenue ratio for the segment from nearly 30% to over 40%, according...
Tuesday 20 October 2020
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Tuesday 11 August 2020
Backend demand for consumer logic chips picking up
Taiwan-based IC backend houses including ASE Technology and Powertech Technology (PTI) have seen orders placed by game console and other consumer electronics vendors ramp up since...
Friday 17 July 2020
Top China backend firms gaining significant expansion momentum
China's top-3 backend houses JCET, Huatian Technology and Tongfu Microelectronics, now all among the world's top-10 IC assembly and testing firms, are gaining increasing business...
Monday 18 May 2020
TSMC may move mature CoWoS tech to US fab, say sources
As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
Friday 3 January 2020
SJSemi strengthens presence in wafer-level 3D packaging segment
SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
Thursday 24 October 2019
China IC backend firms poised for strong 2020
China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
Wednesday 31 July 2019
JCET kicks off 12-inch wafer bumping production in S Korea
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...
Wednesday 20 March 2019
SJSemi rolls out AiP technology for 5G and millimeter waves
SJ Semiconductor (SJSemi) has unveiled its ultrawideband dual-polarization antenna-in-package (AiP) technology for 5G millimeter-wave applications.
Thursday 26 July 2018
China IC packager Tongfu sets up new fab in Xiamen
As one of China's three leading IC backend service firms, Tongfu Microelectronics (TFME) has managed to provide one-stop packaging and testing solutions by expanding its operation...
Research Report Database
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