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NEWS TAGGED BUMPING
Wednesday 19 July 2017
Chipbond, ChipMOS seeing robust gold bumping demand
Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...
Tuesday 27 June 2017
Tongfu Microelectronics to set up advanced IC backend plant in Xiamen, says report
China-based Tongfu Microelectronics has struck a deal with the Xiamen Haicang District government to set up a manufacturing base for advanced packaging and testing services locally...
Friday 2 June 2017
PTI optimistic about memory-dominated packaging
The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...
Wednesday 24 May 2017
ChipMOS reportedly lands gold bumping orders for AMOLED driver ICs from Samsung
ChipMOS Technologies reportedly has landed orders from Samsung Electronics for providing gold bumping services on 12-inch wafers fabricated to produce AMOLED driver ICs to be used...
Friday 12 May 2017
ChipMOS expects revenue growth in 2Q17
ChipMOS Technologies, a backend house targeting the LCD driver IC and memory chip sectors, expects rising sales generated from the LCD driver IC and mixed-signal chip sectors in the...
Thursday 27 April 2017
SPIL posts profit drop in 1Q17
IC packager Siliconware Precision Industries (SPIL) has reported net profits of NT$996 million (US$33.1 million) for the first quarter of 2017, down 64.8% sequentially and 37.9% on...
Tuesday 28 March 2017
Greatek building high-end packaging capacity
Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according...
Monday 26 December 2016
Chipbond grabs new gold bumping orders for power amplifiers, says report
Packaging and testing house Chipbond Technology reportedly has landed new orders for gold bumping for power amplifier (PA) components from Japan- and US-based vendors, according to...
Thursday 28 July 2016
SJSemi, Qualcomm announce mass production of 14nm wafer bumping
SJ Semiconductor (SJSemi) has begun mass production of 14nm wafer bumping for Qualcomm, the companies have jointly announced. Mass production of 14nm wafer bumping in China is part...
Thursday 17 September 2015
SMIC, China National Fund and Qualcomm sign letter of intent to invest in SJsemi
Semiconductor Manufacturing International (SMIC) announced on September 16 that the company has signed a letter of intent with China Integrated Circuit Industry Investment Fund (CICIIF)...
Wednesday 29 July 2015
Chipbond to boost sales from non-driver ICs, says report
Chipbond Technology, which provides backend services mainly for LCD driver ICs, will see significant growth in sales from its non-driver IC product line in the second half of 2015,...
Monday 10 November 2014
TI to open 300mm wafer bumping facility in Chengdu
Texas Instruments has announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu...
Friday 2 May 2014
PTI to acquire Nepes in Singapore
Powertec Technology (PTI) announced on April 29 that it has entered into a share purchase agreement with Nepes to acquire Nepes Pte Ltd (NPL) in Singapore.
Thursday 13 March 2014
China IC backend service companies migrating to advanced processes
More IC testing and packaging companies in China are expected to migrate to advanced processes following Semiconductor Manufacturing International Corporation (SMIC) and Jiangsu Changjiang...
Friday 21 February 2014
SMIC, JCET form JV for 12-inch bumping and testing
Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...
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