Taiwan-based memory packaging/testing company Powertech Technology (PTI) and wafer foundry United Microelectronics (UMC) as well as Japan-based DRAM maker Elpida Memory on May 30...

3D IC Technology holds great promise for manufacturing at 20nm and beyond, bridging the gap between SoC and future system requirements. Because of its high technical thresholds, integrated...

Unlike conventional SoC or SiP solutions that integrate ICs on a two-dimensional (2D) surface, using through silicon via (TSV) technology in a package that stacks ICs in a three-dimensional...