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Utechzone joins 3D IC alliance to expand semiconductor testing capabilities and depth

Monica Chen, Taipei; Charlene Chen, DIGITIMES Asia Saturday 13 September 2025 0

Credit: DIGITIMES

To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September 9, 2025. Co-chaired by TSMC and ASE Holding, the alliance brings together...

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