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Monday 15 September 2025
XMC steps into key stage of China's silicon-on-insulator foundry drive, ahead of SMIC and Hua Hong
Since its IPO application was accepted by Shanghai's STAR Market in September 2024, Wuhan Xinxin Semiconductor Manufacturing Co. (XMC) has updated its prospectus to highlight its move...
Friday 12 September 2025
SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
Wednesday 10 September 2025
SEMICON Taiwan 2025: Memory giants compete in customized HBM race amid AI surge
The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth memory (HBM), which has become a core component of AI system architectures. The...
Tuesday 9 September 2025
China's ACM ships first KrF coater-developer to logic fab as local supply chain advances
As the global semiconductor industry undergoes rapid restructuring, Chinese equipment makers are racing to achieve breakthroughs and scale. ACM Research (Shanghai), Inc. has introduced...
Thursday 4 September 2025
Commentary: YMTC's 3D DRAM push challenges CXMT and global memory leaders
China's push to localize its memory supply chain is gathering momentum. YMTC has begun trial production at its first fully localized NAND flash fab, while market chatter indicates...
Thursday 21 August 2025
SJ Semiconductor advances 3D packaging as key Huawei partner, climbs global OSAT rankings
China's semiconductor packaging and testing firm SJ Semiconductor (SJ Semi) has made significant headway with the completion of its third production facility, J2C, in Jiangyin's high-tech...
Sunday 17 August 2025
TSMC’s top wafer testing partner posts 78% surge as new facility ramps
Xintec Inc., TSMC's backend packaging and testing unit, posted a strong second-quarter 2025 rebound in wafer probe revenue, driven by increased outsourcing from TSMC and the accelerated...
Thursday 14 August 2025
TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining its...
Friday 8 August 2025
Samsung revives Z-NAND after 7 years to supercharge AI with 15x speed gains

Samsung Electronics is reviving its Z-NAND memory technology after a seven-year hiatus, positioning it as a high-performance solution...