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NEWS TAGGED 3D
Thursday 14 August 2025
TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining its...
Friday 8 August 2025
Samsung revives Z-NAND after 7 years to supercharge AI with 15x speed gains

Samsung Electronics is reviving its Z-NAND memory technology after a seven-year hiatus, positioning it as a high-performance solution...

Friday 1 August 2025
Macronix hit by forex losses in 2Q but stays on course for 2025 profitability
Macronix International reported a wider second-quarter 2025 loss, citing seasonal weakness and significant forex losses from the sharp appreciation of the New Taiwan dollar. President...
Monday 21 July 2025
Is computing the wrong focus? Lightmatter's 3D photonics tackles AI's data bottleneck
As AI workloads hit data movement bottlenecks, MIT spinoff Lightmatter is betting that photonics, not more transistors, holds the key to next-generation infrastructure. After years...
Monday 21 July 2025
Exclusive: YMTC to pilot fully China-made NAND line in 2025, eyes 15% global share by 2026
Yangtze Memory Technologies Co. (YMTC), China's top NAND flash maker, is advancing its push for equipment self-sufficiency. Supply chain sources say the company's first NAND production...
Friday 18 July 2025
InPsytech finalizes UCIe 2.0 compliant SoIC design for 3D heterogeneous integration
InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F)...