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SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar

Joseph Chen, DIGITIMES Asia, Taipei Friday 12 September 2025 0

Credit: DIGITIMES

At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the energy cost of scaling AI. He warned that the exponential rise in AI...

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