Marvell Technology has unveiled its first 2nm silicon IP for advanced AI and cloud infrastructure. The silicon, fabricated using TSMC's 2nm process, is integral to the Marvell platform...
At Dassault Systèmes' SolidWorks and 3DEXPERIENCE World 2025 in Houston, CEO Pascal Daloz outlined his 2025 market outlook, predicting strong growth in the US and Asia despite...
Dassault Systèmes launched SOLIDWORKS and 3DEXPERIENCE World 2025 on February 23 in Houston, Texas, uniting industry leaders, engineers, and innovators to showcase the latest...
Dassault Systèmes has announced that 3DExperience World 2025, its annual event dedicated to the SolidWorks and 3DExperience platform user community, is taking place in the US...
Dassault Systèmes has been embedding artificial intelligence (AI) into its platforms and software for nearly a decade. As generative AI (GenAI) reshapes industries, the company...
South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND...
The Taiwan Semiconductor Research Institute (TSRI), under the National Science and Technology Council (NSTC), announced at a press conference held by Taiwan's National Applied Research...
Samsung Electronics has reportedly signed a patent licensing agreement with Chinese NAND Flash manufacturer Yangtze Memory Technology Corp (YMTC) to license its Hybrid Bonding technology...
Japanese NAND Flash manufacturer Kioxia unveiled its latest advancement in NAND flash memory technology on February 20, featuring an impressive increase to 332 layers, up from the...
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
