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NEWS TAGGED 3D
Thursday 7 November 2024
Wah Hong expands to 3D snapshot sensors to enhance drone and EV applications
Optical film manufacturer Wah Hong Industrial Corp has reported that its cumulative pre-tax net profit for the third quarter of 2024 reached NT$410 million (approx. US$12.7 million),...
Wednesday 6 November 2024
Samsung's new semiconductor R&D campus to launch, driving next-gen memory development
Samsung Electronics plans to open its new semiconductor research and development campus in mid-November. The installation of advanced equipment is set to take place from November...
Monday 4 November 2024
Samsung plans 400+ layer NAND and cutting-edge DRAM for 2026 to reclaim AI memory market
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
Thursday 31 October 2024
Samsung, SK Hynix, Intel put packaging at the heart of future innovation
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Wednesday 30 October 2024
Macronix chairman doubts 2025 demand recovery but better than 2024
Macronix International, a mask ROM and flash memory chipmaker, expects its operations to improve in 2025 compared to this year, but demand will not fully recover, according to company...
Tuesday 29 October 2024
Japanese companies develop 3D analog IC for ADAS, overcoming cost and technical challenges
Oki Electric Industry and Nisshinbo Micro Devices have announced the development of an analog IC for advanced driver assistance systems (ADAS) in vehicles, reports Nikkei.
Wednesday 23 October 2024
PSMC optimistic about 3D AI Foundry strategy amid third-quarter losses
Powerchip Semiconductor Manufacturing Corporation (PSMC) reported its earnings for the third quarter of 2024, indicating a continued increase in losses, which totaled NT$2.879 billion...
Tuesday 22 October 2024
Bright future ahead: advanced packaging takes center stage as traditional OSAT providers pivots
AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...
Thursday 17 October 2024
Taiwan unveils breakthrough light field AR technology for smart medicine
Taiwan has pioneered a groundbreaking light field augmented reality (AR) display technology for smart medicine, addressing common issues like dizziness, eye strain, and lack of depth...
Wednesday 16 October 2024
2025 DRAM expansion strategies: Samsung's conservative approach vs. SK Hynix's aggressive stance
The DRAM equipment investment plans of Samsung Electronics (Samsung) and SK Hynix in 2025 may vary based on the sales of high bandwidth memory (HBM).