Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Macronix International, a mask ROM and flash memory chipmaker, expects its operations to improve in 2025 compared to this year, but demand will not fully recover, according to company...
Oki Electric Industry and Nisshinbo Micro Devices have announced the development of an analog IC for advanced driver assistance systems (ADAS) in vehicles, reports Nikkei.
Powerchip Semiconductor Manufacturing Corporation (PSMC) reported its earnings for the third quarter of 2024, indicating a continued increase in losses, which totaled NT$2.879 billion...
AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...
Taiwan has pioneered a groundbreaking light field augmented reality (AR) display technology for smart medicine, addressing common issues like dizziness, eye strain, and lack of depth...
Imagine sitting in a meeting room with a screen mounted on the wall in front of you, a video call comes in. The person calling you suddenly appears to be sitting right in front of...
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
PlayNitride chairman Charles Li stated that the development of Micro LED technology will rapidly drive down costs at a pace similar to Moore's Law, with costs expected to fall below...
Zhen Ding Technology made its debut at SEMICON Taiwan 2024, where the company highlighted the expanding role of IC substrates in advanced semiconductor manufacturing.
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
Samsung Electronics attended Gamescom 2024, held in Cologne, Germany. With an alleged largest-ever exhibition hall of about 800 square meters, Samsung unveiled its new gaming monitor,...
As smartphone camera resolutions continue to improve, lenses inevitably become thicker, impacting the weight of the devices. Market rumors suggest that Apple has been researching...
