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NEWS TAGGED 3D
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Tuesday 1 June 2021
China makers gaining weight on Apple top-200 supplier list
China-based makers have been gaining presence in the Apple's supply chain, with 12 new makers from the country entering the vendor's newly released top-200 supplier list for 2020,...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Monday 24 May 2021
Solidworks expects surging sales from cloud computing business in 2021
Solidworks, a developer of 3D engineering CAD software under Dassault Systemes, expects its sales from cloud computing-related businesses in 2021 to surge 6- to 7-fold from a year...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Monday 17 May 2021
Ingentec to construct new plant for chipmaking specialty gases
Chipmaking specialty gas specialist Ingentec will kick off construction of a new plant for making specialty gases used in semiconductor manufacturing later this year, according to...
Friday 14 May 2021
Apple reportedly to sharply cut VCSEL die size for 3D sensors
Apple reportedly has decided to scale down the die size by 40-50% for VCSEL chips used in 3D face ID sensors for new iPhone and iPad devices to be rolled out later in 2021, a move...
Thursday 13 May 2021
AP Memory sees IoT RAM revenue surge
AP Memory Technology, a subsidiary of Powerchip Technology specializing in customized memory chip designs and IPs, has disclosed revenue generated from orders for IoT RAM products...
Friday 30 April 2021
Vendors of 3D sensors, PA, VMC to brace for new iPhones starting June
Taiwan's 3D sensor, PA and VCM suppliers for iPhones are expected to revive their inventory-preparation momentum for new iPhones starting June following a slowdown in delivering shipments...
Thursday 1 April 2021
CIRC to unveil its latest 3D LiDAR SLAM navigation solution
Coretronic Corporation's subsidiary, CIRC, has unveiled the world's very first autonomous navigation solution featuring 3D LiDAR SLAM.
Wednesday 17 March 2021
Micron to shift resources from 3D XPoint to CXL memory
Micron Technology has announced updates to the company's portfolio strategy to further strengthen its focus on memory and storage innovations for the data center, with plans to cease...
Monday 15 March 2021
PC OEMs to increasingly adopt DRAM-less SSD in lower-end models
PC OEMs are expected to increasingly adopt DRAM-less SSDs in their entry-level and mid-range models for cost reasons, according to industry sources.
Friday 26 February 2021
Kioxia breaks ground for new 3D NAND wafer fab
Kioxia held a groundbreaking ceremony for a semiconductor fabrication facility, dubbed Fab 7, at its factory site in Yokkaichi, Japan on February 24. The facility will be dedicated...
Friday 19 February 2021
Kioxia, Western Digital announce 6th-gen 3D flash memory
Kioxia and Western Digital jointly announced they have developed their sixth-generation, 162-layer 3D flash memory technology.
Monday 8 February 2021
NAND vendors to enter production race for over-100-layer offerings in 2021
As NAND flash stacking technology continues to advance, vendors will be racing for mass production of 3D TLC/QLC (triple/quad-level cell) NAND chips with over 100 layers in 2021 after...