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    GPS-free indoor drones target high-rack inspection as smart warehouses expand
    1min ago
    AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote
    9min ago
    AWS Trainium 3 shipments stall as supply chain sees turnaround
    10min ago
    Applied Materials and Kioxia team up on AI-era memory tech
    11min ago
    Memory shortages deepen as AI demand keeps server prices climbing
    15min ago
    SG Semiconductor builds brand and talent for Singapore chip industry
    22min ago
    Taiwan's cement giant eyes postwar rebuilding demand
    Sep 30, 18:39
    MediaTek’s TPU orders held steady as supply chain capacity became the key bottleneck
    Sep 30, 18:39
    Four glass makers converge on 510x515mm substrate, hinting at TSMC’s next move
    Sep 30, 18:39
    China's humanoid robot shipments topped 19,000 in 1H26
    Sep 30, 18:39
    China Rare-Earths Group and Benmo Tech team up on robot direct-drive magnets
    Sep 30, 18:38
    NEWS TAGGED 3D
    Wednesday 9 September 2026
    Backed by Nanya partnership, PieceMakers eyes AI memory upgrade boom
    As AI compute requirements scale, memory bandwidth has become a primary bottleneck governing system performance. PieceMakers Technology, which maintains a strategic partnership with...
    Monday 7 September 2026
    Micron scores seventh PTAB win in YMTC patent fight
    Micron Technology has scored a seventh favorable Patent Trial and Appeal Board (PTAB) outcome in its wide-ranging patent fight with China's Yangtze Memory Technologies (YMTC), while...
    Monday 7 September 2026
    Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
    China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...
    Monday 7 September 2026
    Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
    Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
    Sunday 6 September 2026
    Trumpf CTO says advanced packaging reshapes semiconductor equipment race
    AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...
    Saturday 5 September 2026
    Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
    China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...
    Friday 4 September 2026
    TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
    TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
    Friday 4 September 2026
    Acer unveils IFA lineup with AI, slim notebooks, sustainability
    Acer used its next@acer global press conference in Berlin during IFA to unveil a broad lineup of new products, highlighting its push into AI, sustainability, thin-and-light notebooks,...
    Thursday 3 September 2026
    China chip tool makers expand beyond import substitution at CSEAC 2026

    China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper...

    Thursday 3 September 2026
    Fei-Fei Li's World Labs unveils Atlas world model for 3D AI, robotics

    World Labs, the startup founded by Stanford professor Fei-Fei Li, has unveiled Atlas, a multimodal world model designed to generate,...

    Thursday 3 September 2026
    Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
    Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...
    Thursday 3 September 2026
    UniVista expands China EDA stack with AI agents, native 3DIC tools
    Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic...
    Wednesday 2 September 2026
    Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
    Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
    Wednesday 2 September 2026
    DRAM giants target 3D stacking to break memory wall and power bottlenecks
    At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
    Wednesday 2 September 2026
    Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026

    This year's SEMICON Taiwan will be packed with discussions about artificial intelligence and the on-wafer challenges it's creating, where the advanced node and emerging...

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    GlobalExhibition
    BIZ FOCUS
    Sep 30, 08:00
    Hackathon Team Optimizes Urban Evacuation Decision-Making
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
    Wednesday 30 September 2026
    Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future
    Tuesday 29 September 2026
    Breaking free from keyword constraints: GeoGraph elevates job matching
    Semicon_TW